Thermal deformation analysis of automotive electronic control units subjected to passive and active thermal conditions

Abstract

The effects of the outer EMC on the thermal deformation of an automotive electronic control unit (ECU) are studied using moiré interferometry and FEA modeling. Two sets of ECU specimens molded with and without outer EMC are subjected to passive and active thermal conditions, respectively. Two orthogonal in-plane displacement fields on the cross section of specimens are documented at various temperatures using moiré interferometry. The results of passive condition case are used to verify the complex FEA modeling of the units, and the initial material properties are subsequently calibrated. The validity of FEA modeling after calibration is corroborated by the results obtained from the active thermal condition.