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2015 IEEE 19th Workshop on Signal and Power Integrity (SPI)最新文献

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Frequency- and time-domain analysis of high-frequency on-chip interconnects with nonuniform conductor edges 具有非均匀导体边缘的高频片上互连的频域和时域分析
2015 IEEE 19th Workshop on Signal and Power Integrity (SPI) Pub Date : 2015-05-10 DOI: 10.1109/SAPIW.2015.7237392
P. Manfredi, D. Vande Ginste, D. De Zutter
{"title":"Frequency- and time-domain analysis of high-frequency on-chip interconnects with nonuniform conductor edges","authors":"P. Manfredi, D. Vande Ginste, D. De Zutter","doi":"10.1109/SAPIW.2015.7237392","DOIUrl":"https://doi.org/10.1109/SAPIW.2015.7237392","url":null,"abstract":"In this paper we illustrate a modeling framework to analyze on-chip transmission lines affected by longitudinal nonuniformities in their conductor edges. The method consists of two steps. First, a macromodel for the frequency-dependent per-unit-length parameters is constructed based on an accurate field solver and it is used to conveniently obtain the pertinent place-dependent line parameters. Second, a fast and accurate perturbation technique is used to analyze the nonuniform transmission line problem. As shown by the application example, the proposed technique makes the statistical assessment for a large number of edge profiles feasible. Numerical results and discussions are provided for the case of an on-chip inverted embedded microstrip line.","PeriodicalId":231437,"journal":{"name":"2015 IEEE 19th Workshop on Signal and Power Integrity (SPI)","volume":"747 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123867850","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Efficient analysis of wave propagation for Through-Silicon-Via pairs using multipole expansion method 用多极展开法有效分析通硅通孔对的波传播
2015 IEEE 19th Workshop on Signal and Power Integrity (SPI) Pub Date : 2015-05-10 DOI: 10.1109/SAPIW.2015.7237387
X. Duan, David Dahl, C. Schuster, I. Ndip, K. Lang
{"title":"Efficient analysis of wave propagation for Through-Silicon-Via pairs using multipole expansion method","authors":"X. Duan, David Dahl, C. Schuster, I. Ndip, K. Lang","doi":"10.1109/SAPIW.2015.7237387","DOIUrl":"https://doi.org/10.1109/SAPIW.2015.7237387","url":null,"abstract":"A multipole expansion method for the efficient analysis of propagation modes along a Through-Silicon-Via pair is proposed. The method takes advantage of cylindrical wave expansion functions and matches exactly the boundary conditions at the metal-to-insulator and insulator-to-silicon interfaces. We verify the accuracy of the method by comparing to a full-wave finite element method solver.","PeriodicalId":231437,"journal":{"name":"2015 IEEE 19th Workshop on Signal and Power Integrity (SPI)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130140821","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Improvement of transmission between Vivaldi antennas for inter-chip Wireless Interconnect Network 芯片间无线互联网络中Vivaldi天线间传输的改进
2015 IEEE 19th Workshop on Signal and Power Integrity (SPI) Pub Date : 2015-05-10 DOI: 10.1109/SAPIW.2015.7237398
P. Martin, T. Le Gouguec, N. Mahdi
{"title":"Improvement of transmission between Vivaldi antennas for inter-chip Wireless Interconnect Network","authors":"P. Martin, T. Le Gouguec, N. Mahdi","doi":"10.1109/SAPIW.2015.7237398","DOIUrl":"https://doi.org/10.1109/SAPIW.2015.7237398","url":null,"abstract":"This paper presents measurement and simulation results of a wireless communication network in Printed Circuit Board (PCB) context. First, we point out the needs and the constraints in term of communication for a Wireless Interconnect Network-on-Board (WiNoB) and we explain why we have chosen “Vivaldi” antennas for this application. Then, we present the transmission coefficients between the chosen printed antennas for the achievement of a 10 GHz demonstrator in a four antennas communication network. Simulation results show levels of transmission between -20 dB and -10 dB over a large bandwidth. To improve these levels, we propose a modification of the propagation channel by inserting a metal grid or a checkerboard between the antennas. The measurements confirm a significant increase in transmission levels, particularly in the case of “face to face” communication.","PeriodicalId":231437,"journal":{"name":"2015 IEEE 19th Workshop on Signal and Power Integrity (SPI)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133958140","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Bended differential transmission line using compensation inductance and capacitance 采用电感和电容补偿的弯曲差动传输线
2015 IEEE 19th Workshop on Signal and Power Integrity (SPI) Pub Date : 2015-05-10 DOI: 10.1109/SAPIW.2015.7237391
Bao-Ren Huang, Chia-Han Chang, R. Fang, Chun-Long Wang
{"title":"Bended differential transmission line using compensation inductance and capacitance","authors":"Bao-Ren Huang, Chia-Han Chang, R. Fang, Chun-Long Wang","doi":"10.1109/SAPIW.2015.7237391","DOIUrl":"https://doi.org/10.1109/SAPIW.2015.7237391","url":null,"abstract":"In this paper, a bended differential transmission line using the compensation inductance and capacitance is proposed. The bended differential transmission line using the compensation inductance and capacitance can greatly reduce the TDT common-mode noise from 0.056 V to 0.019 V as compared with the bended differential transmission line using the right-angle bend. In order to verify the simulation results, measurement is done in the time domain where the measurement results are in good agreement with the simulation results.","PeriodicalId":231437,"journal":{"name":"2015 IEEE 19th Workshop on Signal and Power Integrity (SPI)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134157383","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Multi-conductor transmission line analysis using the generalized multi-mode S-parameter transformation 基于广义多模s参数变换的多导体传输线分析
2015 IEEE 19th Workshop on Signal and Power Integrity (SPI) Pub Date : 2015-05-10 DOI: 10.1109/SAPIW.2015.7237393
P. Meyer
{"title":"Multi-conductor transmission line analysis using the generalized multi-mode S-parameter transformation","authors":"P. Meyer","doi":"10.1109/SAPIW.2015.7237393","DOIUrl":"https://doi.org/10.1109/SAPIW.2015.7237393","url":null,"abstract":"The use of the generalized multi-mode scattering parameter transformation for the analysis of multi-conductor transmission lines is presented. The approach makes it possible to calculate the performance of a multi-conductor transmission line for arbitrary sets of coupled excitations using only one single-ended full electromagnetic analysis. A four-line coaxial line excited by sets of differential and common-mode voltages are shown as example.","PeriodicalId":231437,"journal":{"name":"2015 IEEE 19th Workshop on Signal and Power Integrity (SPI)","volume":"56 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128338044","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
Sensitivity analysis of via impedance using polynomial chaos expansion 用多项式混沌展开法分析通孔阻抗的灵敏度
2015 IEEE 19th Workshop on Signal and Power Integrity (SPI) Pub Date : 2015-05-10 DOI: 10.1109/SAPIW.2015.7237386
J. Preibisch, P. Triverio, C. Schuster
{"title":"Sensitivity analysis of via impedance using polynomial chaos expansion","authors":"J. Preibisch, P. Triverio, C. Schuster","doi":"10.1109/SAPIW.2015.7237386","DOIUrl":"https://doi.org/10.1109/SAPIW.2015.7237386","url":null,"abstract":"This work addresses the sensitivity of the characteristic via impedance used in high-speed digital systems with respect to variations of geometrical parameters. For modeling of the electromagnetic characteristics of a signal via surrounded by ground vias the physics-based via (PBV) model is used, which provides an equivalent circuit representation for a via interconnect. This circuit is augmented element-wise using polynomial chaos expansion (PCE) to include variability in form of stochastic parameters. This representation is used to derive a stochastic characteristic via impedance. The proposed method is validated with Monte-Carlo (MC) simulations and is proven to be more efficient. Finally, the sensitivity of a via on a printed circuit board (PCB) and a via on a glass interposer with respect to variations of geometrical parameters are analyzed.","PeriodicalId":231437,"journal":{"name":"2015 IEEE 19th Workshop on Signal and Power Integrity (SPI)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125659584","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
PCB via field with embedded pitch transformation for ATE pogo pin blocks PCB通过现场嵌入螺距变换为ATE弹簧脚块
2015 IEEE 19th Workshop on Signal and Power Integrity (SPI) Pub Date : 2015-05-10 DOI: 10.1109/SAPIW.2015.7237395
J. Moreira, H. Barnes, V. Poisson
{"title":"PCB via field with embedded pitch transformation for ATE pogo pin blocks","authors":"J. Moreira, H. Barnes, V. Poisson","doi":"10.1109/SAPIW.2015.7237395","DOIUrl":"https://doi.org/10.1109/SAPIW.2015.7237395","url":null,"abstract":"This paper presents a comparison of two different printed circuit board (PCB) via field designs for high density ATE pogo pin interconnects running at Gb/s data rates. The first design is a simple straight through, one-for-one, pogo pin to via design while the second is a higher performance via design that does a transformation of the pogo pin pitch. The higher performance design takes the non-uniform signal/ground pin map of the high density pogo block and translates it to a uniform signal-ground-signal topology to increase the useable bandwidth.","PeriodicalId":231437,"journal":{"name":"2015 IEEE 19th Workshop on Signal and Power Integrity (SPI)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129607021","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
A node clustering reduction scheme for power grids electrothermal analysis 一种用于电网电热分析的节点聚类缩减方案
2015 IEEE 19th Workshop on Signal and Power Integrity (SPI) Pub Date : 2015-05-10 DOI: 10.1109/SAPIW.2015.7237399
A. Magnani, M. de Magistris, A. Maffucci, A. Todri-Sanial
{"title":"A node clustering reduction scheme for power grids electrothermal analysis","authors":"A. Magnani, M. de Magistris, A. Maffucci, A. Todri-Sanial","doi":"10.1109/SAPIW.2015.7237399","DOIUrl":"https://doi.org/10.1109/SAPIW.2015.7237399","url":null,"abstract":"This paper presents a new technique to lower the computational cost of the electrothermal (ET) analysis of a large on-chip power distribution network. It is based on a node reduction strategy following a preliminary efficient steady-state solution of the ET problem. After a proper classification of nodes according to temperature and voltage drop ranges, a reduced network is then produced by means of clustering and topological network transformations, and is available for any static/dynamic analysis. Due to the achievable reduction ratios, it possible to lower by order of magnitudes the computational cost at very good accuracies. A case-study is provided where a power grid of 4 millions of nodes is reduced by a factor of 180 (electrical network) and 500 (thermal network).","PeriodicalId":231437,"journal":{"name":"2015 IEEE 19th Workshop on Signal and Power Integrity (SPI)","volume":"129 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134323412","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Common mode effects in high speed serial links 高速串行链路中的共模效应
2015 IEEE 19th Workshop on Signal and Power Integrity (SPI) Pub Date : 2015-05-10 DOI: 10.1109/SAPIW.2015.7237394
Ingvar Karlsson
{"title":"Common mode effects in high speed serial links","authors":"Ingvar Karlsson","doi":"10.1109/SAPIW.2015.7237394","DOIUrl":"https://doi.org/10.1109/SAPIW.2015.7237394","url":null,"abstract":"In production of printed circuit boards (PCB) signal skew will be introduced in differential traces due to the weave effect. A skew that will vary from PCB to PCB. This signal skew generates mode conversion that together with poor common mode properties along the high speed channel will degrade the system performance. For example might the skew effect give a crosstalk much higher than the pure differential crosstalk. If the poor common mode properties in the channel are high and the skew can be expected to be high enough, the channel performance will be affected. Some PCB's, with right combination of skew, might fail with too high bit error rate (BER) and other PCB's will work.","PeriodicalId":231437,"journal":{"name":"2015 IEEE 19th Workshop on Signal and Power Integrity (SPI)","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121698589","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Broadband analysis of non-uniform transmission lines with a Foster type circuit model 用福斯特电路模型对非均匀传输线进行宽带分析
2015 IEEE 19th Workshop on Signal and Power Integrity (SPI) Pub Date : 2015-05-10 DOI: 10.1109/SAPIW.2015.7237404
A. Mantzke, Sebastian Sudekum, M. Leone
{"title":"Broadband analysis of non-uniform transmission lines with a Foster type circuit model","authors":"A. Mantzke, Sebastian Sudekum, M. Leone","doi":"10.1109/SAPIW.2015.7237404","DOIUrl":"https://doi.org/10.1109/SAPIW.2015.7237404","url":null,"abstract":"A passive and inherently stable Foster equivalent-circuit multiport representation for non-uniform, lossy transmission lines is presented. The method is based on an eigenfunction expansion, where the eigenfunctions are determined numerically with the finite difference method (FD). An efficient model-order reduction is achieved by appropriate inductances that are extracted by a quasistatic FD analysis. The order number of the truncated modal circuit is simply estimated, according to the required signal bandwidth. The accuracy and versatility of the suggested SPICE-compatible equivalent-circuit is demonstrated by an example in the time-domain, including non-linear loads.","PeriodicalId":231437,"journal":{"name":"2015 IEEE 19th Workshop on Signal and Power Integrity (SPI)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125060329","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
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