具有非均匀导体边缘的高频片上互连的频域和时域分析

P. Manfredi, D. Vande Ginste, D. De Zutter
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引用次数: 0

摘要

在本文中,我们展示了一个建模框架来分析芯片上传输线导体边缘纵向不均匀性的影响。该方法包括两个步骤。首先,基于精确的场解算器构建了频率相关单位长度参数的宏模型,并利用该模型方便地获得了相关的位置相关线路参数;其次,采用快速准确的微扰技术对非均匀输电线路问题进行了分析。应用实例表明,该方法对大量边缘轮廓的统计评估是可行的。给出了片上反向嵌入式微带线的数值结果和讨论。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Frequency- and time-domain analysis of high-frequency on-chip interconnects with nonuniform conductor edges
In this paper we illustrate a modeling framework to analyze on-chip transmission lines affected by longitudinal nonuniformities in their conductor edges. The method consists of two steps. First, a macromodel for the frequency-dependent per-unit-length parameters is constructed based on an accurate field solver and it is used to conveniently obtain the pertinent place-dependent line parameters. Second, a fast and accurate perturbation technique is used to analyze the nonuniform transmission line problem. As shown by the application example, the proposed technique makes the statistical assessment for a large number of edge profiles feasible. Numerical results and discussions are provided for the case of an on-chip inverted embedded microstrip line.
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