p-n结阵列的热功率增强和最佳ZT

A. Zakhidov, Y. Ravich, D.A. Pchenoy-Severin
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引用次数: 6

摘要

从理论上考虑了不同类型pn结系统的热电效应,并在严格的近似下计算了热电功率S。由于热因子E/sub g//kT (E/sub g/为带隙),单个p-n结的S相当大。对于非对称结点,这个因子自然出现在S的表达式中,而对于对称结点,这个因子从S中消去。单个p-n结的热功率(S/sub n/)增加了串联结阵列(-p-n-p-n-p-…),这一结果可用于增强蛋白石型三维超晶格中的塞贝克系数。p-n结系统的性能图ZT的上界为1。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Thermopower enhancement and optimal ZT in p-n junction arrays
Thermoelectric effects in different types of p-n junction systems are considered theoretically, and the thermoelectric power S is calculated in a rigorous approximation. S for a single p-n junction is found to be rather large, due to the thermal factor E/sub g//kT (E/sub g/ being the band gap). This factor naturally appears in the expression for S for an asymmetric junction, and cancels from S for a symmetric junction. The thermopower of individual p-n junctions (S/sub n/) add for an array of in-series junctions (-p-n-p-n-p-...), and this result may be used for the enhancement of the Seebeck coefficient in opal-type 3-D superlattices. The figure of merit ZT of the p-n junction system is shown to have an upper bound of 1.
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