{"title":"芯片高密度互连电子电镀成形与性能调控技术研究","authors":"Yunwen Wu, T. Hang, Huiqin Ling, A. Hu, Ming Li","doi":"10.1360/ssc-2023-0133","DOIUrl":"https://doi.org/10.1360/ssc-2023-0133","url":null,"abstract":"","PeriodicalId":21640,"journal":{"name":"SCIENTIA SINICA Chimica","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"48762670","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Preface: special issue in memory of the 90<sup>th</sup> birthday of Prof. Long Jiang","authors":"Liu M H, Li Jb, Hang Bx","doi":"10.1360/ssc-2023-0132","DOIUrl":"https://doi.org/10.1360/ssc-2023-0132","url":null,"abstract":"","PeriodicalId":21640,"journal":{"name":"SCIENTIA SINICA Chimica","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"42957734","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}