{"title":"Productizing a garnet phase shifter and driver","authors":"S. Gaglione, G. Hanley, J. Hecker","doi":"10.1109/EIC.1977.7461905","DOIUrl":"https://doi.org/10.1109/EIC.1977.7461905","url":null,"abstract":"A C-band, latching, non-reciprocal garnet phase shifter and driver is described. Tooling, production cost and test procedures are discussed as well as test data on prototypes and 5000 production units.","PeriodicalId":214025,"journal":{"name":"1977 EIC 13th Electrical/Electronics Insulation Conference","volume":"138 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1977-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125709712","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Inorganic insulations for high voltage dry type transformers","authors":"M. W. Eisele","doi":"10.1109/EIC.1977.7461963","DOIUrl":"https://doi.org/10.1109/EIC.1977.7461963","url":null,"abstract":"High voltage dry type transformers contain geometrically complex combinations of various insulating materials. For thermal resistance, non-flammability and resistance to corona, inorganic insulations may be desirable where cost effective. Mica, chrysotile asbestos and an inorganic fiber, anthophyllite, are compared in terms of molecular structure and their applicability as high voltage insulations. An insulating paper containing anthophyllite fiber, designated HVP, is evaluated in terms of electrical properties, corona start voltage and voltage endurance.","PeriodicalId":214025,"journal":{"name":"1977 EIC 13th Electrical/Electronics Insulation Conference","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1977-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130715577","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Electron processing of dielectric materials","authors":"A. S. Denholm, S. Nablo","doi":"10.1109/EIC.1977.7461959","DOIUrl":"https://doi.org/10.1109/EIC.1977.7461959","url":null,"abstract":"Penetrating electrons provide an attractive alternative to chemical and thermal treatment in a variety of industrial applications. The chemical basis of electron processing is discussed with particular reference to dielectrics, and with a view to broader applications of the technology in the electrical industry.","PeriodicalId":214025,"journal":{"name":"1977 EIC 13th Electrical/Electronics Insulation Conference","volume":"187 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1977-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132908700","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Pyrolytic boron nitride as a microstrip substrate material","authors":"C. Krowne, T. Washburn","doi":"10.1109/EIC.1977.7461909","DOIUrl":"https://doi.org/10.1109/EIC.1977.7461909","url":null,"abstract":"The use of pyrolytic boron nitride (PBN) as a substrate material for microstrip integrated electrical structures operating at microwave frequencies is investigated in this paper. It has been found that PBN has potential as an alternative substrate material. The electrical aspects of PBN will first be detailed, followed by a discussion of PBN's material properties affecting the construction and performance of single and coupled transmission line structures on PBN.","PeriodicalId":214025,"journal":{"name":"1977 EIC 13th Electrical/Electronics Insulation Conference","volume":"241 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1977-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133714609","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Polyarylsulfones as electrical insulation","authors":"R. Eichhorn, C. E. McChesney","doi":"10.1109/EIC.1977.7461960","DOIUrl":"https://doi.org/10.1109/EIC.1977.7461960","url":null,"abstract":"The polyarylsulfones are a unique class among thermoplastic dielectric materials in that their electrical and mechanical properties are very stable over the temperature range −100°C to over 150°C and even after extended periods at the maximum temperature. Continuous use at 150°C is UL rated for polysulfone and 180°C is reasonable for polyphenyl-sulfone. Data is presented to show the effects of time and temperature upon the dielectric strength, dielectric loss, and mechanical properties of these polyarylsulf ones. The frequency and temperature dispersions of dielectric properties are presented. The high oxidation state of the normal polymer is suggested as an explanation of very great resistance to failure by electrical treeing and for the good flammability ratings.","PeriodicalId":214025,"journal":{"name":"1977 EIC 13th Electrical/Electronics Insulation Conference","volume":"230 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1977-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124537175","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Dissipation factor as a systems test","authors":"K. C. Heckeler","doi":"10.1109/EIC.1977.7461984","DOIUrl":"https://doi.org/10.1109/EIC.1977.7461984","url":null,"abstract":"The relationship between dissipation factor and degree of cure of magnet wire insulation has been extensively investigated and well documented.1,2 The users of insulating varnishes have also been concerned with the A-C loss characteristics of these materials and have included maximum dissipation factor values in their specifications.3","PeriodicalId":214025,"journal":{"name":"1977 EIC 13th Electrical/Electronics Insulation Conference","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1977-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128698328","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Selection of insulating materials used in SF6 circuit breakers","authors":"K. H. Yoon","doi":"10.1109/EIC.1977.7461977","DOIUrl":"https://doi.org/10.1109/EIC.1977.7461977","url":null,"abstract":"This presents a method and the results of evaluations of insulating materials for SF6 circuit interruption to be built under a \"Single Pressure SF6 Interrupter Research\" project sponsored by the Electric Power Research Institute (EPRI). In view of the high interrupting and continuous current ratings involved, selected insulating materials were tested in 135°C and 500 psig arced SF6 gas environments. The finally selected materials showed no measurable leakage current during a 300 hour exposure test and they all withstood a surface voltage stress in excess of 85 kV/inch. These tests, therefore, demonstrated that SF6 is a viable insulating medium for even higher temperature and pressure, permitting higher performance and lower costs in future switchgear applications.","PeriodicalId":214025,"journal":{"name":"1977 EIC 13th Electrical/Electronics Insulation Conference","volume":"47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1977-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116299894","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A microstrip slotted line for microwave two-port device characterization","authors":"J. Quine, J. Mcmullen, N. T. Lavoo","doi":"10.1109/EIC.1977.7461908","DOIUrl":"https://doi.org/10.1109/EIC.1977.7461908","url":null,"abstract":"The electrical and mechanical design of a micro-strip slotted line will be described. By means of this line, large-signal input and output impedances, gain and conversion efficiency of two-port bipolar transistor, FET and CATT devices can be measured as a function of frequency and power level. Measurements with the new microstrip slotted line can be performed much more quickly and accurately than with the conventional method.","PeriodicalId":214025,"journal":{"name":"1977 EIC 13th Electrical/Electronics Insulation Conference","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1977-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127793441","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Class H solventless encapsulants — Unsaturated polyester development and evaluation","authors":"W. L. Martin","doi":"10.1109/EIC.1977.7461970","DOIUrl":"https://doi.org/10.1109/EIC.1977.7461970","url":null,"abstract":"This paper examines the technical data accumulation in the development of an Unsaturated Polyester for Class H applications in ballast transformers and stators. The data has been developed over a period of four years and the varnish capability per ASTM D 2307 has been carried out to where actual testing substantiates the validity of extrapolation of the Arrhenius equation.1 Additional methods for establishing the Thermal Index such as weight loss and Helical Coil Bond Strength will be considered. Although this is nothing new it does offer insight to the definite thermal improvements being incorporated in unsaturated polyesters and that laboratory screening can aid the resin chemist.","PeriodicalId":214025,"journal":{"name":"1977 EIC 13th Electrical/Electronics Insulation Conference","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1977-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126041352","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Polyimide — An emerging printed wiring laminate material","authors":"L. Hayes, Rose E. MayfieId","doi":"10.1109/EIC.1977.7461902","DOIUrl":"https://doi.org/10.1109/EIC.1977.7461902","url":null,"abstract":"Presented herein are details of an Air Force sponsored manufacturing technology study to establish improved fabrication processes for polyimide printed wiring boards. Comparisons are made between polyimide and conventional epoxy material systems, and data are presented relative to material availability, material and process characterization, and performance tests. On the basis of comparative tests, it is concluded that polyimide is a superior material for printed wiring applications and that fabricated polyimide boards/assemblies exhibit potentially lower life cycle costs and improved performance characteristics particularly when subjected to adverse environments.","PeriodicalId":214025,"journal":{"name":"1977 EIC 13th Electrical/Electronics Insulation Conference","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1977-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116542206","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}