{"title":"具有非均匀导体边缘的高频片上互连的频域和时域分析","authors":"P. Manfredi, D. Vande Ginste, D. De Zutter","doi":"10.1109/SAPIW.2015.7237392","DOIUrl":null,"url":null,"abstract":"In this paper we illustrate a modeling framework to analyze on-chip transmission lines affected by longitudinal nonuniformities in their conductor edges. The method consists of two steps. First, a macromodel for the frequency-dependent per-unit-length parameters is constructed based on an accurate field solver and it is used to conveniently obtain the pertinent place-dependent line parameters. Second, a fast and accurate perturbation technique is used to analyze the nonuniform transmission line problem. As shown by the application example, the proposed technique makes the statistical assessment for a large number of edge profiles feasible. Numerical results and discussions are provided for the case of an on-chip inverted embedded microstrip line.","PeriodicalId":231437,"journal":{"name":"2015 IEEE 19th Workshop on Signal and Power Integrity (SPI)","volume":"747 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Frequency- and time-domain analysis of high-frequency on-chip interconnects with nonuniform conductor edges\",\"authors\":\"P. Manfredi, D. Vande Ginste, D. De Zutter\",\"doi\":\"10.1109/SAPIW.2015.7237392\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper we illustrate a modeling framework to analyze on-chip transmission lines affected by longitudinal nonuniformities in their conductor edges. The method consists of two steps. First, a macromodel for the frequency-dependent per-unit-length parameters is constructed based on an accurate field solver and it is used to conveniently obtain the pertinent place-dependent line parameters. Second, a fast and accurate perturbation technique is used to analyze the nonuniform transmission line problem. As shown by the application example, the proposed technique makes the statistical assessment for a large number of edge profiles feasible. Numerical results and discussions are provided for the case of an on-chip inverted embedded microstrip line.\",\"PeriodicalId\":231437,\"journal\":{\"name\":\"2015 IEEE 19th Workshop on Signal and Power Integrity (SPI)\",\"volume\":\"747 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-05-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 IEEE 19th Workshop on Signal and Power Integrity (SPI)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SAPIW.2015.7237392\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE 19th Workshop on Signal and Power Integrity (SPI)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SAPIW.2015.7237392","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Frequency- and time-domain analysis of high-frequency on-chip interconnects with nonuniform conductor edges
In this paper we illustrate a modeling framework to analyze on-chip transmission lines affected by longitudinal nonuniformities in their conductor edges. The method consists of two steps. First, a macromodel for the frequency-dependent per-unit-length parameters is constructed based on an accurate field solver and it is used to conveniently obtain the pertinent place-dependent line parameters. Second, a fast and accurate perturbation technique is used to analyze the nonuniform transmission line problem. As shown by the application example, the proposed technique makes the statistical assessment for a large number of edge profiles feasible. Numerical results and discussions are provided for the case of an on-chip inverted embedded microstrip line.