2008 IEEE 21st International Conference on Micro Electro Mechanical Systems最新文献

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High temperature high accuracy piezoresistive pressure sensor based on smart-cut soi 基于智能切割土壤的高温高精度压阻式压力传感器
2008 IEEE 21st International Conference on Micro Electro Mechanical Systems Pub Date : 2008-01-28 DOI: 10.1109/MEMSYS.2008.4443800
S. Quo, H. Eriksen, K. Childress, A. Fink, M. Hoffman
{"title":"High temperature high accuracy piezoresistive pressure sensor based on smart-cut soi","authors":"S. Quo, H. Eriksen, K. Childress, A. Fink, M. Hoffman","doi":"10.1109/MEMSYS.2008.4443800","DOIUrl":"https://doi.org/10.1109/MEMSYS.2008.4443800","url":null,"abstract":"Piezeoresistive pressure sensors based on SMART CUTreg SOI wafer have been developed, which can be used in extreme high temperature environments. It is demonstrated that the minority-carrier exclusion effect in ultra thin film (~0.34 mum) Smart-cut SOI enables resistance values to increase monotonically with temperature up to 600degC which is much higher than the maximum temperature of 330degC normally shown in bulk silicon resistors. Two types of packaging have been developed for different applications; one is for low pressure, high accuracy application, the other is for high pressure, high temperature application. The former is fully characterized across the range of 0.5 psi to 25 psi and -55degC to 300degC and the latter is calibrated across the range of 16 to 600 psi and -55degC to 500degC. A digitized curve fitting technique is used to calibrate the sensors by use of on-chip temperature signals. After curve fitting, the accuracy is < 0.05% F.S. for the first type of the pressure sensor and < 0.25% F.S. for the second type of the pressure sensor. A very low pressure hysteresis (< 0.1% FS) at 500degC indicates that the single crystal silicon diaphragm is capable of operating at very high temperature without creep or plastic deformation.","PeriodicalId":233133,"journal":{"name":"2008 IEEE 21st International Conference on Micro Electro Mechanical Systems","volume":"58 8","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-01-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114127499","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 25
Detection of C-reactive protein based on measurement of Brownian motion by micro-particle-tracking-velocimetry 基于布朗运动测量的微粒子跟踪测速法检测c -反应蛋白
2008 IEEE 21st International Conference on Micro Electro Mechanical Systems Pub Date : 2008-01-28 DOI: 10.1109/MEMSYS.2008.4443625
Yu Jui Fan, C. J. Hsu, C. P. Liu, T. H. Wu, H. Sheen, S. Lin
{"title":"Detection of C-reactive protein based on measurement of Brownian motion by micro-particle-tracking-velocimetry","authors":"Yu Jui Fan, C. J. Hsu, C. P. Liu, T. H. Wu, H. Sheen, S. Lin","doi":"10.1109/MEMSYS.2008.4443625","DOIUrl":"https://doi.org/10.1109/MEMSYS.2008.4443625","url":null,"abstract":"A novel bio-sensing technique based on Brownian motion change with use of a micro-particle-tracking-velocimetry (micro-PT V) has been successfully developed to measure the antigen-antibody interactions. The rapid interaction between antigen, C-reactive protein (CRP), and the nanobeads conjugated with antibody, anti-CRP, enabled the real-time detection of CRP to be easily carried out. During the binding process of nanobeads to CRP, the mean value of the beads diameter increased so that the Brownian velocity decreased with increasing time. Moreover, higher CRP concentration led to lower Brownian velocity of the nanobead at equilibrium state. Furthermore, the sensitivity was raised when the smaller nanobeads were used.","PeriodicalId":233133,"journal":{"name":"2008 IEEE 21st International Conference on Micro Electro Mechanical Systems","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-01-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114596041","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Resonant magnetic microsensor with μT resolution μT分辨率的谐振磁微传感器
2008 IEEE 21st International Conference on Micro Electro Mechanical Systems Pub Date : 2008-01-28 DOI: 10.1109/MEMSYS.2008.4443813
S. Brugger, O. Paul
{"title":"Resonant magnetic microsensor with μT resolution","authors":"S. Brugger, O. Paul","doi":"10.1109/MEMSYS.2008.4443813","DOIUrl":"https://doi.org/10.1109/MEMSYS.2008.4443813","url":null,"abstract":"This paper reports a resonant magnetic microsensor sensitive enough to measure, e.g., the earth magnetic field for compass applications. The sensor combines an electrostatically driven micromechanical resonator and a planar magnetic concentrator with two narrow gaps. For the device fabrication, silicon on insulator technology and epoxy-resin- based attachment of amorphous soft magnetic ribbons are combined. The narrow concentrator gaps are realized using a KrF excimer laser. The device characterization revealed a high sensitivity of up to 2.56 MHz/T and a resolution of 1.1 muT. To demonstrate the capability of the new device for compass applications, the horizontal earth magnetic field component was measured as a function of the horizontal sensor orientation.","PeriodicalId":233133,"journal":{"name":"2008 IEEE 21st International Conference on Micro Electro Mechanical Systems","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-01-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114210638","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 10
Transfection of molecular beacons in microchannels under flow and no-flow conditions 微通道中分子信标在流动和无流动条件下的转染
2008 IEEE 21st International Conference on Micro Electro Mechanical Systems Pub Date : 2008-01-28 DOI: 10.1109/MEMSYS.2008.4443642
N. Li, P. Wong, J. Lin, C. Ho
{"title":"Transfection of molecular beacons in microchannels under flow and no-flow conditions","authors":"N. Li, P. Wong, J. Lin, C. Ho","doi":"10.1109/MEMSYS.2008.4443642","DOIUrl":"https://doi.org/10.1109/MEMSYS.2008.4443642","url":null,"abstract":"In this work, transfection of molecular beacons in traditional cell culture dishes and microfluidic cell culture systems with or without flows were comparatively studied by both computational and experimental methods. The comparison between static microfluidic systems and cell culture dishes reveals that the transfection of molecular beacons is controlled by both diffusion and reaction. The study on the microfluidic system with a range of fluid shear stresses and mass transfer rates implies that under high levels of shear stress the disruption of the binding between transfection reagent/molecular beacon complexes and cell membrane is dominant over the enhanced mass transfer.","PeriodicalId":233133,"journal":{"name":"2008 IEEE 21st International Conference on Micro Electro Mechanical Systems","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-01-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121030797","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Droplet manipulation on high-opening micro filter meshes 高开度微滤网的液滴操纵
2008 IEEE 21st International Conference on Micro Electro Mechanical Systems Pub Date : 2008-01-28 DOI: 10.1109/MEMSYS.2008.4443739
Y. Zhao, S. Cho
{"title":"Droplet manipulation on high-opening micro filter meshes","authors":"Y. Zhao, S. Cho","doi":"10.1109/MEMSYS.2008.4443739","DOIUrl":"https://doi.org/10.1109/MEMSYS.2008.4443739","url":null,"abstract":"This paper describes reversible EWOD (electrowetting on dielectric) contact angle changes (~ 25deg) in sessile droplets and linear transportation of droplets on micro filter meshes, not flat solid surfaces. A key achievement is that droplets are manipulated on highly opened micro filter meshes (the opening ratio defined by the ratio of area of holes to total mesh area is over ~ 50%). A possible application of these droplet operations will be particle capturing and sampling into droplets on highly-opened micro filter meshes.","PeriodicalId":233133,"journal":{"name":"2008 IEEE 21st International Conference on Micro Electro Mechanical Systems","volume":"121 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-01-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128188498","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Inherently robust micro gyroscope actuated by parametric resonance 参数共振驱动的固有鲁棒微型陀螺仪
2008 IEEE 21st International Conference on Micro Electro Mechanical Systems Pub Date : 2008-01-28 DOI: 10.1109/MEMSYS.2008.4443795
L. Oropeza-Ramos, C. Burgner, K. Turner
{"title":"Inherently robust micro gyroscope actuated by parametric resonance","authors":"L. Oropeza-Ramos, C. Burgner, K. Turner","doi":"10.1109/MEMSYS.2008.4443795","DOIUrl":"https://doi.org/10.1109/MEMSYS.2008.4443795","url":null,"abstract":"The sensitivity loss, commonly presented in micro gyroscopes based on harmonic oscillators [1], is overcome by using parametric resonance as an actuation mechanism. This operation has been analytically studied in IEEE- Sensors'05 [2] and preliminary dynamical characterization and experimental setup has been presented in IDETC/CIE- ASME'07 [3]. The device is fabricated using SOI process and in this paper we report complete rate table characterization including off-axis isolation, drift, hysteresis and noise of the micro gyroscope with an additional amplification stage.","PeriodicalId":233133,"journal":{"name":"2008 IEEE 21st International Conference on Micro Electro Mechanical Systems","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-01-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125813863","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 24
Functionalized hydrogel surface patterned in a chip for local pH sensing 功能化的水凝胶表面图案在芯片局部pH传感
2008 IEEE 21st International Conference on Micro Electro Mechanical Systems Pub Date : 2008-01-28 DOI: 10.1109/MEMSYS.2008.4443633
H. Maruyama, H. Matsumoto, T. Fukuda, F. Arai
{"title":"Functionalized hydrogel surface patterned in a chip for local pH sensing","authors":"H. Maruyama, H. Matsumoto, T. Fukuda, F. Arai","doi":"10.1109/MEMSYS.2008.4443633","DOIUrl":"https://doi.org/10.1109/MEMSYS.2008.4443633","url":null,"abstract":"We developed a novel technique to investigate local pH distribution on a chip using patterned hydrogel film made of UV photosensitive resin. The hydrogel is first patterned by photolithography in any shape on a glass, and later functionalized with the pH indicator, for example, bromocresol green (BCG). The hydrogel is polymerized by UV-ray illumination (300-400 nm) on the glass substrate, which is spin coated with the water-soluble prepolymer solution, and immobilized on the glass surface. Unexposed part can be removed easily by water. The hydrogel is hydrophilic, transparent, biocompatible, and is impregnated with the BCG. Then, the polydimethylsiloxane (PDMS) microchannel is assembled and bonded on the functionalized surface. In this way, we can make patterned pH sensitive surface in the microchannel. Local pH is measured from the color of the hydrogel impregnated with BCG based on the calibrated color information in YCrCb color space. We succeeded in measuring local pH distribution in the microchip.","PeriodicalId":233133,"journal":{"name":"2008 IEEE 21st International Conference on Micro Electro Mechanical Systems","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-01-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126072441","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Assembly of single adherent cells on mobile microplates 在移动微孔板上组装单个贴壁细胞
2008 IEEE 21st International Conference on Micro Electro Mechanical Systems Pub Date : 2008-01-28 DOI: 10.1109/MEMSYS.2008.4443652
H. Onoe, S. Takeuchi
{"title":"Assembly of single adherent cells on mobile microplates","authors":"H. Onoe, S. Takeuchi","doi":"10.1109/MEMSYS.2008.4443652","DOIUrl":"https://doi.org/10.1109/MEMSYS.2008.4443652","url":null,"abstract":"This paper describes single-cell-mounted mobile microplates. Microfabricated SiO2 microplates (20-75 mum in diameter and 2 mum in thickness) carry single adherent cells. The microplates are released freely from a plate-holding PDMS substrate. These microplates enabled us to handle adherent cells as if they were floating cells. We applied this cell-handling technique to two types of assembly: (i) microplate-guided 2D assembly of heterogeneous cells for cell-cell interaction analysis, and (ii) 3D microplate assembly powered by cell traction force for fabricating 3D microstructures. These assembly experiments indicate that the cell-mounted mobile microplates make it possible to handle single adherent cells and have potentials to assemble cell-plate microstructures.","PeriodicalId":233133,"journal":{"name":"2008 IEEE 21st International Conference on Micro Electro Mechanical Systems","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-01-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124496749","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Micro-mirror On Ribbon-actuator (MOR) for high speed spatial light modulator 用于高速空间光调制器的微镜带状致动器
2008 IEEE 21st International Conference on Micro Electro Mechanical Systems Pub Date : 2008-01-28 DOI: 10.1109/MEMSYS.2008.4443768
J. Suzuki, A. Komai, Y. Ohuchi, Y. Tezuka, H. Konishi, M. Nishiyama, Y. Suzuki, S. Owa
{"title":"Micro-mirror On Ribbon-actuator (MOR) for high speed spatial light modulator","authors":"J. Suzuki, A. Komai, Y. Ohuchi, Y. Tezuka, H. Konishi, M. Nishiyama, Y. Suzuki, S. Owa","doi":"10.1109/MEMSYS.2008.4443768","DOIUrl":"https://doi.org/10.1109/MEMSYS.2008.4443768","url":null,"abstract":"To realize a high throughput optical mask-less lithography (OML) which is utilized for the semiconductor integrated circuit (IC) mass fabrication, we have been studying the high speed spatial light modulator (SLM). In this paper, we report a Micro-mirror On Ribbon-actuator (MOR) as a novel MEMS SLM. The MOR consists of a ribbon actuator which carries a mirror placed on the offset position. The mirror tilts when the ribbon actuator is bent by electrostatic force. The high speed driving of the MOR is realized by the high resonant frequency of the ribbon actuator and the large damping factor of the submicron gap. The MOR showed the routinely switching response of less than 3 musec and the resonant frequency of around 1.7 MHz. The 8times8 passive matrix drive of the MOR was also demonstrated.","PeriodicalId":233133,"journal":{"name":"2008 IEEE 21st International Conference on Micro Electro Mechanical Systems","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-01-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121872021","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
Wafer-level sandwiched packaging for high-yield fabrication of high-performance mems inertial sensors 高性能mems惯性传感器的晶圆级夹层封装
2008 IEEE 21st International Conference on Micro Electro Mechanical Systems Pub Date : 2008-01-28 DOI: 10.1109/MEMSYS.2008.4443781
Kun Zhang, Wei Jiang, Xinxin Li
{"title":"Wafer-level sandwiched packaging for high-yield fabrication of high-performance mems inertial sensors","authors":"Kun Zhang, Wei Jiang, Xinxin Li","doi":"10.1109/MEMSYS.2008.4443781","DOIUrl":"https://doi.org/10.1109/MEMSYS.2008.4443781","url":null,"abstract":"A wafer-level sandwiched packaging technology is developed for micromechanical sensors such as inertial sensors, which comprise movable parts, e.g. spring-mass structures. Via a thin polymer intermediate layer of benzocyclobuene (BCB), a pre-micromachined silicon cap wafer is aligned bonded with the sensor-chip wafer. Prior to the BCB bonding, the sensor-chip wafer was formed by anodic bonding a Pyrex-7740 glass wafer to the silicon wafer with the sensing elements formed. This sandwich wafer level packaging can protect the formed micromechanical structures from damage or dirty during the saw dicing, and facilitates plastic molding device package. With the technique, various kinds of accelerometers have been high-yield and low-cost packaged.","PeriodicalId":233133,"journal":{"name":"2008 IEEE 21st International Conference on Micro Electro Mechanical Systems","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-01-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122134142","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
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