2012 10th IEEE International Conference on Semiconductor Electronics (ICSE)最新文献

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Scaling down of the 32 nm to 22 nm gate length NMOS transistor 将32纳米栅极长度的NMOS晶体管缩小到22纳米
2012 10th IEEE International Conference on Semiconductor Electronics (ICSE) Pub Date : 2012-09-01 DOI: 10.1109/SMELEC.2012.6417117
A. Maheran, P. Menon, Ibrahim Ahmad, H. A. Elgomati, B. Majlis, F. Salehuddin
{"title":"Scaling down of the 32 nm to 22 nm gate length NMOS transistor","authors":"A. Maheran, P. Menon, Ibrahim Ahmad, H. A. Elgomati, B. Majlis, F. Salehuddin","doi":"10.1109/SMELEC.2012.6417117","DOIUrl":"https://doi.org/10.1109/SMELEC.2012.6417117","url":null,"abstract":"In this paper, we provide the downscaling design and simulation of NMOS transistor with 22 nm gate length, based on the 32 nm design simulation from our previous research. A combination Titanium dioxide (TiO2) was used as the high-k material and tungsten silicide (WSix) was used as the metal gate instead of SiO2 dielectric from the 32 nm gate length device. The NMOS transistor was simulated using fabrication tool ATHENA and electrical characterization was simulated using ATLAS. The scale down ratio was used and the dimension of device was scaled down with minimal issues. Our simulation shows that the optimal value of threshold voltage (Vth) and leakage currents (Ion and Ioff) was achieved according to specification in ITRS 2011. This provides a benchmark towards the fabrication of 22 nm NMOS in future work.","PeriodicalId":210558,"journal":{"name":"2012 10th IEEE International Conference on Semiconductor Electronics (ICSE)","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129695700","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 13
The role of Reactive Ion Etching(RIE) on wirebond formation: A study on successful rate of thermosonic gold wire on aluminium bondpad 反应离子蚀刻(RIE)在线键形成中的作用:铝键垫上热超声金线成功率的研究
2012 10th IEEE International Conference on Semiconductor Electronics (ICSE) Pub Date : 2012-09-01 DOI: 10.1109/SMELEC.2012.6417148
Z. Sauli, V. Retnasamy, N. Rahman, M. Aziz, H. A. Razak, M. Palianysamy
{"title":"The role of Reactive Ion Etching(RIE) on wirebond formation: A study on successful rate of thermosonic gold wire on aluminium bondpad","authors":"Z. Sauli, V. Retnasamy, N. Rahman, M. Aziz, H. A. Razak, M. Palianysamy","doi":"10.1109/SMELEC.2012.6417148","DOIUrl":"https://doi.org/10.1109/SMELEC.2012.6417148","url":null,"abstract":"Wire bond has been an important tool in the world of microelectronic interconnections. The effect of Reactive Ion Etching (RIE) on the successful rate of thermosonic bonding using gold wire on aluminium pad is studied. Surface morphology images from Atomic Force Microscopy (AFM) are used as correlation comparison. In this work wire bonding adhesion is studied on two different surface conditions, which are treated with RIE and the other without RIE treatment. In this experiment only the bonding time was varied for each set of experiments. Results of the wire bond from both samples, with and without RIE were compared. The RIE treated surfaces yield better adhesion results in this work.","PeriodicalId":210558,"journal":{"name":"2012 10th IEEE International Conference on Semiconductor Electronics (ICSE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129318043","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Charge collection efficiency measurement system based on Field Programmable Gate Array multipurpose card 基于现场可编程门阵列多用途卡的收费效率测量系统
2012 10th IEEE International Conference on Semiconductor Electronics (ICSE) Pub Date : 2012-09-01 DOI: 10.1109/SMELEC.2012.6417215
N. Saad, I. Mansor, M. A. Hamid, A. Jalar, R. Shamsudin
{"title":"Charge collection efficiency measurement system based on Field Programmable Gate Array multipurpose card","authors":"N. Saad, I. Mansor, M. A. Hamid, A. Jalar, R. Shamsudin","doi":"10.1109/SMELEC.2012.6417215","DOIUrl":"https://doi.org/10.1109/SMELEC.2012.6417215","url":null,"abstract":"A charge collection efficiency (CCE) measurement system has been developed for CCE measurement of semiconductor nuclear detector using a nuclear counting system interface to a PC for data acquisition. A Field Programmable Gate Array (FPGA) based multipurpose card used for system development due to analog digital converter (ADC) and multichannel analyzer (MCA) functions needed for data acquisition available on board. This multipurpose card also portable and can easily interfaced to a computer. A data acquisition of CCE measurement system namely CCE Measurement V.1.0 also developed using LabVIEW 8.6. The CCE measurement system developed is a user friendly measurement system as it contains detector information, experimental, analysis and documentation. So, measurement results can automatically prepared during system execution. A CCE measurement of CdZnTe semiconductor detector AMPTEK XR-100T-CZT exposed to Cs-137 with 10.45 μCi activity with an increasing operating voltage proved that this developed measurement system is functional and ready to use.","PeriodicalId":210558,"journal":{"name":"2012 10th IEEE International Conference on Semiconductor Electronics (ICSE)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126736038","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
The design of DC motor driver for solar tracking applications 太阳能跟踪用直流电机驱动器的设计
2012 10th IEEE International Conference on Semiconductor Electronics (ICSE) Pub Date : 2012-09-01 DOI: 10.1109/SMELEC.2012.6417207
Lam Zi-Yi, Wong Sew-Kin, Pang Wai-Leong, Ooi Chee-Pun
{"title":"The design of DC motor driver for solar tracking applications","authors":"Lam Zi-Yi, Wong Sew-Kin, Pang Wai-Leong, Ooi Chee-Pun","doi":"10.1109/SMELEC.2012.6417207","DOIUrl":"https://doi.org/10.1109/SMELEC.2012.6417207","url":null,"abstract":"Solar trackers rely on a direct-current (DC) motor driver circuit to control the movement of the solar panel. However, conventional DC motor drivers used in solar tracking system do not provide any options for speed and torque control. Hence, the fixed speed of the DC motor leads to either too fast or too slow tracking movement. Usually, the output torque is set to the maximum. If the load (solar panels' weight) is small, the maximum torque is not fully utilized and therefore energy is wasted. So, a fully adjustable DC motor driver for solar tracking system shows great potential in commercialization because highly energy efficient DC motor driver circuit can improves the total efficiency of the solar tracker. Fewer solar panels are needed when they are attached to high efficiency solar tracking system, which will be reflected to lower system cost. Therefore, this enhanced motor driver will bring significant impact to the solar energy industry. The proposed DC motor driver is fully adjustable in term of speed and torque. The speed and torque of the motor is directly proportional to the output voltage and output current of the proposed DC motor driver, respectively. Adaptive controlling of the output voltage and current are possible by installing algorithm in the microcontroller of the DC motor driver and it can be reprogrammed according to the requirement. The speed control makes the solar tracking system to track the Sun more accurately and the torque control saves energy.","PeriodicalId":210558,"journal":{"name":"2012 10th IEEE International Conference on Semiconductor Electronics (ICSE)","volume":"146 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121300621","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 17
Infrared emissivity of Co, Ni Co-doped ZnO powders by solid-state reaction Co, Ni共掺杂ZnO粉体固相反应的红外发射率
2012 10th IEEE International Conference on Semiconductor Electronics (ICSE) Pub Date : 2012-09-01 DOI: 10.1109/SMELEC.2012.6417087
Yin-hua Yao, Quan-xi Cao
{"title":"Infrared emissivity of Co, Ni Co-doped ZnO powders by solid-state reaction","authors":"Yin-hua Yao, Quan-xi Cao","doi":"10.1109/SMELEC.2012.6417087","DOIUrl":"https://doi.org/10.1109/SMELEC.2012.6417087","url":null,"abstract":"This paper studies the infrared emissivity of Zn<sub>0.99-x</sub>Ni<sub>0.01</sub>Co<sub>x</sub>O (x=0.00, 0.01, 0.03, 0.05) powders prepared by solid-state reaction. The phase and morphology of samples were characterized by XRD and SEM. The UV absorption spectra and infrared emissivity at the wavelength of 8-14μm were measured by UV Spectrophotometer and IR-2 Dual-Band Emissivity Measuring Instrument. The peak of the impurity phase, NiO, is detected at temperatures below 1150°C. The optical band-gap decreases with increasing Co concentration and calcination temperature, which are much smaller than results in other studies. The infrared emissivity of Zn<sub>0.99-x</sub>Ni<sub>0.01</sub>Co<sub>x</sub>O falls with the increase of Co content. It descends to the minimum (0.772) at 1100°C and then ascends when the temperature is raised.","PeriodicalId":210558,"journal":{"name":"2012 10th IEEE International Conference on Semiconductor Electronics (ICSE)","volume":"2000 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125727618","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Magnetic force on a magnetic bead 磁珠上的磁力
2012 10th IEEE International Conference on Semiconductor Electronics (ICSE) Pub Date : 2012-09-01 DOI: 10.1109/SMELEC.2012.6417141
A. Bahadorimehr, J. Alvankarian, B. Majlis
{"title":"Magnetic force on a magnetic bead","authors":"A. Bahadorimehr, J. Alvankarian, B. Majlis","doi":"10.1109/SMELEC.2012.6417141","DOIUrl":"https://doi.org/10.1109/SMELEC.2012.6417141","url":null,"abstract":"Micron-size magnetic particles are utilized in different bio-applications. Many in-vivo and in-vitro analysis use these particles because of their interesting abilities to attach to biomolecules. The magnetically actuation of magnetic beads is important to confine the area of the specified cell analysis. Electromagnets and permanent magnets are used for different applications to capture these particles. Therefore exerting optimum force on magnetic particles is crucial in micron size analysis. In this paper we present the magnetic force calculation on a single magnetic bead using magnetic related equations from both permanent and electromagnet sources. It is shown that the magnetic force exerted on larger particles is more than smaller ones.","PeriodicalId":210558,"journal":{"name":"2012 10th IEEE International Conference on Semiconductor Electronics (ICSE)","volume":"138 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116050871","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Capacitor-grounded electronically tunable voltage-mode OTA-C multifunction filter with three inputs and five outputs 电容接地电子可调谐电压模式OTA-C多功能滤波器,具有三个输入和五个输出
2012 10th IEEE International Conference on Semiconductor Electronics (ICSE) Pub Date : 2012-09-01 DOI: 10.1109/SMELEC.2012.6417200
M. Kumngern, K. Dejhan
{"title":"Capacitor-grounded electronically tunable voltage-mode OTA-C multifunction filter with three inputs and five outputs","authors":"M. Kumngern, K. Dejhan","doi":"10.1109/SMELEC.2012.6417200","DOIUrl":"https://doi.org/10.1109/SMELEC.2012.6417200","url":null,"abstract":"This paper presents an electronically tunable versatile multifunction voltage-mode biquadratic filter with three inputs and five outputs employing five operational transconductance amplifiers, two grounded capacitors and one grounded resistor. The use of grounded capacitors makes the circuit highly suitable for integrated circuit implementation. The proposed filter can simultaneously realize low-pass, band-pass, high-pass, band-stop and all-pass voltage responses by appropriately connecting the input and output terminals. The natural frequency and the quality factor can be orthogonally controlled. No inverting-type input signals are required for realizing all the filter responses, and all the incremental sensitivities are low. PSPICE simulation results are given to confirm the presented theory.","PeriodicalId":210558,"journal":{"name":"2012 10th IEEE International Conference on Semiconductor Electronics (ICSE)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116661883","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Development of microstructure on polysilicon substrate by reactive ion etching (RIE) for future reproductivity of nanogap 反应离子刻蚀(RIE)技术在多晶硅衬底上的微结构研究及其对纳米间隙再生性能的影响
2012 10th IEEE International Conference on Semiconductor Electronics (ICSE) Pub Date : 2012-09-01 DOI: 10.1109/SMELEC.2012.6417258
Q. Humayun, U. Hashim
{"title":"Development of microstructure on polysilicon substrate by reactive ion etching (RIE) for future reproductivity of nanogap","authors":"Q. Humayun, U. Hashim","doi":"10.1109/SMELEC.2012.6417258","DOIUrl":"https://doi.org/10.1109/SMELEC.2012.6417258","url":null,"abstract":"This article is a study about dry etching as applied to etch substrate directionality, which is the important feature of RIE. The biosensors based on polysilicon material should be sensitive and selective for the detection of bio molecule. The objective of this research is to design, and fabricate polysilicon microstructure. The proposed microstructure was designed initially by using AutoCAD software and then transferred to commercial chrome mask. Standard CMOS photolithography process coupled with RIE dry etching is used for fabrication of proposed microstructure. The fabrication process start by microstructure formation on resist and than by reactive ion etching (RIE) the proposed polysilicon microstructure was created onto samples wafer. Future work will focuse to reduce the microstructure width and finally break the microstructure to create nanogap by size reduction technique using thermal oxidation. For biomolecules sensing applications, the size of the gap must be small enough to allow the biomolecule inserted into the gap space to connect both leads to keep the molecules in a relaxed and undistorted state.","PeriodicalId":210558,"journal":{"name":"2012 10th IEEE International Conference on Semiconductor Electronics (ICSE)","volume":"95 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121713344","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Fabrication of AlGaN/GaN HEMTs with slant field plates by using deep-UV lithography 用深紫外光刻技术制备斜场板AlGaN/GaN hemt
2012 10th IEEE International Conference on Semiconductor Electronics (ICSE) Pub Date : 2012-09-01 DOI: 10.1109/SMELEC.2012.6417250
T. Hsieh, Lu-Che Huang, Yueh-Chin Lin, Chia‐Hua Chang, Huan-Chung Wang, E. Chang
{"title":"Fabrication of AlGaN/GaN HEMTs with slant field plates by using deep-UV lithography","authors":"T. Hsieh, Lu-Che Huang, Yueh-Chin Lin, Chia‐Hua Chang, Huan-Chung Wang, E. Chang","doi":"10.1109/SMELEC.2012.6417250","DOIUrl":"https://doi.org/10.1109/SMELEC.2012.6417250","url":null,"abstract":"In this work, AlGaN/GaN HEMTs with slant field plate have been successfully fabricated using deep-UV lithography. By using an angle exposure technique, submicron T-shaped gates with slant sidewalls were achieved. The method is simple of cost effective. The 0.6 × 100μm2 slant-field-plated AlGaN/GaN HEMT on silicon substrate exhibited a peak value of transconductance higher than 200 mS/mm and a breakdown voltage higher than 100 V. Through high-frequency measurements, the device revealed a current gain cut-off frequency (fT) of 24 GHz, a maximum oscillation frequency (fmax) of 49 GHz.","PeriodicalId":210558,"journal":{"name":"2012 10th IEEE International Conference on Semiconductor Electronics (ICSE)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121725512","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
The effect of exposure time and development time on photoresist thin film in Micro/Nano structure formation 曝光时间和显影时间对光刻胶薄膜微纳结构形成的影响
2012 10th IEEE International Conference on Semiconductor Electronics (ICSE) Pub Date : 2012-09-01 DOI: 10.1109/SMELEC.2012.6417102
T. Adam, U. Hashim
{"title":"The effect of exposure time and development time on photoresist thin film in Micro/Nano structure formation","authors":"T. Adam, U. Hashim","doi":"10.1109/SMELEC.2012.6417102","DOIUrl":"https://doi.org/10.1109/SMELEC.2012.6417102","url":null,"abstract":"Precise transfer of pattern means guarantee in high repeatability and reliability, high throughput and low cost of ownership. By improving this resolution and alignment precision the minimum size can be further reduced to 1nm and beyond. The other important aspect of achieving minimum precised size is the photo resist must be very sensitive to the exposure light to achieve reasonable throughput. However, if the sensitivity is too high, other photoresist characteristics can be affected, including the resolution. Thus, the paper present a preliminary study on fundamentals of resist exposure and development mechanisms for fabrication of Micro- Nanowire formation, We demonstrated significance of considering process parameters such as quality of resist, soft bake, exposure time and intensity, and development time.","PeriodicalId":210558,"journal":{"name":"2012 10th IEEE International Conference on Semiconductor Electronics (ICSE)","volume":"67 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121265133","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
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