1977 EIC 13th Electrical/Electronics Insulation Conference最新文献_第3页

Solving the design problems of a ZIF connector to accept leaded LSI packages 解决了接引式LSI封装的ZIF连接器的设计问题

1977 EIC 13th Electrical/Electronics Insulation Conference Pub Date : 1977-09-01 DOI: 10.1109/EIC.1977.7461928

Gabe Cherian

引用次数: 0

Reliability assessment of hybrid encapsulants: Fluorinated network polymeric materials and silicones 杂化密封剂的可靠性评估:氟化网状聚合材料和有机硅

1977 EIC 13th Electrical/Electronics Insulation Conference Pub Date : 1977-09-01 DOI: 10.1109/EIC.1977.7461915

A. Christou

{"title":"Reliability assessment of hybrid encapsulants: Fluorinated network polymeric materials and silicones","authors":"A. Christou","doi":"10.1109/EIC.1977.7461915","DOIUrl":"https://doi.org/10.1109/EIC.1977.7461915","url":null,"abstract":"Hybrid encapsulation materials for Navy systems consist of silicones and silicone-dispersions. Utilizing test structures, a micro-thin film AU-AI2O3 moisture sensor and Auger/SIMS analysis, the mositure penetration kinetics for silicon was determined and compared with fluorinated network polymeric materials. Reliability data relating MTF of interdigitated hybrids to moisture levels on the substrate surface has been determined for the new class of polymeric coatings under consideration. The polymeric materials have been synthesized from fluorinated percursors to produce network molecules of epoxies and polyurethanes. It was determined that the kinetics activation energy remained constant for silicones and silicone-dispersions at relative humidity levels from 20% to 95%. The actual activation enegy varied from 1.3 eV at 20% to 0.97 eV at 95%. Significant improvement in moisture penetration resistance was observed with fluorinated network polymeric coatings. Additional test structures were utilized to study the migrative resistance shorts induced by bias, moisture and ionic contamination migration through the silicones and polymers. Finally, hybrid circuits consisting of operational amplifiers, were coated with the present synthesized polymeric materials and silicone-dispersions. Results from temperature-cycling and moisture tests will be presented and compared to results obtained from silicone coated hybrids.","PeriodicalId":214025,"journal":{"name":"1977 EIC 13th Electrical/Electronics Insulation Conference","volume":"20 11","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1977-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120819687","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Characteristics and application of Triazine resins 三嗪树脂的特性及应用

1977 EIC 13th Electrical/Electronics Insulation Conference Pub Date : 1977-09-01 DOI: 10.1109/EIC.1977.7461903

Morio Gaku, Kazuhiro Suzuki, N. Ikeguchi

引用次数: 1

A new class F armature insulation system for turbine-generators 一种新型汽轮发电机F级电枢绝缘系统

1977 EIC 13th Electrical/Electronics Insulation Conference Pub Date : 1977-09-01 DOI: 10.1109/EIC.1977.7461950

H. Galpern, G. H. Vogt

引用次数: 9

Concepts of magnet wire film material costs 磁铁线膜材料成本的概念

1977 EIC 13th Electrical/Electronics Insulation Conference Pub Date : 1977-09-01 DOI: 10.1109/EIC.1977.7461968

Richard E. Zauner

引用次数: 0

New type of turn insulation for medium-sized, high-voltage electrical machines 用于中型、高压电机的新型匝绝缘

1977 EIC 13th Electrical/Electronics Insulation Conference Pub Date : 1977-09-01 DOI: 10.1109/EIC.1977.7461946

L. Virsberg, A. Björklund

引用次数: 3

Fiberglass rod for electrical/mechanical applications 用于电气/机械应用的玻璃纤维棒

1977 EIC 13th Electrical/Electronics Insulation Conference Pub Date : 1977-09-01 DOI: 10.1109/EIC.1977.7461953

John C Haarsma

引用次数: 0

Internal conformal coatings for microcircuits 微电路内部保形涂层

1977 EIC 13th Electrical/Electronics Insulation Conference Pub Date : 1977-09-01 DOI: 10.1109/TCHMT.1978.1135297

J. Whittington, A. Mastro, G. Malloy, R. D. Hutchens

{"title":"Internal conformal coatings for microcircuits","authors":"J. Whittington, A. Mastro, G. Malloy, R. D. Hutchens","doi":"10.1109/TCHMT.1978.1135297","DOIUrl":"https://doi.org/10.1109/TCHMT.1978.1135297","url":null,"abstract":"Inadvertent inclusion of conductive particulate contaminants in sealed hybrid microcircuit packages often results in electrical failure of the device. Particles that escape detection by post-sealing radiographic (X-ray) or particle impact noise analysis can be effectively immobilized by conformally coating the circuit with a thin, resilient film of silicone, epoxy or polyxylyene (parylene). The advantages and disadvantages of using each of these materials as a microcircuit coating are discussed, and a recommendation for the use of silicones is made, based on the objectives involved. Two silicone materials have been deposited on test structures. The methods for application of the materials are presented, including those aspects of the application process which are critical to the performance of the materials as coatings. An investigation of the two silicone materials has been conducted with respect to: chemical and mechanical compatibility with hybrid circuit components and materials, chemical purity, outgassing characteristics thermal expansion effects on wire bonds and hybrid circuit rework and repair. This report presents the results of the initial portion of the coating evaluation phase and includes a comparison of the silicone coating properties with those of the polyxylylenes (parylene).","PeriodicalId":214025,"journal":{"name":"1977 EIC 13th Electrical/Electronics Insulation Conference","volume":"55 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1977-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121860245","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Techniques of temperature limiting burnoff process for form wound stators 绕线定子限温烧断工艺技术

1977 EIC 13th Electrical/Electronics Insulation Conference Pub Date : 1977-09-01 DOI: 10.1109/EIC.1977.7461931

Melvin W. Stark

引用次数: 0

Electrically insulative adhesives for hybrid microelectronic fabrication 混合微电子制造用绝缘胶粘剂

1977 EIC 13th Electrical/Electronics Insulation Conference Pub Date : 1977-09-01 DOI: 10.1109/TCHMT.1978.1135270

G. W. Brassell, D. R. Fancher

{"title":"Electrically insulative adhesives for hybrid microelectronic fabrication","authors":"G. W. Brassell, D. R. Fancher","doi":"10.1109/TCHMT.1978.1135270","DOIUrl":"https://doi.org/10.1109/TCHMT.1978.1135270","url":null,"abstract":"The use of insulative adhesives for attachment of alumina substrates to metallic headers is gaining considerable interest in the areas of hybrid microcircuit fabrication. However, many unresolved problems concerning long-term reliability of hybrid circuits using organic materials continues to plague the industry. Thus, the purposes of the investigation described herein are: (1) to select and describe tests pertaining to long-term reliability and (2) to evaluate several insulative adhesives specifically formulated for the microelectronic industry, for the purpose of selecting a substrate attach adhesive for use in a high-rate hybrid production facility. Specific properties investigated include: lap shear and tensile strength, effects of temperature aging and cycling, effects of solvent exposure, degradation temperature, adhesive-adherent compatibility, and outgassing amounts and effects. The insulative adhesives selected for evaluation include: Scotchcast 281, a one-component premixed frozen paste; Ablefilm 550, a \"B\" staged epoxy-impregnated fiberglass film and Epo-Tek H74 and H77 both two-component systems requiring mixing prior to use. Selection of these adhesives for evaluation was partially based on the results of a literature survey, which revealed these adhesives to be representative of those currently in use for hybrid assemblies.","PeriodicalId":214025,"journal":{"name":"1977 EIC 13th Electrical/Electronics Insulation Conference","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1977-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126141993","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0