Polyimide — An emerging printed wiring laminate material

Abstract

Presented herein are details of an Air Force sponsored manufacturing technology study to establish improved fabrication processes for polyimide printed wiring boards. Comparisons are made between polyimide and conventional epoxy material systems, and data are presented relative to material availability, material and process characterization, and performance tests. On the basis of comparative tests, it is concluded that polyimide is a superior material for printed wiring applications and that fabricated polyimide boards/assemblies exhibit potentially lower life cycle costs and improved performance characteristics particularly when subjected to adverse environments.