芯片高密度互连电子电镀成形与性能调控技术研究

Q4 Chemistry

中国科学(化学) Pub Date : 2023-07-01 DOI:10.1360/ssc-2023-0133

Yunwen Wu, T. Hang, Huiqin Ling, A. Hu, Ming Li

引用次数: 0

Research on Electronic Electroplating Forming and Performance Control Technology for High Density Interconnection of Chips

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

中国科学(化学) Materials Science-Materials Chemistry

CiteScore

1.20

自引率

0.00%

发文量

6112

期刊介绍： SCIENTIA SINICA Chimica is a monthly, peer-reviewed academic journal supervised by the Chinese Academy of Sciences (CAS), and co-sponsored by the Chinese Academy of Sciences and the National Natural Science Foundation of China (NSFC). Its primary mission is to encourage communication of fundamental and/or innovative, high-quality research results in the field of chemistry . The subject areas featured in this journal include: inorganic chemistry, organic chemistry, physical chemistry, polymer chemistry, chemical biology and biological chemistry, analytical chemistry, environmental chemistry, as well as chemical engineering. Manuscripts published in SCIENTIA SINICA Chimica (SSC) include Feature Articles, Reviews, Articles, Communications, and Highlights.