2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference最新文献

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An investigation on AlInGaP die crack during LED die attach process LED贴装过程中AlInGaP模具裂纹的研究

2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference Pub Date : 2016-09-01 DOI: 10.1109/IEMT.2016.7761983

L. Annaniah, M. Devarajan

{"title":"An investigation on AlInGaP die crack during LED die attach process","authors":"L. Annaniah, M. Devarajan","doi":"10.1109/IEMT.2016.7761983","DOIUrl":"https://doi.org/10.1109/IEMT.2016.7761983","url":null,"abstract":"Die crack is a potentially serious issue affecting reliability and performance in Semiconductor industry. As a result, customers, particularly in the automotive industry, are concerned about the consequences of this failure mode and expect zero defect. In view of this an investigation was carried out with a focus to eliminate die crack occurrence in the AlInGaP die used in certain LED packages. Crack are only observed in AlInGaP die, other die such InGaN material system were found not exhibit cracks under similar conditions of design and process. Using a process mapping approach, it was observed that cracks only occur on one particular die attach (DA) equipment model. The lower elastic modulus of GaAs combined with the crystal orientation creates condition where external forces during LED assembly, in particularly in DA process, can exceed the mechanical strength of the die causing cracking. It is known that in situation where a crack does not extend into the epitaxial layer, the die will perform well. This makes it impossible to detect at electrical testing. In a controlled experiment, dice were intentionally subjected to large stresses at DA to induce partial cracks. These LEDs were biased with high current and reverse voltage in cyclic mode to induce further stress and initiate crack propagation. It was found that with further crack propagation, these crack dice we able to be segregated. Combined with correct bond force, which will not mechanically overstress the die during assembly and stress test, shown to eliminate this failure mode in mass production and prevent failure in customer application.","PeriodicalId":237235,"journal":{"name":"2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116460465","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Assessing the remnant of anti-oxidant agent on the processed copper bond pad surface by using XPS and TEM analysis 用XPS和TEM分析了铜焊垫表面抗氧化剂残留情况

2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference Pub Date : 2016-09-01 DOI: 10.1109/IEMT.2016.7761947

Lai Chin Yung, C. C. Fei

{"title":"Assessing the remnant of anti-oxidant agent on the processed copper bond pad surface by using XPS and TEM analysis","authors":"Lai Chin Yung, C. C. Fei","doi":"10.1109/IEMT.2016.7761947","DOIUrl":"https://doi.org/10.1109/IEMT.2016.7761947","url":null,"abstract":"In copper leadframe fabrication process, anti-oxidant agent is a common chemical solution used to easily protect oxidize surface like copper bond pad surface. There are varieties of anti-oxidant solution available in the market. However, only certain group of anti-oxidant chemical solution can be applied on the copper leadframe or bond pad surface. This is mainly due to the specific and unique anti-tarnish properties, such as low evaporation point and high adhesion strength on specific metal or polymer surface. The application of this anti-oxidant in copper leadframe or bond pad application leads to some challenges like difficulty to examine or ensure the homogeneity of the coating thickness. Besides, in flip chip die bonding process, insufficient removal of the anti-oxidant protecting layer from the copper bond pad surface will cause copper pillar chip bonding quality issue, due to the organic residue left on the bond pad surface, which inhibits the intermetallic formation and contributes to solder voiding issue. Therefore, to accurately examine the existence of the anti-oxidant characteristics, high end analytical tools like X-ray Photoelectron Spectroscopy (XPS) and Transmission Electron Microscopy (TEM) had been applied in this study. From the analysis, the properties of chemical bonding state on the anti-oxidant and coating thickness had been successfully determined. In term of verifying the coating thickness, a single analytical tool like XPS may not be able to provide an accurate information, due to the tool depth profiling setting. Therefore, a complimentary analytical tool like TEM is more suitable to be used to examine the nano thickness level anti-oxidant coating.","PeriodicalId":237235,"journal":{"name":"2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130545976","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Solder joint reliability enhancement through surface mounting solder joint reflow optimization in enterprise grade solid state drives (SSDs) 通过对企业级固态硬盘(ssd)表面贴装焊点回流优化，提高焊点可靠性

2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference Pub Date : 1900-01-01 DOI: 10.1109/iemt.2016.7761962

Mohammad Zainudeen Moideen, C.L. Gan

{"title":"Solder joint reliability enhancement through surface mounting solder joint reflow optimization in enterprise grade solid state drives (SSDs)","authors":"Mohammad Zainudeen Moideen, C.L. Gan","doi":"10.1109/iemt.2016.7761962","DOIUrl":"https://doi.org/10.1109/iemt.2016.7761962","url":null,"abstract":"In high reliability Surface Mount Technology (SMT) assembly applications, the ability to inspect the solder joints visually has been standard and has been key factors in providing confidence in solder joint reliability. Inspection techniques such as X-ray can be used to detect gross manufacturing defects such as solder bridging, but are not suitable for detection of other defects such as cracks. Temperature cycling test (TCT) is a standard solder joint reliability assessment method in semiconductor reliability for ball grid array (BGA) packaging. SMT reflow process and CTE (coefficient of thermal expansion) between solder materials, PCB and BGA package have high influence in solder joint reliability. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-2Ag-Cu-Ni solder paste. This evaluation specifically looked at the impact of time above liquidus, peak temperature and thermal interface material (TIM) on solder joint reliability. Four types of samples prepared with the peak temperature of 2500C and no TIM, 2500C with TIM, time above liquidus (TAL) 90 seconds and no TIM and TAL 90 seconds with TIM. A total of 60 drives were assembled and subjected to accelerated thermal cycling (ATC) test in the temperature range of 00C to 1000C for a maximum of 2000 cycles with reference to JESD22-A104 standard. Based on the results from the deisgn of experiment (DOE), TAL 90s profile have demonstrated better TCT reliability margin compared to peak temperature of 2500C.","PeriodicalId":237235,"journal":{"name":"2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference","volume":"89 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121240133","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

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