用多极展开法有效分析通硅通孔对的波传播

2015 IEEE 19th Workshop on Signal and Power Integrity (SPI) Pub Date : 2015-05-10 DOI:10.1109/SAPIW.2015.7237387

X. Duan, David Dahl, C. Schuster, I. Ndip, K. Lang

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引用次数: 2

摘要

提出了一种多极展开法，用于高效分析沿通硅-通孔对的传播模式。该方法利用圆柱波展开函数，精确匹配了金属-绝缘体和绝缘体-硅界面的边界条件。通过与全波有限元法求解器的比较，验证了该方法的准确性。

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Efficient analysis of wave propagation for Through-Silicon-Via pairs using multipole expansion method

A multipole expansion method for the efficient analysis of propagation modes along a Through-Silicon-Via pair is proposed. The method takes advantage of cylindrical wave expansion functions and matches exactly the boundary conditions at the metal-to-insulator and insulator-to-silicon interfaces. We verify the accuracy of the method by comparing to a full-wave finite element method solver.

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2015 IEEE 19th Workshop on Signal and Power Integrity (SPI)

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