Mechanical test for vapor phase solder joint

Abstract

The goal of present paper is to describe some aspects regarding the mechanical properties of the lead-free solder joint connections obtained by using the vapor phase soldering technology. In order to highlight the mechanical properties of solder joints in correlation with different pad finishes and different solder paste composition, there were performed some mechanical tests using a Share test system. Novelty is that the paper presents a mechanical experiment that wants to describe the adhesion of solder joint on cooper pad. The experiment was performed using two types of solder paste and three types of pad finish.