{"title":"Temperature dependent characterization of Ga2O3 MOSFETs with Spin-on-Glass source/drain doping","authors":"Ke Zeng, U. Singisetti","doi":"10.1109/DRC.2017.7999401","DOIUrl":"https://doi.org/10.1109/DRC.2017.7999401","url":null,"abstract":"β-Gallium oxide (Ga2O3) is an increasingly attractive choice for next generation power electronics applications due to its large bandgap, good mobility giving rise to a high Baliga's figure of merit (BFoM), mature bulk and thin film growth technologies with excellent doping control over several orders [1-3]. Moreover, recent experimental MOSFETs have shown large breakdown voltages (750 V), large on current densities (0.6 A/mm), enhancement mode operation, and record high breakdown field strengths (3.8 MV/cm); all of which show the potential of the technology for high efficiency power devices. Source/drain (S/D) contact and access resistance need to be reduced in power devices to decrease the conduction losses. Si ion-implantation was used previously to reduce the source resistance. Alternatively, we have proposed a novel, simple and effective Sn-doped Spin-on-Glass (SOG) doping to achieve a high doping density at the surface, thus reducing the specific contact resistivity (ρc) [4]. A ρc of 2.1±1.4 × 10−5 Ω·cm2 was obtained for 20 nm ultra-shallow junctions which is comparable to ion-implanted S/D junctions. Large drain current density (40 mA/mm) was measured in MOSFETs with SOG S/D doping. Here, we report the temperature dependent characteristics of Ga2O3 MOSFETs with spin-on-glass S/D doping.","PeriodicalId":248087,"journal":{"name":"2017 75th Annual Device Research Conference (DRC)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-06-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116485563","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
K. Chabak, A. Green, N. Moser, S. Tetlak, J. McCandless, K. Leedy, R. Fitch, A. Crespo, G. Jessen
{"title":"Gate-recessed, laterally-scaled β-Ga2O3 MOSFETs with high-voltage enhancement-mode operation","authors":"K. Chabak, A. Green, N. Moser, S. Tetlak, J. McCandless, K. Leedy, R. Fitch, A. Crespo, G. Jessen","doi":"10.1109/DRC.2017.7999398","DOIUrl":"https://doi.org/10.1109/DRC.2017.7999398","url":null,"abstract":"Beta-phase gallium oxide (Ga2O3) is a promising wide bandgap semiconductor possessing a larger bandgap (∼4.8 eV) and critical electric field strength (∼8 MV/cm) than GaN and SiC [1]. Early metal-oxide-semiconductor field-effect transistors (MOSFETs) have shown promising depletion-mode operation with high critical field strength [2], high-current density [3] and high breakdown voltage [4]. On native substrates, enhancement-mode operation has been achieved with a gated unintentional doped channel [5] and fin-channels [6], the latter achieving 600-V normally-off breakdown voltage. However, both are limited to ∼1 mA/mm or less. Here, we report a new enhancement-mode device achieved by gate recess with improved drain-current > 20 mA/mm and near 200-V breakdown for laterally scaled 3-μm source-drain distance (Lsd).","PeriodicalId":248087,"journal":{"name":"2017 75th Annual Device Research Conference (DRC)","volume":"56 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-06-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116389610","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
G. Jessen, K. Chabak, A. Green, J. McCandless, S. Tetlak, K. Leedy, R. Fitch, S. Mou, E. Heller, S. Badescu, A. Crespo, N. Moser
{"title":"Toward realization of Ga2O3 for power electronics applications","authors":"G. Jessen, K. Chabak, A. Green, J. McCandless, S. Tetlak, K. Leedy, R. Fitch, S. Mou, E. Heller, S. Badescu, A. Crespo, N. Moser","doi":"10.1109/DRC.2017.7999397","DOIUrl":"https://doi.org/10.1109/DRC.2017.7999397","url":null,"abstract":"As a transparent conducting oxide with a large bandgap of ∼4.9 eV and associated large estimated critical electric field (Ec) strength of 8 MV/cm, β-Ga2O3 (BGO) has been touted for its tremendous potential as a power switch. Power switch metrics such as Baliga's figure of merit (BFOM) estimating dc conduction losses and Huang's material figure of merit (HMFOM) incorporating dynamic switching losses are functions of EC3 and EC respectively [1, 2]. BFOM for BGO is expected to exceed that of GaN by 400% and HMFOM for BGO is expected to be comparable to GaN. It can also be shown that for a given power loss during switching, the switch frequency (f) varies as EC2 suggesting the potential of BGO power conversion in the GHz regime [1, 2]. The manufacturability and cost value proposition of BGO based on large area native substrate availability as shown by Huang's chip area manufacturing FOM (HCAFOM) indicate a disruptive cost advantage over GaN (330%). Additionally, the Johnson figure of merit (JFOM) representing the power-frequency product for RF amplification for BGO is similar to that of GaN indicating potential for integration of power conversion and RF applications in the same platform. Finally, Huang's high temperature figure of merit (HTFOM) shows that BGO has the lowest metric for all semiconductors compared here due to low thermal conductivity and high field strength. However, all wide bandgap power semiconductors, including diamond, face significant thermal engineering challenges relative to Si because of the inherent high energy densities of materials with large Ec values. A summary of unipolar FET figure-of-merit comparisons for power semiconductors is shown in Table 1.","PeriodicalId":248087,"journal":{"name":"2017 75th Annual Device Research Conference (DRC)","volume":"63 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-06-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114624211","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Tianning Liu, M. Wallace, S. Trolier-McKinstry, T. Jackson
{"title":"Piezoelectric thin films on polyimide substrates for flexible piezoelectric devices","authors":"Tianning Liu, M. Wallace, S. Trolier-McKinstry, T. Jackson","doi":"10.1109/DRC.2017.7999459","DOIUrl":"https://doi.org/10.1109/DRC.2017.7999459","url":null,"abstract":"Flexible 2.5 cm × 2.5 cm PZT thin films on polyimide substrate were successfully obtained through a release and transfer process developed in this work. The released films not only functioned, but had superior properties compared to films grown on silicon wafers. This approach to flexible piezoelectric devices provides opportunities for sensors, transducers, and energy harvesters.","PeriodicalId":248087,"journal":{"name":"2017 75th Annual Device Research Conference (DRC)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-06-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124681036","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
C. McClellan, E. Yalon, K. Smithe, S. Suryavanshi, E. Pop
{"title":"Effective n-type doping of monolayer MoS2 by AlOx","authors":"C. McClellan, E. Yalon, K. Smithe, S. Suryavanshi, E. Pop","doi":"10.1109/DRC.2017.7999392","DOIUrl":"https://doi.org/10.1109/DRC.2017.7999392","url":null,"abstract":"Doping of two-dimensional (2D) semiconductors often utilizes charge transfer techniques that are not compatible with standard CMOS fabrication and are unstable over time. Sub-stoichiometric oxides have demonstrated stable 2D material doping [1], but often degrade the subthreshold swing (S) and current on/off ratio (I<inf>max</inf>/I<inf>min</inf>) of a device. Here, we demonstrate that AlOx can n-dope monolayer (1L) MoS2 while preserving Imax/Imin and S. The AlO<inf>x</inf> doping significantly reduces the contact resistance (to 480 Ω·μm) while preserving the mobility (∼34 cm<sup>2</sup>V<sup>−1</sup>s<sup>−1</sup>) and S, ultimately achieving record on-current of 700 μA/μm for a monolayer semiconductor. We also present a model for the effect of interface traps on the transfer characteristics, which explains the experimentally obtained results.","PeriodicalId":248087,"journal":{"name":"2017 75th Annual Device Research Conference (DRC)","volume":"95 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-06-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124622199","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Molecular doping of transition metal dichalcogenides using metal phythalocyanines","authors":"S. Zhang, Christopher J. Benjamin, Zhihong Chen","doi":"10.1109/DRC.2017.7999455","DOIUrl":"https://doi.org/10.1109/DRC.2017.7999455","url":null,"abstract":"Control of carrier type and density through doping of semiconducting transition metal dichalcogenides (TMDs) is critical for their applications in electronic and optoelectronic devices. In this work, we explore a group of phythalocyannie (Pc) molecules that can chelate with various metal elements from the periodic table, providing a wide range of doping levels. Unlike other substitutional doping distorting TMD lattices, these Pc molecules dope the TMD channels through surface charge transfer [1]. By using metal substituents with different work functions, such as Pt, Cu, Fe, and Na in phythalocyannies, we are able to tune the doping level and polarity of TMD devices. We achieved the highest doping levels for phsioabsorbed species up to date. Unlike other dopants exhibiting unstable doping effects [2], these Pc compounds offering high doping levels remain almost unchanged even weeks after initial doping. These Pc molecules can chelate up to 70 different elements from the periodic table [3] and potentially providing vastly different properties to TMD devices.","PeriodicalId":248087,"journal":{"name":"2017 75th Annual Device Research Conference (DRC)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-06-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133904656","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
K. Sasaki, D. Wakimoto, Q. Thieu, Y. Koishikawa, A. Kuramata, M. Higashiwaki, S. Yamakoshi
{"title":"Demonstration of Ga2O3 trench MOS-type Schottky barrier diodes","authors":"K. Sasaki, D. Wakimoto, Q. Thieu, Y. Koishikawa, A. Kuramata, M. Higashiwaki, S. Yamakoshi","doi":"10.1109/DRC.2017.7999399","DOIUrl":"https://doi.org/10.1109/DRC.2017.7999399","url":null,"abstract":"β-Ga2O3 is a suitable material for next-generation high-power devices because it has excellent material properties and mass productivity. In the past, we have demonstrated field-plated Ga2O3 Schottky barrier diodes (SBDs) with nearly ideal reverse characteristics limited mainly by the thermionic field emission (TFE) leakage current. [1] However, the TFE current, that is, leakage current, was very large because of the large electric field at the Schottky metal/semiconductor interface. Here, introducing a junction barrier controlled Schottky structure or trench MOS barrier structure is an effective way to decrease the electric field [2]. In this study, we succeeded in developing Ga2O3 trench MOS-type SBDs (MOSSBDs) for the first time and examined their characteristics.","PeriodicalId":248087,"journal":{"name":"2017 75th Annual Device Research Conference (DRC)","volume":"56 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-06-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128448981","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Munho Kim, Soongyu Yi, J. Kim, Shih-Chia Liu, Weidong Zhou, Zongfu Yu, Xiuling Li
{"title":"Nano-indented Ge surfaces by metal-assisted chemical etching (MacEtch) and its application for optoelectronic devices","authors":"Munho Kim, Soongyu Yi, J. Kim, Shih-Chia Liu, Weidong Zhou, Zongfu Yu, Xiuling Li","doi":"10.1109/DRC.2017.7999453","DOIUrl":"https://doi.org/10.1109/DRC.2017.7999453","url":null,"abstract":"Surface reflection is one of the major limiting factors to determine light absorption performance of optoelectronic devices. In recent years, light management using various types of nanostructures has gained much attention [1]. However, fabricating the nanostructures by conventional dry etching results in damage within the crystal structures attributed to high energy ions. Metal assisted chemical etching (MacEtch) is an alternative method to produce the nanostructures [2]. Because MacEtch is fundamentally a wet etch which does not involve high energy ions, structural defects can be avoided [3,4]. Therefore, the technique has been widely used to create surface texturing for the optoelectronic and photonic applications. However, the MacEtch enabled nanostructures have been mainly formed on Si and III-V compounds [5,6]. In this report, we present a novel MacEtch based technique to create nano-indentations on Ge and the enhanced responsivity and reduced dark current of Ge photodiodes.","PeriodicalId":248087,"journal":{"name":"2017 75th Annual Device Research Conference (DRC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-06-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129743627","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"High-frequency ZnO schottky diodes for non-contact inductive power transfer in large-area electronics","authors":"L. E. Aygun, S. Wagner, N. Verma, J. Sturm","doi":"10.1109/DRC.2017.7999462","DOIUrl":"https://doi.org/10.1109/DRC.2017.7999462","url":null,"abstract":"Besides traditional RFID [1], an emerging application of large-area electronics is hybrid systems [2], where we need to transfer power and signals from one flexible sheet to another. This is driven by manufacturing considerations: sheets providing different functionality, via different materials and devices, can simply be laminated together. Hard-wired metallurgical bonds between flexible sheets are expected to be problematic, especially for reliability, motivating the use of non-contact inductively-coupled interfaces between adjacent sheets [2-3]. For efficiency of such interfaces, high-frequency thin-film diodes (HF-TFDs) are required, since inductive losses are lower at high frequencies [3].","PeriodicalId":248087,"journal":{"name":"2017 75th Annual Device Research Conference (DRC)","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117239870","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
K. Nomoto, S. Bader, Kevin Lee, S. Bharadwaj, Zongyang Hu, H. Xing, D. Jena
{"title":"Wide-bandgap Gallium Nitride p-channel MISFETs with enhanced performance at high temperature","authors":"K. Nomoto, S. Bader, Kevin Lee, S. Bharadwaj, Zongyang Hu, H. Xing, D. Jena","doi":"10.1109/DRC.2017.7999466","DOIUrl":"https://doi.org/10.1109/DRC.2017.7999466","url":null,"abstract":"Wide-bandgap materials, particularly Gallium Nitride, have emerged as the platform underlying many of the most promising technologies in the high-power and high-frequency domain. However, GaN p-channel devices lag far behind their popular n-channel counterparts, due to lower mobilities as well as difficulties in doping and forming ohmic contacts. There is a strong need for wide-bandgap p-channel FETs — this missing piece would enable energy-efficient, high-voltage CMOS electronics, a critical technique for on-chip power conditioning and management.","PeriodicalId":248087,"journal":{"name":"2017 75th Annual Device Research Conference (DRC)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128546137","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}