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2009 20th International Zurich Symposium on Electromagnetic Compatibility最新文献

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Audio Test Setup for EMC Interference Assessment by Listeners 用于EMC干扰评估的音频测试设置
2009 20th International Zurich Symposium on Electromagnetic Compatibility Pub Date : 2009-02-13 DOI: 10.1109/EMCZUR.2009.4783426
Wolfgang Wegst, J. Waldmann, A. Enders
{"title":"Audio Test Setup for EMC Interference Assessment by Listeners","authors":"Wolfgang Wegst, J. Waldmann, A. Enders","doi":"10.1109/EMCZUR.2009.4783426","DOIUrl":"https://doi.org/10.1109/EMCZUR.2009.4783426","url":null,"abstract":"The proposed setup is intended to support vehicle emission measurements as an additional method since there are sometimes differences between detector readings and impressions on a listening person, depending although on the specific radio receiver, of course. This subjective audio test setup is capable of determining electromagnetic interferences in the acoustic base band and to pinpoint the necessary attenuation of the interference to get an interference-free broadcast reception. The suitability is demonstrated with examples of amplitude and frequency modulated signals.","PeriodicalId":192851,"journal":{"name":"2009 20th International Zurich Symposium on Electromagnetic Compatibility","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121359034","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Transient Analysis of Nano-Interconnects 纳米互连的瞬态分析
2009 20th International Zurich Symposium on Electromagnetic Compatibility Pub Date : 2009-02-13 DOI: 10.1109/EMCZUR.2009.4783488
G. Antonini, A. Orlandi, L. Raimondo, F. Ruscitti
{"title":"Transient Analysis of Nano-Interconnects","authors":"G. Antonini, A. Orlandi, L. Raimondo, F. Ruscitti","doi":"10.1109/EMCZUR.2009.4783488","DOIUrl":"https://doi.org/10.1109/EMCZUR.2009.4783488","url":null,"abstract":"This paper presents a new methodology for the transient analysis of nano-interconnects, modeled as lossy and dispersive multiconductor transmission lines. The proposed model is derived from the solution of the Telegrapher's equations in the framework of the Sturm-Liouville theory. The open-ended impedance matrix is expressed in a series form as sum of infinite rational functions, derived by the series form of the Green's function. Hence, a pole-residue rational model can be synthesized and a reduced order model is generated by a simple selection of dominant poles. The numerical results confirm the robustness of the proposed technique.","PeriodicalId":192851,"journal":{"name":"2009 20th International Zurich Symposium on Electromagnetic Compatibility","volume":"110 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127258551","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Vascular Structure Model for Improved Numerical Simulation of Heat Transfer in Human Tissue 改进人体组织传热数值模拟的血管结构模型
2009 20th International Zurich Symposium on Electromagnetic Compatibility Pub Date : 2009-02-13 DOI: 10.1109/EMCZUR.2009.4783440
Mikheil Prishvin, L. Manukyan, R. Zaridze
{"title":"Vascular Structure Model for Improved Numerical Simulation of Heat Transfer in Human Tissue","authors":"Mikheil Prishvin, L. Manukyan, R. Zaridze","doi":"10.1109/EMCZUR.2009.4783440","DOIUrl":"https://doi.org/10.1109/EMCZUR.2009.4783440","url":null,"abstract":"A new algorithm for construction of artificial blood vessel networks and a new approach to simulate heat exchange in tissue are presented. The algorithm produces discrete three-dimensional geometric representations of both arterial and venous networks. The key feature of the algorithm is that growth begins from the root points and it can work with any enclosed geometry. Unlike traditional schemes where heat exchange is calculated between vessels and cells, we consider that heat exchange between blood and tissue as well as the metabolic process happens mainly in capillary. The motivation of this paper is development of realistic vascular structure and simulation of the blood perfusion in tissue. It is needed for precise thermal analysis using the modified bio-heat equation to provide better prediction of thermal response of tissues exposed to RF energy.","PeriodicalId":192851,"journal":{"name":"2009 20th International Zurich Symposium on Electromagnetic Compatibility","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125853630","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Analysis of stochastic resonances in electromagnetic couplings to transmission lines 传输线电磁联轴器随机共振分析
2009 20th International Zurich Symposium on Electromagnetic Compatibility Pub Date : 2009-02-13 DOI: 10.1109/EMCZUR.2009.4783383
O. O. Sy, M. V. van Beurden, B.L. ichielseny
{"title":"Analysis of stochastic resonances in electromagnetic couplings to transmission lines","authors":"O. O. Sy, M. V. van Beurden, B.L. ichielseny","doi":"10.1109/EMCZUR.2009.4783383","DOIUrl":"https://doi.org/10.1109/EMCZUR.2009.4783383","url":null,"abstract":"Resonances present in coupling phenomena between a randomly varying thin-wire transmission-line, and an electro-magnetic field are stochastically characterized. This is achieved by using the first 4 statistical moments in order to appreciate the intensity of the resonance phenomena. The stochastic method proposed is applied to a thin-wire transmission line connected to a variable impedance, and, undergoing random geometrically localized perturbations.","PeriodicalId":192851,"journal":{"name":"2009 20th International Zurich Symposium on Electromagnetic Compatibility","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125971396","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Chip-Package Co-modeling & Verification of Noise Coupling & Generation in CMOS DC/DC Buck Converter CMOS DC/DC降压变换器噪声耦合与产生的芯片-封装协同建模与验证
2009 20th International Zurich Symposium on Electromagnetic Compatibility Pub Date : 2009-02-13 DOI: 10.1109/EMCZUR.2009.4783446
Taigon Song, Jiseong Kim, J. Pak, Joungho Kim
{"title":"Chip-Package Co-modeling & Verification of Noise Coupling & Generation in CMOS DC/DC Buck Converter","authors":"Taigon Song, Jiseong Kim, J. Pak, Joungho Kim","doi":"10.1109/EMCZUR.2009.4783446","DOIUrl":"https://doi.org/10.1109/EMCZUR.2009.4783446","url":null,"abstract":"DC/DC Converters are now an essential part in a system due to the various needs of supply voltage that is necessary for different circuits in the system. However, there are many papers which have dealt for efficiency or for a novel structure that would be customized to the specific design, but few dealt with the noise characteristics of DC/DC Converters which could critically affect to the output supply voltage the target circuit would need. In this paper we analyzed the effect of noise to a DC/DC Converter in a chip-package co-design. We figured out that the decoupling capacitors on the PCB board cannot shield all the noise that could affect to the DC/DC converter, and on-chip decoupling capacitor for a DC/DC Converter would be necessary.","PeriodicalId":192851,"journal":{"name":"2009 20th International Zurich Symposium on Electromagnetic Compatibility","volume":"83 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133158000","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Applications of the Dirichlet-to-Neumann Boundary Operator in Transmission Line Modeling Dirichlet-to-Neumann边界算子在输电线路建模中的应用
2009 20th International Zurich Symposium on Electromagnetic Compatibility Pub Date : 2009-02-13 DOI: 10.1109/EMCZUR.2009.4783381
T. Demeester, D. De Zutter
{"title":"Applications of the Dirichlet-to-Neumann Boundary Operator in Transmission Line Modeling","authors":"T. Demeester, D. De Zutter","doi":"10.1109/EMCZUR.2009.4783381","DOIUrl":"https://doi.org/10.1109/EMCZUR.2009.4783381","url":null,"abstract":"The DtN operator is a useful tool in the characterization of interconnect structures. In combination with the Method of Moments, it can be used for transmission line modeling or to directly determine the internal impedance of conductors. This paper presents a new calculation method for the Dirichlet-to-Neumann (DtN) boundary operator, in the important case of a rectangular block, based on the superposition of slab waveguide modes. Especially for its non-differential form, some numerical issues need to be addressed. It is further explained how the DtN operator can be determined for composite blocks. The theory is illustrated by some numerical examples.","PeriodicalId":192851,"journal":{"name":"2009 20th International Zurich Symposium on Electromagnetic Compatibility","volume":"559 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133482272","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Induced Noise in a Telephone Circuit: a Monte Carlo Approach 电话电路中的感应噪声:蒙特卡罗方法
2009 20th International Zurich Symposium on Electromagnetic Compatibility Pub Date : 2009-02-13 DOI: 10.1109/EMCZUR.2009.4783432
G. Lucca
{"title":"Induced Noise in a Telephone Circuit: a Monte Carlo Approach","authors":"G. Lucca","doi":"10.1109/EMCZUR.2009.4783432","DOIUrl":"https://doi.org/10.1109/EMCZUR.2009.4783432","url":null,"abstract":"The paper describes a method for calculating the level of noise generated in a telephone circuit due to the electromagnetic interference from power or railway lines. By considering the intrinsic random nature of some parameters involved in the phenomenon, a statistical method based on a Monte Carlo algorithm is proposed.","PeriodicalId":192851,"journal":{"name":"2009 20th International Zurich Symposium on Electromagnetic Compatibility","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117076558","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Simplification Method for the Assessment of the EM Response of a Complex Cable Harness 复杂电缆线束电磁响应评估的简化方法
2009 20th International Zurich Symposium on Electromagnetic Compatibility Pub Date : 2009-02-13 DOI: 10.1109/EMCZUR.2009.4783415
J. Parmantier, I. Junqua, S. Bertuol, F. Issac, S. Guillet, S. Houhou, R. Perraud
{"title":"Simplification Method for the Assessment of the EM Response of a Complex Cable Harness","authors":"J. Parmantier, I. Junqua, S. Bertuol, F. Issac, S. Guillet, S. Houhou, R. Perraud","doi":"10.1109/EMCZUR.2009.4783415","DOIUrl":"https://doi.org/10.1109/EMCZUR.2009.4783415","url":null,"abstract":"This paper describes a simplification technique in order to model a complex cable bundle made of a large amount of wires. The basic principle consists in the description of the topology of the cable bundle in terms of point-to-point cable links and to model those cable-links as equivalent wires in a multiconductor transmission line network model. The different steps required to build the model are first presented. Then, a validation on a wiring bundle of the NH90 helicopter, carried out in the frame of the French MOVEA project, demonstrates the pertinence of such an approach in industrial contexts.","PeriodicalId":192851,"journal":{"name":"2009 20th International Zurich Symposium on Electromagnetic Compatibility","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114170145","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 12
Including Stripline Connections into Network Parameter Based Via Models for Fast Simulation of Interconnects 基于通孔模型将带状线连接纳入网络参数，实现互连的快速仿真
2009 20th International Zurich Symposium on Electromagnetic Compatibility Pub Date : 2009-02-13 DOI: 10.1109/EMCZUR.2009.4783461
R. Rímolo-Donadío, H. Bruns, C. Schuster
{"title":"Including Stripline Connections into Network Parameter Based Via Models for Fast Simulation of Interconnects","authors":"R. Rímolo-Donadío, H. Bruns, C. Schuster","doi":"10.1109/EMCZUR.2009.4783461","DOIUrl":"https://doi.org/10.1109/EMCZUR.2009.4783461","url":null,"abstract":"Comprehensive physics-based via models are extended to consider traces connecting vias in PCB and package structures (stripline connection). The traces routed between two power planes are described by modal decomposition to account for the contribution of the parallel plate mode and the stripline mode. The analytical formulation for two vias connected by a trace is provided in this work. It results in a fully parameterized 4-port network, formed by the parallel connection of four 4-by-4 admittance matrices corresponding to: the parallel plate mode, the stripline mode, a coupling factor resulting from the superposition of the two modes, and the capacitances between the via barrel and the power planes. With this novel formulation, good correlation with respect to full-wave simulations could be observed up to 20 GHz, with a remarkable improvement on the computation speed (up to three orders of magnitude).","PeriodicalId":192851,"journal":{"name":"2009 20th International Zurich Symposium on Electromagnetic Compatibility","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125929250","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 19
Vertical Electromagnetic Bandgap Structure for Noise Suppression in Single-ended and Differential Signaling on a Multi-layer Backplane Board 用于多层背板上单端差分信号噪声抑制的垂直电磁带隙结构
2009 20th International Zurich Symposium on Electromagnetic Compatibility Pub Date : 2009-02-13 DOI: 10.1109/EMCZUR.2009.4783424
C. Hwang, Jongbae Park, Jaemin Kim, Kyoungchoul Koo, Joungho Kim
{"title":"Vertical Electromagnetic Bandgap Structure for Noise Suppression in Single-ended and Differential Signaling on a Multi-layer Backplane Board","authors":"C. Hwang, Jongbae Park, Jaemin Kim, Kyoungchoul Koo, Joungho Kim","doi":"10.1109/EMCZUR.2009.4783424","DOIUrl":"https://doi.org/10.1109/EMCZUR.2009.4783424","url":null,"abstract":"Signal via transition is inevitable in backplane multi-layer board for high density routing. And a significant simultaneous switching noise (SSN) coupling to a signal occurs through the signal via transition. In this paper, we present suppression method of the SSN noise coupling caused by via transition in multi-layer backplane board using electromagnetic bandgap (EBG) structure. EBG structures are vertically located around a signal via to provide the low power/ground impedance area. The low power/ground impedance area suppresses the noise propagation and reduces the SSN noise coupling. It is shown that, within the stopband, the power/ground impedance at the position of the signal via with EBG structures is free from the power/ground planes cavity resonance, and the SSN coupling in single-ended and differential signaling is suppressed.","PeriodicalId":192851,"journal":{"name":"2009 20th International Zurich Symposium on Electromagnetic Compatibility","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127502615","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
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