2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems最新文献_第2页

Laser grooving of semiconductor wafers: Comparing a simplified numerical approach with experiments 半导体晶圆的激光刻槽:简化数值方法与实验的比较

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2015-04-19 DOI: 10.1109/EUROSIME.2015.7103120

M. van Soestbergen, J. Zaal, F. Swartjes, J. Janssen

引用次数: 2

Life time characterization for a highly robust metallization 高强度金属化的寿命表征

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2015-04-19 DOI: 10.1109/EUROSIME.2015.7103123

K. Weide-Zaage, J. Kludt, M. Ackermann, V. Hein, M. Erstling

引用次数: 6

Die thickness impact on thermo-mechanical stress in 3D packages 模具厚度对三维封装热机械应力的影响

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2015-04-19 DOI: 10.1109/EUROSIME.2015.7103104

A. Salahouelhadj, M. Gonzalez, H. Oprins

引用次数: 7

Numerical prediction of residual stresses evolving during packaging of ICs 集成电路封装过程中残余应力演化的数值预测

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2015-04-19 DOI: 10.1109/EUROSIME.2015.7103131

A. R. Rezaie Adliv, K. Jansen, L. Ernst

引用次数: 0

Detection of the non-uniformity of junction temperature in large light-emitting diode using an improved forward voltage method 利用改进的正向电压法检测大型发光二极管结温不均匀性

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2015-04-19 DOI: 10.1109/EUROSIME.2015.7103108

Mian Tao, S. Lee

{"title":"Detection of the non-uniformity of junction temperature in large light-emitting diode using an improved forward voltage method","authors":"Mian Tao, S. Lee","doi":"10.1109/EUROSIME.2015.7103108","DOIUrl":"https://doi.org/10.1109/EUROSIME.2015.7103108","url":null,"abstract":"Large size light-emitting diodes (LED) are frequently used in the application that requires high luminous intensity. Among diverse types of LED chips, the wire-bonding LED chip has become the most common type for its simple and mature manufacturing processes. For the commercial product manufacturing, chip bonding is one of the most critical procedures. Conventional chip bonding uses adhesive filled with thermal conductive particles. As the size of the LED chips is being enlarged, it becomes much more challenging to achieve perfect bonding. Defects may often occur in the bonding layer in practical manufacturing. Previous studies have revealed that defects inside the bonding layer will block the heat flow from the LED junction to the carrier and create non-uniform junction temperature distribution. The ordinary method to measure the junction temperature is the forward voltage method which uses the negative forward voltage-junction temperature characteristic of LEDs. Nevertheless, this standard method could not offer any information about the non-uniformity of junction temperature. As it is well understood that the junction temperature is critical to the performance of an LED device, it is necessary to find out a method to evaluate this non-uniform junction temperature phenomenon. In this study, we prepared several custom-made LED samples with artificial bonding defects to generate non-uniform junction temperature. An improved forward voltage method was developed to detect the junction temperature non-uniformity. The introduced method was experimentally validated.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"25 3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131010393","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Multiphysics study of electrochemical migration in ceramic capacitors 陶瓷电容器中电化学迁移的多物理场研究

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2015-04-19 DOI: 10.1109/EUROSIME.2015.7103154

Jaemi L. Herzberger, A. Dasgupta, Siddhartha Das

{"title":"Multiphysics study of electrochemical migration in ceramic capacitors","authors":"Jaemi L. Herzberger, A. Dasgupta, Siddhartha Das","doi":"10.1109/EUROSIME.2015.7103154","DOIUrl":"https://doi.org/10.1109/EUROSIME.2015.7103154","url":null,"abstract":"Electrochemical migration across the surface of dielectric cracks in multilayer ceramic capacitors when exposed to humidity or condensed moisture can result in the growth of dendritic filaments, thus causing increased leakage currents or even short circuit failure. This study uses measured empirical data to demonstrate that the growth rate of the dendrite accelerates nonlinearly with time, due to the increased electric field strength and ionic flux that results from the continuously decreasing distance between the anode and the tip of the cathodic dendrite, as the dendrite grows with time. A simple 1D analytic predictive model is developed that incorporates the nonlinear growth kinetics by allowing the separation between the anode and effective cathode to vary with time. The failure time predicted by this model is calibrated with the help of the experimental data, and the dendrite growth kinetics are found to have a close qualitative and quantitative match with the experiments. A comparison is also made to a calibrated fixed-separation linear TTF prediction model in the literature and the comparison shows that the nonlinear model developed in this study produces results that are physically more meaningful than the linear model.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130476895","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Thermal deformation analysis of automotive electronic control units subjected to passive and active thermal conditions 汽车电子控制单元在被动和主动热条件下的热变形分析

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2015-04-19 DOI: 10.1109/EUROSIME.2015.7103085

Bulong Wu, Dae-Suk Kim, B. Han, Alicja Palczynska, P. Gromala

引用次数: 18

Optimal design and nonlinearities in a z-axis resonant accelerometer z轴谐振加速度计的优化设计与非线性

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2015-04-19 DOI: 10.1109/EUROSIME.2015.7103145

C. Comi, A. Corigliano, V. Zega, S. Zerbini

引用次数: 5

Experimental investigation on microstructural influence towards visco-plastic mechanical properties of Sn-based solder alloy for material modelling in finite element simulations 微观组织对锡基钎料合金粘塑性力学性能影响的有限元模拟实验研究

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2015-04-19 DOI: 10.1109/EUROSIME.2015.7103159

R. Metasch, R. Schwerz, M. Roellig, A. Kabakchiev, B. Métais, R. Ratchev, K. Wolter

{"title":"Experimental investigation on microstructural influence towards visco-plastic mechanical properties of Sn-based solder alloy for material modelling in finite element simulations","authors":"R. Metasch, R. Schwerz, M. Roellig, A. Kabakchiev, B. Métais, R. Ratchev, K. Wolter","doi":"10.1109/EUROSIME.2015.7103159","DOIUrl":"https://doi.org/10.1109/EUROSIME.2015.7103159","url":null,"abstract":"The paper presents experimental results on tinbased solder alloys to their mechanical visco-plastic deformation behaviour under systematically investigation of cooling rates and their micro-structural solidification. We developed a novel process to produce solder bulk specimens in a re-melting process under specific cooling rates up to -300 K/min. The paper shows a comparison of SnAg3.5 and SnAg3.8cuO.75 solidified with -20 Klmin and -200 Klmin as well as a SnSbCu alloy solidified with -20 Klmin and -100 K/min. By contrast to a commonly used passive cooling solution the increased cooling rates are closer to an actual industrial soldering process. The metallographic investigation shows significant changes of the micro-structure with increasing grain quantity while their size decreased. The intermetallic sizes are reduced and the surface roughness of the specimens overall decreased with higher cooling rates. The mechanical comparison of the different produced specimens uses an advanced experimental procedure to determine the material properties for a unified visco-plastic constitutive model initially proposed by Chaboche et al. The constitutive model describes the time-dependent material behaviour in the strain range of primary creep under cyclic load and isothermal conditions. This progress is performed in a temperature range between -40°C up to 150 °C, with varying strain rates between lE-3 to lE-6 per second and relaxation steps. The detailed characterization procedure has been presented in [4] and [5]. In two separate chapters the paper explains the advantages of this modelling approach on lifetime prediction using finite-element simulations.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"60 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131591175","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Research on packaging effects of three-axis SOI MEMS accelerometer 三轴SOI MEMS加速度计封装效果研究

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2015-04-19 DOI: 10.1109/EUROSIME.2015.7103101

Hung-Te Yang, Yen-Fu Su, K. Chiang

引用次数: 2