Gustavo Rafael Collere Possetti, Galileu Godoy Terada, Rafael Jose Daciuk, Cesar Yutaka Ofuchi, Flavio Neves Junior, Lucia Valeria Ramos de Arruda, M. Muller, Jose Luis Fabris
{"title":"Heterogeneous measurement system based on optical fiber and ultrasonic sensors to determine ethanol concentration","authors":"Gustavo Rafael Collere Possetti, Galileu Godoy Terada, Rafael Jose Daciuk, Cesar Yutaka Ofuchi, Flavio Neves Junior, Lucia Valeria Ramos de Arruda, M. Muller, Jose Luis Fabris","doi":"10.1109/ICSENS.2011.6127310","DOIUrl":"https://doi.org/10.1109/ICSENS.2011.6127310","url":null,"abstract":"This work shows an heterogeneous measurement system to determine the ethanol concentration in ethanol-water blends. The system is composed by two sensors: an optical fiber refractometric sensor based on long-period grating and a sound velocity sensor based on a pair of ultrasonic transducers operating in transmission-reception mode. An artificial neural network was used to correlate the sensor responses and determine the ethanol concentration. The results demonstrate that the heterogeneous measurement system can predict, without ambiguity for a range between 0 and 100 % v/v, the ethanol concentration with maximum absolute error of 0.55 % v/v and 0.14 % v/v mean squared error, in validation step.","PeriodicalId":201386,"journal":{"name":"2011 IEEE SENSORS Proceedings","volume":"90 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123712550","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Optimized acoustic wave detector based on long period grating","authors":"J. Gaudron, F. Surre, T. Sun, K. Grattan","doi":"10.1109/ICSENS.2011.6127071","DOIUrl":"https://doi.org/10.1109/ICSENS.2011.6127071","url":null,"abstract":"In this paper, a long period grating (LPG)-based optical fibre sensor system designed for narrow band acoustic wave detection is presented and a means to optimize it is investigated. Due to the fibre being fixed at both extremities, a string resonance appears allowing a narrow band sensitive detection of sound. Varying the curvature of the LPG creates a change in the shape of frequency response of the sensor. By selecting carefully the curvature of the fibre, a ten-fold increase in the detected signal intensity is demonstrated thereby making the sensor a suitable candidate for sound detection in harsh environments taking advantage of the properties of the optical fibres involved.","PeriodicalId":201386,"journal":{"name":"2011 IEEE SENSORS Proceedings","volume":"78 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121865352","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Paper-based capacitive mass sensor","authors":"N. Allen, P. Pinto, A. Traoré, M. Agah","doi":"10.1109/ICSENS.2011.6127369","DOIUrl":"https://doi.org/10.1109/ICSENS.2011.6127369","url":null,"abstract":"Paper-based MEMS is a new area in the field of micro-electro mechanical systems. We have developed a paper-based MEMS sensing device that is capable of measuring masses as small as 2mg (~20μN) with a sensitivity of 0.5fF/mg. Using this device, we monitored changes in capacitance values, which can be related to mass changes. This capacitive-based mass sensor, which uses a cantilever beam design, promotes and advances the use of paper in the design of micro systems. The work presented in this paper on building a capacitive sensor is advantageous because the overall costs are considerably reduced and the methods used can serve as a building block to conduct initial tests and analyses for future MEMS sensors.","PeriodicalId":201386,"journal":{"name":"2011 IEEE SENSORS Proceedings","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125834036","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Soft artificial skin with multi-modal sensing capability using embedded liquid conductors","authors":"Yong‐Lae Park, Bor-rong Chen, R. Wood","doi":"10.1109/ICSENS.2011.6127228","DOIUrl":"https://doi.org/10.1109/ICSENS.2011.6127228","url":null,"abstract":"We describe the design, fabrication and calibration of a highly compliant mechanism to be used as an artificial skin sensor. The artificial skin sensor consists of multilayered mircochannels filled with a conductive liquid capable of detecting multi-axis strains and contact pressure. A novel manufacturing method composed of layered molding and casting processes was proposed to fabricate a multilayered soft sensor circuit. Silicone rubber layers with channel patterns, cast with 3D printed molds, were bonded to create embedded microchannels, and a conductive liquid was injected into the microchannels. The channel dimensions are 200µm × 200µm for strain sensing and 500µm (width) × 200µm (height) for pressure sensing. The size of the sensor is 25mm × 25mm, and the thickness is approximately 3.5mm. The prototype was tested with a materials tester and showed linearity in strain sensing and nonlinearity in pressure sensing. The sensor signal was repeatable in both cases.","PeriodicalId":201386,"journal":{"name":"2011 IEEE SENSORS Proceedings","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126020280","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A low power compact CMOS programmable temperature switch with process compensation","authors":"Z. Geng, W. Lou, N. Wu","doi":"10.1109/ICSENS.2011.6127108","DOIUrl":"https://doi.org/10.1109/ICSENS.2011.6127108","url":null,"abstract":"A low power compact CMOS programmable temperature switch with process compensation is presented. Its threshold temperature Tth can be programmed by a digital signal. The operating principle of the temperature switch is theoretically explained. We adopt a simple circuit architecture and a subthreshold CMOS circuit technique to reduce the chip size and the power consumption. A process compensation circuit is designed to compensate the threshold temperature Tth variation automatically. The switch circuit is implemented in a standard 0.18um CMOS process. The measured results show that the temperature switch can be programmed to perform the switch operation at 12 different threshold temperature Tths from 45°C–100°C with a 5°C increment. The chip core area is 0.03mm2 and the power consumption is less than 1uA at 1.8V power supply.","PeriodicalId":201386,"journal":{"name":"2011 IEEE SENSORS Proceedings","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126183389","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
H. Ewald, C. Ruther, W. Mittelmeier, R. Bader, D. Kluess
{"title":"A novel in vivo sensor for loosening diagnostics in total hip replacement","authors":"H. Ewald, C. Ruther, W. Mittelmeier, R. Bader, D. Kluess","doi":"10.1109/ICSENS.2011.6127166","DOIUrl":"https://doi.org/10.1109/ICSENS.2011.6127166","url":null,"abstract":"Approximately 200,000 patients are treated with total hip replacements (THR) in the United States per annum, in European Countries over 500.000. The main reason for revision of total hip replacements (THR) is the aseptic or septic loosening. The Osseointegration of the uncemented hip stem in the femoral bone has to be detected exactly, in order to enable early state loosening detection. All present diagnostic methods, e.g. radiographs and arthroscopy, show insufficient sensitivities and specificities between 70% and 80%. Osseointegration can be identified in-vivo by use of ‘active’ acoustic methods. The acoustic waves can be generated, e.g. by a mechanical hammer placed on the inside of the femoral hip stem wall. The mechanical-acoustic properties of the bone-implant interface give information about the status of the loosening process. A functional in-vitro model of the measuring principle shows significant differences in varied phases of fixation. The new acoustic sensor system demonstrates its potential to detect aseptic loosening.","PeriodicalId":201386,"journal":{"name":"2011 IEEE SENSORS Proceedings","volume":"98 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124684686","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A microfabricated platform for three-dimensional microsystems","authors":"Grant A. McCallum, R. Lahiji, Mehran Meregany","doi":"10.1109/ICSENS.2011.6127170","DOIUrl":"https://doi.org/10.1109/ICSENS.2011.6127170","url":null,"abstract":"This work presents a manually assembled three-dimensional (3-D) silicon platform structure that fully houses a microsystem containing sensors and the necessary system electronics including the power supply. The unique design of this platform provides a supporting package in a 3-D form factor, as well as routing capabilities with orthogonal mechanical and electrical connections between the assembled internal sides. An example platform is fabricated to realize an autonomous data-logging inertial measurement unit (IMU). The IMU consists of a programmable microcontroller, Flash memory, a three-axis accelerometer and a three-axis gyroscope. Double-sided polished, 250 µm-thick silicon wafers are processed using standard microfabrication techniques to produce the individual platform pieces. Sensor data, at a rate of 100Hz, is collected via a microcontroller and stored in the on-board Flash memory. Reliable and repeatable inertial data are collected with maximum power consumption of ∼16 mW, and the duration of data-logging capability of ∼48 hours. It is envisioned that extensions of this 3-D platform, combined with standard microfabrication techniques, will enable the integration of a variety of heterogeneous materials and devices with a form factor that reduces planar footprint and expands 3-D design space. Through-wafer vias can be used to integrate more functionality per surface area by increasing the interconnect density and allowing both the front and backside of the wafers to be populated with either fabricated or mounted devices.","PeriodicalId":201386,"journal":{"name":"2011 IEEE SENSORS Proceedings","volume":"153 1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124720369","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
J. Tamelier, S. Chary, K. Turner, Jing Yu, Saurabh Das, J. Israelachvili
{"title":"Millimeter size patch behavior of gecko-inspired reversible adhesive","authors":"J. Tamelier, S. Chary, K. Turner, Jing Yu, Saurabh Das, J. Israelachvili","doi":"10.1109/ICSENS.2011.6127159","DOIUrl":"https://doi.org/10.1109/ICSENS.2011.6127159","url":null,"abstract":"A synthetic adhesive inspired by the gecko should replicate the important properties found on the animal, but does not need to be a direct copy of its system. This paper describes the fabrication and testing of micron-sized vertical and tilted rectangular flaps composed of polydimethylsiloxane (PDMS) that successfully mimic key characteristics found on the creature. Rectangular flaps have been chosen in order to create large areas of contact on the face of the structures after shearing, similar to the animal's terminal structures. Additionally, an angle has been implemented to generate anisotropy in the system and offer comparisons with the vertical counterparts. The performance of the structures is characterized by measuring adhesion, shear, and shear adhesion forces with flat on flat testing geometry over an area of roughly 12 mm2 using a high precision home-built testing apparatus.","PeriodicalId":201386,"journal":{"name":"2011 IEEE SENSORS Proceedings","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124861794","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Spectral measurement with a UV linear-variable optical filter microspectrometer","authors":"A. Emadi","doi":"10.1109/ICSENS.2011.6127349","DOIUrl":"https://doi.org/10.1109/ICSENS.2011.6127349","url":null,"abstract":"This paper presents the design, fabrication and spectral measurements of an Ultra-Violet (UV) Linear Variable Optical Filter (LVOF)-based micro-spectrometer operating in the 300 nm – 400 nm wavelength range. The UV LVOF has been fabricated in an IC-Compatible process using resist reflow. Characterization of the LVOF, by passing monochromatic light through the LVOF, shows high linearity of the profile. The filter provides the possibility to have a robust high-resolution microspectrometer in the UV on a CMOS chip. Spectrum of a Mercury lamp has been measured using the UV LVOF-microspectrometer with 0.5 nm spectral resolution.","PeriodicalId":201386,"journal":{"name":"2011 IEEE SENSORS Proceedings","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129897290","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Hamid Rafiei Karkvandi, Efraim Pecht, O. Yadid-Pecht
{"title":"Confidence level analysis of Sensing Spatial Coverage in Wireless Sensor Networks","authors":"Hamid Rafiei Karkvandi, Efraim Pecht, O. Yadid-Pecht","doi":"10.1109/ICSENS.2011.6127004","DOIUrl":"https://doi.org/10.1109/ICSENS.2011.6127004","url":null,"abstract":"Achieving required Sensing Spatial Coverage (SSC) is considered a main challenge in Wireless Sensor Networks (WSN). Earlier works used the asymptotic analysis to determine the required number of sensors to meet the necessary sensing coverage in a randomly deployed WSN. Recent works have shown that there is an overestimation in the asymptotic analysis and proposed other analytical solutions to overcome this issue. In this work, a novel concept called the coverage ‘confidence level’ is introduced. It overcomes a lack of reliability that previous works ignored in their calculations. The analysis provides an important practical tool that relates the required sensing spatial coverage to WSN key parameters: the number of available nodes and their sensing range ability.","PeriodicalId":201386,"journal":{"name":"2011 IEEE SENSORS Proceedings","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128457718","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}