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2008 IEEE 21st International Conference on Micro Electro Mechanical Systems最新文献

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From VHF to UHF CMOS-MEMS monolithically integrated resonators 从甚高频到超高频CMOS-MEMS单片集成谐振器
2008 IEEE 21st International Conference on Micro Electro Mechanical Systems Pub Date : 2008-01-28 DOI: 10.1109/MEMSYS.2008.4443598
J. Teva, G. Abadal, A. Uranga, J. Verd, F. Torres, J.L. Lopez, J. Esteve, F. Pérez-Murano, N. Barniol
{"title":"From VHF to UHF CMOS-MEMS monolithically integrated resonators","authors":"J. Teva, G. Abadal, A. Uranga, J. Verd, F. Torres, J.L. Lopez, J. Esteve, F. Pérez-Murano, N. Barniol","doi":"10.1109/MEMSYS.2008.4443598","DOIUrl":"https://doi.org/10.1109/MEMSYS.2008.4443598","url":null,"abstract":"This paper presents the design, fabrication and characterization of microresonators exhibiting resonance frequencies in the VHF and UHF bands, fabricated using the available layers of the standard and commercial CMOS technology, AMS-0.35mum. The resonators are released in a post-CMOS process consisting on a maskless wet etching. A clamped-clamped beam with resonance frequency of 290 MHz exhibiting Q-factors of 970 in air and 2836 in vacuum is presented. The fabrication and design of a ring bulk acoustic resonator (RBAR) designed to operate at 1 GHz is described. Preliminary results on the electrical characterization show a resonance frequency of 1.04 GHz and a quality factor of 400 in air.","PeriodicalId":233133,"journal":{"name":"2008 IEEE 21st International Conference on Micro Electro Mechanical Systems","volume":"56 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-01-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127059964","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 21
AL to AL wafer bonding for MEMS encapsulation and 3-D interconnect 用于MEMS封装和三维互连的AL - AL晶圆键合
2008 IEEE 21st International Conference on Micro Electro Mechanical Systems Pub Date : 2008-01-28 DOI: 10.1109/MEMSYS.2008.4443780
C. Yun, J.R. Martin, E. Tarvin, J. Winbigler
{"title":"AL to AL wafer bonding for MEMS encapsulation and 3-D interconnect","authors":"C. Yun, J.R. Martin, E. Tarvin, J. Winbigler","doi":"10.1109/MEMSYS.2008.4443780","DOIUrl":"https://doi.org/10.1109/MEMSYS.2008.4443780","url":null,"abstract":"Al to Al bonding was successfully demonstrated for hermetic sealing of MEMS devices and three-dimensional interconnects. On a MEMS device wafer, 2 mum thick Al (with 2% Cu) was patterned at the perimeters of the individual dies as well as the input/output bond pads. On a cap wafer, after forming polycrystalline-Si filled vias, the seal rings and bond pads were also patterned with the Al described above. The two wafers were then bonded at ~ 450degC with various bond forces up to 80 kN. The leak detection on the capped device showed the superb hermeticity of ~10-12 cm3 atm/sec He leak rate with an Al seal width as narrow as 3 mum. And the electrical contact resistance of the Al to Al bonded interface measured less than 1 Omega.","PeriodicalId":233133,"journal":{"name":"2008 IEEE 21st International Conference on Micro Electro Mechanical Systems","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-01-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115783527","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 37
Small-bandwidth integrated tunable bandpass filters for GSM applications 用于GSM应用的小带宽集成可调谐带通滤波器
2008 IEEE 21st International Conference on Micro Electro Mechanical Systems Pub Date : 2008-01-28 DOI: 10.1109/MEMSYS.2008.4443835
M. Rais-Zadeh, F. Ayazi
{"title":"Small-bandwidth integrated tunable bandpass filters for GSM applications","authors":"M. Rais-Zadeh, F. Ayazi","doi":"10.1109/MEMSYS.2008.4443835","DOIUrl":"https://doi.org/10.1109/MEMSYS.2008.4443835","url":null,"abstract":"This paper presents an integrated tunable lumped- element filter at 831 MHz with a 3 dB-bandwidth of 77 MHz (9% bandwidth) and an embedded insertion loss of 4.0 dB. The filter is fabricated using a combination of thick high aspect-ratio silver plating and bulk micromachining that enables the implementation of high- quality factor inductors as well as high-performance fixed and tunable two-port capacitors. The third-order filter shows good thermal stability and is continuously tuned using voltage-tunable capacitors.","PeriodicalId":233133,"journal":{"name":"2008 IEEE 21st International Conference on Micro Electro Mechanical Systems","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-01-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114395608","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 22
Scanning micromirror using deformation of a Parylene-Encapsulated Liquid Structure 利用聚苯乙烯封装液体结构的变形扫描微镜
2008 IEEE 21st International Conference on Micro Electro Mechanical Systems Pub Date : 2008-01-28 DOI: 10.1109/MEMSYS.2008.4443770
Y. Yoshihata, N. Binh-Khiem, A. Takei, E. Iwase, K. Matsumoto, L. Shimoyama
{"title":"Scanning micromirror using deformation of a Parylene-Encapsulated Liquid Structure","authors":"Y. Yoshihata, N. Binh-Khiem, A. Takei, E. Iwase, K. Matsumoto, L. Shimoyama","doi":"10.1109/MEMSYS.2008.4443770","DOIUrl":"https://doi.org/10.1109/MEMSYS.2008.4443770","url":null,"abstract":"This paper presents a scanning micromirror using deformation of a parylene-encapsulated liquid structure (PELS). Silicone fluid is put between a silicon plate and an electrode-patterned plate. Both of the plates and liquid are encapsulated by a parylene membrane. Gold is deposited on the surface of the parylene membrane to fabricate an upper electrode. By applying voltage between the upper and lower electrodes, the encapsulated liquid is deformed and the silicon plate is tilted. The silicon plate is supported by the PELS, instead of usual torsion beams. When a set of four appropriately synchronized voltages is applied between the four lower electrodes and the upper electrode, two dimensional scanning motion is achieved.","PeriodicalId":233133,"journal":{"name":"2008 IEEE 21st International Conference on Micro Electro Mechanical Systems","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-01-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114788007","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Gold nanoparticle patterning by self-assembly and transfer for LSPR based sensing 基于LSPR传感的金纳米粒子自组装和转移模式
2008 IEEE 21st International Conference on Micro Electro Mechanical Systems Pub Date : 2008-01-28 DOI: 10.1109/MEMSYS.2008.4443839
T. Ozaki, K. Sugano, T. Tsuchiya, O. Tabata
{"title":"Gold nanoparticle patterning by self-assembly and transfer for LSPR based sensing","authors":"T. Ozaki, K. Sugano, T. Tsuchiya, O. Tabata","doi":"10.1109/MEMSYS.2008.4443839","DOIUrl":"https://doi.org/10.1109/MEMSYS.2008.4443839","url":null,"abstract":"We successfully demonstrated a pattern formation of 60 nm gold nanoparticles using high productive combined technique of particle self-assembly and the assembled particle pattern transfer, and its availability for bio/chemical sensor with localized surface plasmon resonance (LSPR) of the patterned particles was verified. Dot and line patterns of nanoparticles were fabricated on a flexible PDMS substrate by proposed method. In addition, by measuring spectrums of assembled nanoparticle arrays, it was confirmed that the LSPR optical characteristic can be controlled by patterns of the assembled nanoparticles.","PeriodicalId":233133,"journal":{"name":"2008 IEEE 21st International Conference on Micro Electro Mechanical Systems","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-01-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114895639","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
A PECVD CNT-based open architecture field ionizer for portable mass spectrometry 一种用于便携式质谱分析的PECVD cnt开放式结构场电离器
2008 IEEE 21st International Conference on Micro Electro Mechanical Systems Pub Date : 2008-01-28 DOI: 10.1109/MEMSYS.2008.4443763
L. Velásquez-García, A. Akinwande
{"title":"A PECVD CNT-based open architecture field ionizer for portable mass spectrometry","authors":"L. Velásquez-García, A. Akinwande","doi":"10.1109/MEMSYS.2008.4443763","DOIUrl":"https://doi.org/10.1109/MEMSYS.2008.4443763","url":null,"abstract":"This paper reports a novel carbon nanotube (CNT)- based field ionizer that is part of a portable micro gas analyzer. The device uses a micro-fabricated 3D foam-like silicon structure (mufoam) to increase the neutral particle flux, resulting in higher ion current. The mufoam is fabricated using deep reactive ion etching (DRIE). The ionizer uses plasma enhanced chemical vapor deposited (PECVD) CNTs as field enhancers. The PECVD CNT growth interacts with the mufoam to produce a sparse array of isolated CNT clusters on top of the mufoam. Electrical tests of the device both as an electron field emitter and field ionizer are reported and discussed.","PeriodicalId":233133,"journal":{"name":"2008 IEEE 21st International Conference on Micro Electro Mechanical Systems","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-01-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115046233","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 16
Manipulation system for nano/micro components integration via transportation and self-assembly 通过运输和自组装实现纳米/微部件集成的操作系统
2008 IEEE 21st International Conference on Micro Electro Mechanical Systems Pub Date : 2008-01-28 DOI: 10.1109/MEMSYS.2008.4443786
Y. Higuchi, T. Kusakabe, T. Tanemura, K. Sugano, T. Tsuchiya, O. Tabata
{"title":"Manipulation system for nano/micro components integration via transportation and self-assembly","authors":"Y. Higuchi, T. Kusakabe, T. Tanemura, K. Sugano, T. Tsuchiya, O. Tabata","doi":"10.1109/MEMSYS.2008.4443786","DOIUrl":"https://doi.org/10.1109/MEMSYS.2008.4443786","url":null,"abstract":"We developed, for the first time, the manipulation system based on optoelectronic tweezers (OET) which manipulates multiple nano/micro components on an arbitrary substrate with concurrent observation of the component motion. From the theoretical analysis, the manipulation force of a hundred pN order is expected to act on components. It was successfully demonstrated to manipulate a PMMA particle of 10 mum diameter on a photoconductive film.","PeriodicalId":233133,"journal":{"name":"2008 IEEE 21st International Conference on Micro Electro Mechanical Systems","volume":"68 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-01-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116924239","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 10
Digitally-tunable mems filter using mechanically-coupled resonator array 采用机械耦合谐振器阵列的数字可调谐mems滤波器
2008 IEEE 21st International Conference on Micro Electro Mechanical Systems Pub Date : 2008-01-28 DOI: 10.1109/MEMSYS.2008.4443832
Hengky Chandrahalim, S. Bhave
{"title":"Digitally-tunable mems filter using mechanically-coupled resonator array","authors":"Hengky Chandrahalim, S. Bhave","doi":"10.1109/MEMSYS.2008.4443832","DOIUrl":"https://doi.org/10.1109/MEMSYS.2008.4443832","url":null,"abstract":"This paper reports on the design of a bandwidth-tunable RF MEMS filter using a series-coupled array of dielectrically-transduced square-extensional mode resonators. The proposed digital tuning scheme provides channel-agility and bandwidth granularity for analog spectral processors and RF spectrum analyzers. The resonators and filters are fabricated on the 3 mum thick device layer of a heavily doped SOI wafer with a 100 nm thick silicon nitride film sandwiched between the polysilicon electrodes and the silicon device layer. A 511 MHz overtone square-extensional mode resonator is demonstrated with a quality factor (Q) of 1,800 in air and motional impedance (RX) of 1.1 kOmega. An array of four such resonators is coupled mechanically to form a channel-select filter with 1.4 MHz bandwidth at 509 MHz center frequency. By switching the DC-biasing scheme, the filter is split into narrower high and low sub-bands, each 700 kHz wide.","PeriodicalId":233133,"journal":{"name":"2008 IEEE 21st International Conference on Micro Electro Mechanical Systems","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-01-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123528177","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 32
A fully functional micro transportation system with strider-like movement of micro containers 一个功能齐全的微型运输系统，具有像步行者一样的微型集装箱运动
2008 IEEE 21st International Conference on Micro Electro Mechanical Systems Pub Date : 2008-01-28 DOI: 10.1109/MEMSYS.2008.4443590
D. Dao, P. H. Pham, S. Sugiyama
{"title":"A fully functional micro transportation system with strider-like movement of micro containers","authors":"D. Dao, P. H. Pham, S. Sugiyama","doi":"10.1109/MEMSYS.2008.4443590","DOIUrl":"https://doi.org/10.1109/MEMSYS.2008.4443590","url":null,"abstract":"This paper presents a novel micro transportation system (MTS), which can drive micro containers in both straight and curved paths, based on electrostatic and ratchet mechanism. The micro container, which has driving-wings and anti-reverse-wings attached to the central 'backbone', is driven by electrostatic actuator through the ratchet racks in perpendicular direction. The container with the length and width of 450 mum and 250 mum, respectively, moves like a water strider with desirable velocity up to 200 mum/sec in the straight and curved paths. In order to create the smart and flexible MTS, the elemental modules, e.g. straight, turning and separation modules with the same size (6 mm x 6 mm) have been developed. Therefore, different configurations of the MTS can be created flexibly by assembling the elemental modules.","PeriodicalId":233133,"journal":{"name":"2008 IEEE 21st International Conference on Micro Electro Mechanical Systems","volume":"47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-01-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116829358","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
CMOS based sensors: From a sample to real products 基于CMOS的传感器:从样品到实际产品
2008 IEEE 21st International Conference on Micro Electro Mechanical Systems Pub Date : 2008-01-28 DOI: 10.1109/MEMSYS.2008.4443578
F. Mayer
{"title":"CMOS based sensors: From a sample to real products","authors":"F. Mayer","doi":"10.1109/MEMSYS.2008.4443578","DOIUrl":"https://doi.org/10.1109/MEMSYS.2008.4443578","url":null,"abstract":"Sensirion [1] is a high-tech sensor company with headquarters in Switzerland. Based on technological concepts developed in the mid 90 s at ETH Zurich, Sensirion was founded in 1998. Product development started in the same year. Today, Sensirion is a high-tech sensor company, with a highly skilled team of more than 120 employees. About 50% of the manpower is concentrated in R&D. Sensirion successfully manufactures millions of MEMS sensors each year for a wide range of industrial, consumer, medical, and automotive applications. Sensirion is the industry leader for chip based humidity & temperature sensors, mass flow measurement and control devices for gases and liquids, and differential pressure sensors.","PeriodicalId":233133,"journal":{"name":"2008 IEEE 21st International Conference on Micro Electro Mechanical Systems","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-01-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117178620","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
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