{"title":"Image-Based Auto-Focus Microscope System with Visual Servo Control for Micro-Stereolithography.","authors":"Yijie Liu, Xuexuan Li, Pengfei Jiang, Ziyue Wang, Jichang Guo, Chao Luo, Yaozhong Wei, Zhiliang Chen, Chang Liu, Wang Ren, Wei Zhang, Juntian Qu, Zhen Zhang","doi":"10.3390/mi15101250","DOIUrl":"https://doi.org/10.3390/mi15101250","url":null,"abstract":"<p><p>Micro-stereolithography (μSL) is an advanced additive manufacturing technique that enables the fabrication of highly precise microstructures with fine feature resolution. One of the primary challenges in μSL is achieving and maintaining precise focus throughout the fabrication process. For the successful application of μSL, it is essential to maintain the sample surface within a focal depth of several microns. Despite the growing interest in auto-focus devices, limited attention has been directed towards auto-focus systems in image-based auto-focus microscope systems for precision μSL. To address this challenge, we propose an image-based auto-focus microscope system incorporating visual servo control. In the optical design, a transflective beam splitter is employed, allowing the laser beam to pass through for fabrication while reflecting the focused beam on the sample surface to the microscope and camera. Utilizing captured spot images and the Foucault knife-edge test, a deep learning-based laser spot image processing algorithm is developed to determine the focus position based on spot size and the number of spot pixels on both sides. Experimental results demonstrate that the proposed auto-focus system effectively determines the relative position of the focal point using the laser spot image and achieves auto-focusing through visual servo control.</p>","PeriodicalId":18508,"journal":{"name":"Micromachines","volume":"15 10","pages":""},"PeriodicalIF":3.0,"publicationDate":"2024-10-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC11509336/pdf/","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142503700","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Optimizing Bipolar Reset Waveform to Improve Grayscale Stability in Active Matrix Electrowetting Displays.","authors":"Taiyuan Zhang, Li Wang, Linwei Liu, Wei Li, Shipeng Wu, Jianyang Guo, Guofu Zhou","doi":"10.3390/mi15101247","DOIUrl":"https://doi.org/10.3390/mi15101247","url":null,"abstract":"<p><p>The electrowetting display (EWD) device is a new type of electrowetting-on-dielectric (EWOD) equipment that can achieve a paper-like display effect under the control of an electric field. In this microfluidic system, the stability of grayscale can be affected by various factors, such as the physicochemical properties of the materials, the device structure, and electric field distribution. To improve the grayscale stability of active matrix electrowetting displays (AM-EWDs), the impact of different polarities of driving voltage on oil backflow was investigated in this study. Based on the driving principles of AM-EWD, an optimized inter-frame bipolar reset driving waveform was designed to overcome oil backflow. The proposed driving waveform maintained the stability of the oil state by periodically and rapidly releasing trapped charges in the dielectric layer through a reverse driving voltage. Additionally, the effect of feed-through voltage on pixel driving voltage was eliminated by compensating for the driving voltage on a common electrode. Finally, the performance of the designed driving waveform was evaluated with a 6-inch AM-EWD driving platform. Compared to the conventional unipolar reset driving waveform, the backflow speed decreased by 2.70 a.u./s. The standard deviation of the display luminance was also reduced by 11.24 a.u. Experimental results indicated that both the oil backflow speed and the fluctuation range of luminance were effectively suppressed by the proposed driving waveform.</p>","PeriodicalId":18508,"journal":{"name":"Micromachines","volume":"15 10","pages":""},"PeriodicalIF":3.0,"publicationDate":"2024-10-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC11509134/pdf/","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142503719","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
MicromachinesPub Date : 2024-10-11DOI: 10.3390/mi15101248
Yi Shen, Jiang Luo, Wei Zhao, Jun-Yan Dai, Qiang Cheng
{"title":"A Compact V-Band Temperature Compensation Low-Noise Amplifier in a 130 nm SiGe BiCMOS Process.","authors":"Yi Shen, Jiang Luo, Wei Zhao, Jun-Yan Dai, Qiang Cheng","doi":"10.3390/mi15101248","DOIUrl":"https://doi.org/10.3390/mi15101248","url":null,"abstract":"<p><p>This paper presents a compact V-band low-noise amplifier (LNA) featuring temperature compensation, implemented in a 130 nm SiGe BiCMOS process. A negative temperature coefficient bias circuit generates an adaptive current for temperature compensation, enhancing the LNA's temperature robustness. A T-type inductive network is employed to establish two dominant poles at different frequencies, significantly broadening the amplifier's bandwidth. Over the wide temperature range of -55 °C to 85 °C, the LNA prototype exhibits a gain variation of less than 1.5 dB at test frequencies from 40 GHz to 65 GHz, corresponding to a temperature coefficient of 0.01 dB/°C. At -55 °C, 25 °C, and 85 °C, the measured peak gains are 25.5 dB, 25 dB, and 24.4 dB, respectively, with minimum noise figures (NF) of 3.0 dB, 3.5 dB, and 4.2 dB, and DC power consumptions of 22.3 mW, 27.6 mW, and 34.4 mW. Moreover, the total silicon area of the LNA chip is 0.37 mm<sup>2</sup>, including all test pads, while the core area is only 0.09 mm<sup>2</sup>.</p>","PeriodicalId":18508,"journal":{"name":"Micromachines","volume":"15 10","pages":""},"PeriodicalIF":3.0,"publicationDate":"2024-10-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC11509697/pdf/","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142503635","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
MicromachinesPub Date : 2024-10-10DOI: 10.3390/mi15101245
Amir Hussain Idrisi
{"title":"Editorial for the Special Issue on Nanomaterials for Micro/Nanodevices.","authors":"Amir Hussain Idrisi","doi":"10.3390/mi15101245","DOIUrl":"https://doi.org/10.3390/mi15101245","url":null,"abstract":"<p><p>The Special Issue of <i>Micromachines</i>, titled \"Nanomaterials for Micro/Nanodevices\", comprehensively examines the intersection of nanotechnology and micro/nanodevices [...].</p>","PeriodicalId":18508,"journal":{"name":"Micromachines","volume":"15 10","pages":""},"PeriodicalIF":3.0,"publicationDate":"2024-10-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC11509741/pdf/","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142503678","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
MicromachinesPub Date : 2024-10-10DOI: 10.3390/mi15101246
Bingzheng Li, Weike Wang, Hanbing Chu, Zixuan Liu, Wei Wang
{"title":"A Lightweight SPI-Flash Controller Based on AMBA AHB-Lite Bus.","authors":"Bingzheng Li, Weike Wang, Hanbing Chu, Zixuan Liu, Wei Wang","doi":"10.3390/mi15101246","DOIUrl":"https://doi.org/10.3390/mi15101246","url":null,"abstract":"<p><p>The utilization of SPI-Flash in embedded systems is widespread, primarily serving as program storage during the boot process. As a result, the boot process is influenced to some extent by the SPI-Flash controller. This paper presents a lightweight SPI-Flash controller that simplifies the boot process design by establishing a direct connection between the SPI-Flash and AHB-lite bus interface, enabling rapid program execution in RAM instead of directly from the SPI-Flash. Additionally, the controller can function as a bare-metal program downloader for testing the boot process functionality during FPGA-based SoC (system-on-chip) prototype verification. The system-level simulation and FPGA verification results demonstrate that the proposed SPI-Flash controller successfully achieves its intended functional impact in operations to target the Micron N25Q256A SPI-Flash chip, boot process design, and bare-metal program download. The synthesis results under the SMIC 180 nm 1P8M technology process indicate that this SPI-Flash controller exhibits remarkable performance, power consumption, and area utilization. The source code of the proposed lightweight SPI-Flash controller has been uploaded to GitHub as an open-source project.</p>","PeriodicalId":18508,"journal":{"name":"Micromachines","volume":"15 10","pages":""},"PeriodicalIF":3.0,"publicationDate":"2024-10-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC11509855/pdf/","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142503638","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
MicromachinesPub Date : 2024-10-09DOI: 10.3390/mi15101241
Feng Wu, Jing Xu, Yuanyuan Liu, Hua Sun, Lishang Zhang, Yixuan Liu, Weiwei Wang, Fali Chong, Dan Zou, Shuli Wang
{"title":"Rapid Construction of Liquid-like Surfaces via Single-Cycle Polymer Brush Grafting for Enhanced Antifouling in Microfluidic Systems.","authors":"Feng Wu, Jing Xu, Yuanyuan Liu, Hua Sun, Lishang Zhang, Yixuan Liu, Weiwei Wang, Fali Chong, Dan Zou, Shuli Wang","doi":"10.3390/mi15101241","DOIUrl":"https://doi.org/10.3390/mi15101241","url":null,"abstract":"<p><p>Liquid-like surfaces have demonstrated immense potential in their ability to resist cell adhesion, a critical requirement for numerous applications across various domains. However, the conventional methodologies for preparing liquid-like surfaces often entail a complex multi-step polymer brush modification process, which is not only time-consuming but also presents significant challenges. In this work, we developed a single-cycle polymer brush modification strategy to build liquid-like surfaces by leveraging high-molecular-weight bis(3-aminopropyl)-terminated polydimethylsiloxane, which significantly simplifies the preparation process. The resultant liquid-like surface is endowed with exceptional slipperiness, effectively inhibiting bacterial colonization and diminishing the adherence of platelets. Moreover, it offers promising implications for reducing the dependency on anticoagulants in microfluidic systems constructed from PDMS, all while sustaining its antithrombotic attributes.</p>","PeriodicalId":18508,"journal":{"name":"Micromachines","volume":"15 10","pages":""},"PeriodicalIF":3.0,"publicationDate":"2024-10-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC11509447/pdf/","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142503729","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
MicromachinesPub Date : 2024-10-09DOI: 10.3390/mi15101244
Ehsan Fallah Nia, Ammar Kouki
{"title":"Ceramics for Microelectromechanical Systems Applications: A Review.","authors":"Ehsan Fallah Nia, Ammar Kouki","doi":"10.3390/mi15101244","DOIUrl":"https://doi.org/10.3390/mi15101244","url":null,"abstract":"<p><p>A comprehensive review of the application of different ceramics for MEMS devices is presented. Main ceramics materials used for MEMS systems and devices including alumina, zirconia, aluminum Nitride, Silicon Nitride, and LTCC are introduced. Conventional and new methods of fabricating each material are explained based on the literature, along with the advantages of the new approaches, mainly additive manufacturing, i.e., 3D-printing technologies. Various manufacturing processes with relevant sub-techniques are detailed and the ones that are more suitable to have an application for MEMS devices are highlighted with their properties. In the main body of this paper, each material with its application for MEMS is categorized and explained. The majority of works are within three main classifications, including the following: (i) using ceramics as a substrate for MEMS devices to be mounted or fabricated on top of it; (ii) ceramics are a part of the materials used for an MEMS device or a monolithic fabrication of MEMS and ceramics; and finally, (iii) using ceramics as packaging solution for MEMS devices. We elaborate on how ceramics may be superior substitutes over other materials when delicate MEMS-based systems need to be assembled or packaged by a simpler fabrication process as well as their advantages when they need to operate in harsh environments.</p>","PeriodicalId":18508,"journal":{"name":"Micromachines","volume":"15 10","pages":""},"PeriodicalIF":3.0,"publicationDate":"2024-10-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC11509724/pdf/","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142503665","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Design, Testing, and Experimental Validation of a Rotary Vibration-Assisted Polishing Device (RVAPD) for Enhanced Machining and Surface Quality.","authors":"Silin Liu, Yan Gu, Jieqiong Lin, Zisu Xu, Tianyu Gao, Xinyang Liu, Xiaoming Zhang, Bingjin Yu","doi":"10.3390/mi15101242","DOIUrl":"https://doi.org/10.3390/mi15101242","url":null,"abstract":"<p><p>A rotary vibration-assisted polishing device (RVAPD) is designed to enhance polishing force by converting PZT's linear motion into the rotary motion of a central platform via a flexible mechanism, improving material surface quality. The RVAPD is optimized, simulated, and tested to meet high-frequency and large-amplitude non-resonant vibration polishing requirements. Its structure, designed using theoretical models and finite element software, offers a wide range of polishing parameters. Performance parameters are validated through open-loop tests, confirming effectiveness in polishing experiments. The lever mechanism and Hoeckens connection enhance vibration parameters and motion efficiency, reducing surface flaws in SiC and improving uniformity. Adjusting the RVAPD structure and using the proposed method significantly improve SiC surface quality.</p>","PeriodicalId":18508,"journal":{"name":"Micromachines","volume":"15 10","pages":""},"PeriodicalIF":3.0,"publicationDate":"2024-10-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC11509902/pdf/","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142503670","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Physical Sensors Based on Lamb Wave Resonators.","authors":"Zixia Yu, Yongqing Yue, Zhaozhao Liang, Xiaolong Zhao, Fangpei Li, Wenbo Peng, Quanzhe Zhu, Yongning He","doi":"10.3390/mi15101243","DOIUrl":"https://doi.org/10.3390/mi15101243","url":null,"abstract":"<p><p>A Lamb wave is a guided wave that propagates within plate-like structures, with its vibration mode resulting from the coupling of a longitudinal wave and a shear vertical wave, which can be applied in sensors, filters, and frequency control devices. The working principle of Lamb wave sensors relies on the excitation and propagation of this guided wave within piezoelectric material. Lamb wave sensors exhibit significant advantages in various sensing applications due to their unique wave characteristics and design flexibility. Compared to traditional surface acoustic wave (SAW) and bulk acoustic wave (BAW) sensors, Lamb wave sensors can not only achieve higher frequencies and quality factors in smaller dimensions but also exhibit superior integration and multifunctionality. In this paper, we briefly introduce Lamb wave sensors, summarizing methods for enhancing their sensitivity through optimizing electrode configurations and adjusting piezoelectric thin plate structures. Furthermore, this paper systematically explores the development of Lamb wave sensors in various sensing applications and provides new insights into their future development.</p>","PeriodicalId":18508,"journal":{"name":"Micromachines","volume":"15 10","pages":""},"PeriodicalIF":3.0,"publicationDate":"2024-10-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC11509218/pdf/","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142503722","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
MicromachinesPub Date : 2024-10-08DOI: 10.3390/mi15101239
Ege Ozgul, Wenxin Zeng, Sameer Sonkusale
{"title":"Automated Fabrication of Smart Strain Sensing Threads.","authors":"Ege Ozgul, Wenxin Zeng, Sameer Sonkusale","doi":"10.3390/mi15101239","DOIUrl":"https://doi.org/10.3390/mi15101239","url":null,"abstract":"<p><p>With favorable properties of stretchability, stitchability, and potential to be woven into a fabric, thread-based sensors have gained considerable interest for wearable devices for smart and connected health applications. To facilitate wearable applications, an easy and reliable way to fabricate these thread-based sensors with good performance and consistency is the key while manufacturing these smart threads. In this paper, we propose an automated thread-coating system that can fabricate thread-based strain sensors with controlled parameters. The platform uses integrated sensors for controlled manufacturing of the threads in a highly compact structure that consists of an innovative tension sensor and a closed-loop thermal management system. Using this new system, a sample thread with a gauge factor of 1.47 and tension sensitivity of 32.64 KΩ/N is prepared. Compared with hand-coated thread, the machine-fabricated thread shows much better sensitivity and consistency. The prepared strain sensor is made into a respiration sensor patch and a limb motion patch to demonstrate its application.</p>","PeriodicalId":18508,"journal":{"name":"Micromachines","volume":"15 10","pages":""},"PeriodicalIF":3.0,"publicationDate":"2024-10-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC11509538/pdf/","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142503663","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}