2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO)最新文献_第6页

Anti-computer forensics Anti-computer取证

2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO) Pub Date : 2017-05-22 DOI: 10.23919/MIPRO.2017.7973612

K. Hausknecht, S. Gruicic

引用次数: 7

Is there any impact of human influence factors on quality of experience? 人为因素对体验质量有影响吗?

2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO) Pub Date : 2017-05-22 DOI: 10.23919/MIPRO.2017.7973464

J. Barakovic, Sabina Baraković, S. Muminovic

{"title":"Is there any impact of human influence factors on quality of experience?","authors":"J. Barakovic, Sabina Baraković, S. Muminovic","doi":"10.23919/MIPRO.2017.7973464","DOIUrl":"https://doi.org/10.23919/MIPRO.2017.7973464","url":null,"abstract":"The increasing popularity of real-time communication services has driven a rising interest in understanding the factors influencing the quality of experience (QoE). Many research activities aiming to accomplish this goal have addressed different influence factors (IFs), which may be classified into three categories, i.e., human IFs, context IFs, and system IFs. Although the importance of human IFs (HIFs) has been already emphasized, these factors have been considered to a limited extent, and due to lack of empirical evidence, they still remain not well understood. Therefore, this research has been motivated by the challenge to provide a deeper understanding of HIF's impact on QoE in the context of the real-time communication services. In order to accomplish this and verify the conclusions derived from related work, we have conducted two experimental studies which consider voice over internet protocol (VoIP) and unified communication (UC) services. Experimental results show no existence of impacts of selected HIFs on the user's overall QoE while using either VoIP or UC services. However, this highlights the need for further research on this topic due its importance for satisfying end user needs and expectations in the context of real-time communication services.","PeriodicalId":203046,"journal":{"name":"2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO)","volume":"74 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124946585","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Cloud-Dew computing support for automatic data analysis in life sciences 云露计算支持生命科学中的自动数据分析

2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO) Pub Date : 2017-05-22 DOI: 10.23919/MIPRO.2017.7973450

P. Brezany, Thomas Ludescher, T. Feilhauer

引用次数: 11

A circular economy for Photovoltaic waste - the vision of the European project CABRISS 光伏废弃物的循环经济——欧洲CABRISS项目的愿景

2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO) Pub Date : 2017-05-22 DOI: 10.23919/MIPRO.2017.7973407

W. Brenner, N. Adamovic

{"title":"A circular economy for Photovoltaic waste - the vision of the European project CABRISS","authors":"W. Brenner, N. Adamovic","doi":"10.23919/MIPRO.2017.7973407","DOIUrl":"https://doi.org/10.23919/MIPRO.2017.7973407","url":null,"abstract":"Growing Photovoltaic (PV) panel waste causes a new environmental challenge, but on the other hand opportunities to create value and new economic paths. The main vision of the European project CABRISS “Implementation of a circular economy based on recycling, reused and recovered indium, silicon and silver materials for photovoltaic and other applications” is to develop a circular economy mainly for the photovoltaic, but also for electronic and glass industry. CABRISS bundles the efforts of 16 European companies and research institutions. The project consists in the development of: (i) recycling technologies to recover In, Ag and Si for the sustainable PV technology and other applications; (ii) a solar cell processing roadmap, which will use Si waste for the high throughput, cost-effective manufacturing of hybrid Si based solar cells and will demonstrate the possibility for the reusability and recyclability at the end of life of key PV materials. From the begin the CABRISS consortium decided to have all results in accordance with valid European standards to ease access to market.","PeriodicalId":203046,"journal":{"name":"2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129370784","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 12

Ultra-Wideband pulse generator for time-encoding wireless transmission 用于时间编码无线传输的超宽带脉冲发生器

2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO) Pub Date : 2017-05-22 DOI: 10.23919/MIPRO.2017.7973400

Leon Šneler, M. Herceg, T. Matić

引用次数: 2

Structural integrity optimization of 3D TSV package by analyzing crack behavior at TSV and BEOL 基于TSV和BEOL裂纹行为分析的三维TSV封装结构完整性优化

2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO) Pub Date : 2017-05-01 DOI: 10.23919/MIPRO.2017.7966577

Unique Rahangdale, A. Doiphode, Pavan Rajmane, Abel Misrak, D. Agonafer

{"title":"Structural integrity optimization of 3D TSV package by analyzing crack behavior at TSV and BEOL","authors":"Unique Rahangdale, A. Doiphode, Pavan Rajmane, Abel Misrak, D. Agonafer","doi":"10.23919/MIPRO.2017.7966577","DOIUrl":"https://doi.org/10.23919/MIPRO.2017.7966577","url":null,"abstract":"New electronic devices with small size and low power consumption are in demand in recent years. Miniaturization and complex product are required in modern electronics for more functionality in the smaller electronic package. To overcome such issues, 3D packages or package on package (PoP) are introduced. The 3D packaging is stacking of chip on top of another which is emerging as a powerful technology that satisfies such integrated circuit (IC) package demands. A 3D package using through silicon vias (TSVs) has emerged as an effective technology for future interconnection requirements. The mismatch of coefficient of thermal expansion (CTE) of the SiO2 and copper used in TSV can induce a lot of thermal stresses. The stress developed at interfaces results in the interfacial delamination of TSV, which is mainly driven by a shear stress concentration at the point. The developed thermal stresses are critical for the thermo-mechanical reliability of the 3D package. In this paper, the effect of package structure on the failure metric of the 3D package has been studied. J-integral has been used to quantify the crack driving force. The crack is modeled at the TSV and BEOL (Back End of the Line) and the die-substrate thickness is varied and studied during chip attachment process and under thermal cycling load for optimizing the die and substrate thickness design [1]. Finite Element method have been used to analyze the thermo-mechanical stresses and fracture parameters in TSV structures 3D package. For this study, full field compact modeling methodology [2] has been leveraged for the ease of FEA using ANSYS Workbench 17.2. An optimized package assembly was obtained to reduce the crack driving energy at the TSV region and in the BEOL dielectric layer. A design approach has been proposed to mitigate brittle failure issues thus improving the thermo-mechanical reliability of the 3D package.","PeriodicalId":203046,"journal":{"name":"2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114983052","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Maximizing quality class time using computers for a flipped classroom approach 利用电脑进行翻转课堂教学，最大限度地提高教学质量

2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO) Pub Date : 2017-05-01 DOI: 10.23919/MIPRO.2017.7973504

C. Fulford, S. Paek

引用次数: 1

Digital forensic analysis through Firewall for detection of information crimes in hospital networks 通过防火墙进行数字取证分析，检测医院网络中的信息犯罪

2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO) Pub Date : 2017-05-01 DOI: 10.23919/MIPRO.2017.7973478

Ayhan Akbal, Erhan Akbal

引用次数: 1

Drawing process recording tool for Eye-hand Coordination modelling 手眼协调建模的绘图过程记录工具

2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO) Pub Date : 2017-05-01 DOI: 10.23919/MIPRO.2017.7973493

Vaidas Giedrimas, L. Vaitkevičius, Asta Vaitkevičienė

引用次数: 0

Decision trees in formative procedural knowledge assessment 形成性程序性知识评估中的决策树

2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO) Pub Date : 2017-05-01 DOI: 10.23919/MIPRO.2017.7973383

J. Petrović, P. Pale

引用次数: 0