{"title":"芯片高密度互连电子电镀成形与性能调控技术研究","authors":"Yunwen Wu, T. Hang, Huiqin Ling, A. Hu, Ming Li","doi":"10.1360/ssc-2023-0133","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":21640,"journal":{"name":"中国科学(化学)","volume":" ","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2023-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"中国科学(化学)","FirstCategoryId":"1089","ListUrlMain":"https://doi.org/10.1360/ssc-2023-0133","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"Chemistry","Score":null,"Total":0}
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
