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Eighteenth International Conference on Thermoelectrics. Proceedings, ICT'99 (Cat. No.99TH8407)最新文献

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Determination of thermoelectric module parameters 热电模块参数的测定
Eighteenth International Conference on Thermoelectrics. Proceedings, ICT'99 (Cat. No.99TH8407) Pub Date : 1999-08-29 DOI: 10.1109/ICT.1999.843384
S. M. Gorodetskiy
{"title":"Determination of thermoelectric module parameters","authors":"S. M. Gorodetskiy","doi":"10.1109/ICT.1999.843384","DOIUrl":"https://doi.org/10.1109/ICT.1999.843384","url":null,"abstract":"Figure of merit and resistance are fundamental parameters used to define the quality of a thermoelectric module. These parameters are often measured by a computer-aided system that uses a modern modification of the Harman method. The parameter values have to be corrected to take account of a heat exchange between the module under test and the environment. Usually the account of a heat exchange is rather difficult and approximate and this study has been done to evaluate the degree of credence to the corrected parameter values. Several different groups each consisting of single-type modules have been formed. Each module from the group was tested under different heat exchange conditions and/or under various directions and magnitudes of the test current. The corrected values of parameters were calculated for the module using a computer program on the basis of parameters measured by a computer-aided system and measurement conditions. An analysis of the results is presented.","PeriodicalId":253439,"journal":{"name":"Eighteenth International Conference on Thermoelectrics. Proceedings, ICT'99 (Cat. No.99TH8407)","volume":"47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-08-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126098290","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Transport properties of Co/sub 1-x/Fe/sub x/Sb/sub 3/ Co/sub - 1-x/Fe/sub -x/ Sb/sub - 3/的输运性质
Eighteenth International Conference on Thermoelectrics. Proceedings, ICT'99 (Cat. No.99TH8407) Pub Date : 1999-08-29 DOI: 10.1109/ICT.1999.843430
J. Yang, G. Meisner, C. Uher
{"title":"Transport properties of Co/sub 1-x/Fe/sub x/Sb/sub 3/","authors":"J. Yang, G. Meisner, C. Uher","doi":"10.1109/ICT.1999.843430","DOIUrl":"https://doi.org/10.1109/ICT.1999.843430","url":null,"abstract":"The role of iron on the cobalt site of the filled skutterudites has yet to be firmly ascertained. To address this question, we prepared a series of samples of the form Co/sub 1-x/Fe/sub x/Sb/sub 3/ with x=0, 0.5, 1, 2, 5 and 10 at% by induction melting. We performed measurements of thermal conductivity, thermopower, resistivity, Hall effect, X-ray diffraction, and magnetization. The presence of iron reduces dramatically the lattice thermal conductivity. Iron doping increases the hole concentration resulting in a concomitant reduction of the room temperature Seebeck coefficient. We also observed phonon drag effects at low temperature. Magnetization studies indicate the development of a paramagnetic state. The subtle role of iron in creating lattice defects will also be discussed.","PeriodicalId":253439,"journal":{"name":"Eighteenth International Conference on Thermoelectrics. Proceedings, ICT'99 (Cat. No.99TH8407)","volume":"104 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-08-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124746379","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Thermoelectric properties of some phosphorus-based skutterudite compounds 某些磷基角钨矿化合物的热电性质
Eighteenth International Conference on Thermoelectrics. Proceedings, ICT'99 (Cat. No.99TH8407) Pub Date : 1999-08-29 DOI: 10.1109/ICT.1999.843431
A. Watcharapasorn, R. DeMattei, R. Feigelson, T. Caillat, A. Borschchevsky, J. Fleurial
{"title":"Thermoelectric properties of some phosphorus-based skutterudite compounds","authors":"A. Watcharapasorn, R. DeMattei, R. Feigelson, T. Caillat, A. Borschchevsky, J. Fleurial","doi":"10.1109/ICT.1999.843431","DOIUrl":"https://doi.org/10.1109/ICT.1999.843431","url":null,"abstract":"The synthesis and thermoelectric properties of some phosphorus-based skutterudites have been investigated. These compounds were made by both a flux technique using tin as the solvent and direct synthesis from pure elements. Thermoelectric measurements showed that CoP/sub 3/, CeFe/sub 4/P/sub 12/ and CeRu/sub 4/P/sub 12/ have semiconducting properties. The difference between the thermal conductivity of binary and ternary compounds can be primarily attributed to the additional phonon scattering by Ce atoms rattling inside the empty cages in the skutterudite unit cell. The thermal conductivity values for CeFe/sub 4/P/sub 12/ and CeRu/sub 4/P/sub 12/ are compared and discussed. Thermoelectric figures of merits for these compounds were calculated and the highest value was obtained for CeFe/sub 4/P/sub 12/ with a ZT of about 0.15 at 850 K. Two other compounds, CeCo/sub 4/Si/sub 3/P/sub 9/ and Ce/sub 0.3/Co/sub 4/Ge/sub 1.2/P/sub 10.8/ were made in order to compare their properties to those of CoP/sub 3/ and to attempt to determine the effect of both atomic rattling and anion substitution on the lattice thermal conductivity. Comparisons to some antimonide skutterudite compounds are also briefly discussed.","PeriodicalId":253439,"journal":{"name":"Eighteenth International Conference on Thermoelectrics. Proceedings, ICT'99 (Cat. No.99TH8407)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-08-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125118050","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Optimization of the thermoelectric properties of low-dimensional structures via phonon engineering 利用声子工程优化低维结构的热电性能
Eighteenth International Conference on Thermoelectrics. Proceedings, ICT'99 (Cat. No.99TH8407) Pub Date : 1999-08-29 DOI: 10.1109/ICT.1999.843365
A. Balandin, A. Khitun, J. Liu, K. Wang, T. Borca-Tasciuc, G. Chen
{"title":"Optimization of the thermoelectric properties of low-dimensional structures via phonon engineering","authors":"A. Balandin, A. Khitun, J. Liu, K. Wang, T. Borca-Tasciuc, G. Chen","doi":"10.1109/ICT.1999.843365","DOIUrl":"https://doi.org/10.1109/ICT.1999.843365","url":null,"abstract":"We report the first direct observation of confined acoustic phonon modes in a single semiconductor thin film. High-resolution Raman spectroscopy of ultra-thin silicon-on-insulator (SOI) structures reveals multiple quasi-equidistant peaks in the spectral range from 50 cm/sup -1/ to 160 cm/sup -1/. Confined nature of phonon transport in low-dimensional structures with the finite acoustic mismatch indicates an additional tuning capability for optimizing of thermoelectric properties of these structures. Our experimental results are consistent with the recent theoretical predictions of the strong decrease of the lateral lattice thermal conductivity due to phonon confinement.","PeriodicalId":253439,"journal":{"name":"Eighteenth International Conference on Thermoelectrics. Proceedings, ICT'99 (Cat. No.99TH8407)","volume":"57 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-08-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121041885","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Effects of the addition of Co on the thermoelectric properties of the AlPdMn quasicrystalline system Co的加入对AlPdMn准晶体系热电性能的影响
Eighteenth International Conference on Thermoelectrics. Proceedings, ICT'99 (Cat. No.99TH8407) Pub Date : 1999-08-29 DOI: 10.1109/ICT.1999.843462
A. Pope, P. Alboni, T. Tritt, R. Gagnon, S. Legault, J. Strom-Olsen
{"title":"Effects of the addition of Co on the thermoelectric properties of the AlPdMn quasicrystalline system","authors":"A. Pope, P. Alboni, T. Tritt, R. Gagnon, S. Legault, J. Strom-Olsen","doi":"10.1109/ICT.1999.843462","DOIUrl":"https://doi.org/10.1109/ICT.1999.843462","url":null,"abstract":"Partially due to their lack of periodic structure, quasicrystals have inherently low thermal conductivity, on the order of 1-3 W/mK. AlPdMn quasicrystals exhibit reasonable values of electrical conductivity (500-800 (/spl Omega//spl middot/cm/sup -1/)) and thermopower (80 /spl mu/V/K) with respect to thermoelectrics. In an effort to further increase the thermopower and hopefully decrease the thermal conductivity via phonon scattering, a fourth element was added to the nominally Al/sub 70/Pd/sub 10/Mn/sub 10/ quasicrystal. X-ray data confirms that the addition of the additional element does not alter the quasiperiodicity of the sample. Several Al/sub 70/Pd/sub 22.5/Mn/sub 7.5/ quasicrystal ingots were grown. Two subsequent batches of Al/sub 70/Pd/sub 22.5/5Mn/sub 7.5/ were grown, adding up to 2% Co. Thermopower, electrical conductivity, and thermal conductivity were measured on each sample over a broad temperature range and the results are discussed.","PeriodicalId":253439,"journal":{"name":"Eighteenth International Conference on Thermoelectrics. Proceedings, ICT'99 (Cat. No.99TH8407)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-08-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121268068","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Thermoelectric transport in superlattices from anisotropic materials 各向异性材料超晶格中的热电输运
Eighteenth International Conference on Thermoelectrics. Proceedings, ICT'99 (Cat. No.99TH8407) Pub Date : 1999-08-29 DOI: 10.1109/ICT.1999.843471
T. Reinecke, D. Broido
{"title":"Thermoelectric transport in superlattices from anisotropic materials","authors":"T. Reinecke, D. Broido","doi":"10.1109/ICT.1999.843471","DOIUrl":"https://doi.org/10.1109/ICT.1999.843471","url":null,"abstract":"A formalism for treating thermoelectric transport in systems with anisotropic electronic band structure has been developed, and it has been used to make detailed calculations for PbTe quantum wire superlattices. A novel dependence of their power factors on wire size is obtained and discussed.","PeriodicalId":253439,"journal":{"name":"Eighteenth International Conference on Thermoelectrics. Proceedings, ICT'99 (Cat. No.99TH8407)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-08-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122584417","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Parallel thermal conductance technique for measuring thermal conductivity of smaller thermoelectric materials 测量小型热电材料热导率的平行热导技术
Eighteenth International Conference on Thermoelectrics. Proceedings, ICT'99 (Cat. No.99TH8407) Pub Date : 1999-08-29 DOI: 10.1109/ICT.1999.843420
B. Zawilski, R. Littleton, A. Pope, T. Tritt
{"title":"Parallel thermal conductance technique for measuring thermal conductivity of smaller thermoelectric materials","authors":"B. Zawilski, R. Littleton, A. Pope, T. Tritt","doi":"10.1109/ICT.1999.843420","DOIUrl":"https://doi.org/10.1109/ICT.1999.843420","url":null,"abstract":"We have recently developed a technique to evaluate the thermal conductivity as a function of temperature for materials of relatively small dimensions (L/spl sim/2 mm, A/spl sim/0.05 mm/sup 2/). The parallel thermal conductance technique, or PTC, consists of an initial base-line thermal conductance measurement of a sample stage then a measurement of the stage and sample together. The difference between the baseline and baseline plus sample, coupled with high-precision measurements of the sample dimensions, provides a straightforward and effective method of determining the thermal conductivity of relatively small samples.","PeriodicalId":253439,"journal":{"name":"Eighteenth International Conference on Thermoelectrics. Proceedings, ICT'99 (Cat. No.99TH8407)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-08-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122757296","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Thermopower enhancement and optimal ZT in p-n junction arrays p-n结阵列的热功率增强和最佳ZT
Eighteenth International Conference on Thermoelectrics. Proceedings, ICT'99 (Cat. No.99TH8407) Pub Date : 1999-08-29 DOI: 10.1109/ICT.1999.843366
A. Zakhidov, Y. Ravich, D.A. Pchenoy-Severin
{"title":"Thermopower enhancement and optimal ZT in p-n junction arrays","authors":"A. Zakhidov, Y. Ravich, D.A. Pchenoy-Severin","doi":"10.1109/ICT.1999.843366","DOIUrl":"https://doi.org/10.1109/ICT.1999.843366","url":null,"abstract":"Thermoelectric effects in different types of p-n junction systems are considered theoretically, and the thermoelectric power S is calculated in a rigorous approximation. S for a single p-n junction is found to be rather large, due to the thermal factor E/sub g//kT (E/sub g/ being the band gap). This factor naturally appears in the expression for S for an asymmetric junction, and cancels from S for a symmetric junction. The thermopower of individual p-n junctions (S/sub n/) add for an array of in-series junctions (-p-n-p-n-p-...), and this result may be used for the enhancement of the Seebeck coefficient in opal-type 3-D superlattices. The figure of merit ZT of the p-n junction system is shown to have an upper bound of 1.","PeriodicalId":253439,"journal":{"name":"Eighteenth International Conference on Thermoelectrics. Proceedings, ICT'99 (Cat. No.99TH8407)","volume":"106 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-08-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124121442","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Mechanical alloying lead telluride based materials: synthesis and microstructure studies 机械合金化碲化铅基材料:合成与微观结构研究
Eighteenth International Conference on Thermoelectrics. Proceedings, ICT'99 (Cat. No.99TH8407) Pub Date : 1999-08-29 DOI: 10.1109/ICT.1999.843352
N. Bouad, R. Marin-Ayral, J. Tedenac
{"title":"Mechanical alloying lead telluride based materials: synthesis and microstructure studies","authors":"N. Bouad, R. Marin-Ayral, J. Tedenac","doi":"10.1109/ICT.1999.843352","DOIUrl":"https://doi.org/10.1109/ICT.1999.843352","url":null,"abstract":"Lead telluride and its alloys are well established materials for thermoelectric power generation in the medium range of temperature. They are obtained by varied solidification methods or powder metallurgy. Mechanical alloying is a new way for obtaining such thermoelectric materials. By this method, it is possible to prepare at low temperature, powders with good chemical homogeneity. In this study, we have synthesised powders of lead telluride (p-type and n-type) by mechanical alloying, and compared them with conventional synthesised powders concerning microstructural and electrical properties.","PeriodicalId":253439,"journal":{"name":"Eighteenth International Conference on Thermoelectrics. Proceedings, ICT'99 (Cat. No.99TH8407)","volume":"48 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-08-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115885129","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Application of thermoelectrics to cooling electronics: review and prospects 热电技术在冷却电子中的应用:回顾与展望
Eighteenth International Conference on Thermoelectrics. Proceedings, ICT'99 (Cat. No.99TH8407) Pub Date : 1999-08-29 DOI: 10.1109/ICT.1999.843385
R. C. Chu, R. Simons
{"title":"Application of thermoelectrics to cooling electronics: review and prospects","authors":"R. C. Chu, R. Simons","doi":"10.1109/ICT.1999.843385","DOIUrl":"https://doi.org/10.1109/ICT.1999.843385","url":null,"abstract":"This paper provides a review of the applications of thermoelectric devices to cooling electronics and prospects for the future. The need to accommodate increased module heat flux and reduce chip operating temperatures is discussed, along with the cooling technology developed within IBM to do this. A brief background discussion of thermoelectric cooling citing some of the recent literature, and a survey of heat flux capability of commercially available modules is provided. Examples are given of early applications of thermoelectric cooling technology within IBM. The paper focuses on the desire to use thermoelectric devices as a means to either augment heat removal from electronic modules or achieve lower operating temperatures. An example considering the augmentation of high performance multichip module cooling with thermoelectrics is presented. The analysis is discussed and summarized in terms of the relevant equations and calculation results. The need for further improvements in the heat pumping capability, /spl Delta/T capability and C.O.P. of thermoelectrics is emphasized. The paper concludes by outlining the improvements needed if thermoelectrics are to compete effectively with vapor-compression based refrigeration systems in electronic cooling applications where high heat loads must be supported at lower temperatures.","PeriodicalId":253439,"journal":{"name":"Eighteenth International Conference on Thermoelectrics. Proceedings, ICT'99 (Cat. No.99TH8407)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-08-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123734251","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 26
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