Application of CAE/CAD to Electronic Systems最新文献

High Resolution Thermal Design Tools for Air-Cooled Electronics Components and Systems 用于风冷电子元件和系统的高分辨率热设计工具

Application of CAE/CAD to Electronic Systems Pub Date : 1996-11-17 DOI: 10.1115/imece1996-0999

A. Przekwas, M. Athavale, Y. Ho

引用次数: 0

Determination of Temperatures and Heat Fluxes on Surfaces of Multi-Domain Three-Dimensional Electronic Components 多域三维电子元件表面温度和热流的测定

Application of CAE/CAD to Electronic Systems Pub Date : 1996-11-17 DOI: 10.1115/imece1996-0996

T. Martin, G. Dulikravich

引用次数: 1

The Determination and Utilization of AuSn Solder Creep Properties to Bond GaAs Dice to Diamond Substrates 砷化镓片与金刚石衬底结合的AuSn焊料蠕变性能的测定与利用

Application of CAE/CAD to Electronic Systems Pub Date : 1996-11-17 DOI: 10.1115/imece1996-1003

B. Chandran, W. F. Schmidt, M. Gordon, R. Djkaria

{"title":"The Determination and Utilization of AuSn Solder Creep Properties to Bond GaAs Dice to Diamond Substrates","authors":"B. Chandran, W. F. Schmidt, M. Gordon, R. Djkaria","doi":"10.1115/imece1996-1003","DOIUrl":"https://doi.org/10.1115/imece1996-1003","url":null,"abstract":"\u0000 The stress in gallium arsenide dice larger than 2mm × 2mm conventionally bonded to diamond substrates using eutectic gold-tin solder is larger than the dice’s fracture strength leading to fracture during bonding. This paper discusses a novel bonding technique to reliably bond large gallium arsenide devices to diamond substrates using eutectic gold tin solder. In this technique, the cooling process after bonding is controlled to induce creep in the solder layer. Creep deformation in the solder layer relieves part of the stress in the die and thereby prevents die cracking. An analytical model describing the stress relaxation in the die due to solder creep deformation was developed. Due to the lack of published creep properties of AuSn solder, they were experimentally determined. Optimal cooling curves were generated using the relaxation model to reliably bond different sizes and thicknesses of GaAs dice to diamond substrates. Bonding experiments indicate that all the bonded dice cooled using conventional techniques cracked after bonding and that those cooled using the generated cooling schemes survived. Previously, these creep properties were boot-strapped from the published values for other solders. The experimentally obtained properties deviate substantially from those previously boot-strapped. However, it is interesting to note that the implied cooling schemes were similar.","PeriodicalId":182683,"journal":{"name":"Application of CAE/CAD to Electronic Systems","volume":"87 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-11-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124917807","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Prevention of Overheating and Frequent Thermal Cycling of Outdoor Electronic Cabinets Cooled by Forced Air Convection in Cold Climates 寒冷气候下室外强制对流制冷电子柜过热及频繁热循环的预防

Application of CAE/CAD to Electronic Systems Pub Date : 1996-11-17 DOI: 10.1115/imece1996-1006

E. Zimmerman, H. Hegab, G. T. Colwell

{"title":"Prevention of Overheating and Frequent Thermal Cycling of Outdoor Electronic Cabinets Cooled by Forced Air Convection in Cold Climates","authors":"E. Zimmerman, H. Hegab, G. T. Colwell","doi":"10.1115/imece1996-1006","DOIUrl":"https://doi.org/10.1115/imece1996-1006","url":null,"abstract":"\u0000 Telephone companies use electronics to route calls between customers. These electronics are generally packaged together and placed in steel containers located outdoors. When a significant amount of electronics are packaged together the cooling capacity of natural convection is exceeded and supplementary cooling systems are needed. Forced air cooling is generally the system of choice given the relative low cost and simplicity when compared to alternative cooling methods. Simple axial flow fans are typically turned on and off by a thermostat located inside the cabinet to keep the inside air temperature below a predetermined maximum. While the behavior of an electronics cabinet with this type of cooling system may be acceptable under conditions of a summer day in the desert southwest, it may overheat or have unacceptable thermal cycling during the cold days of winter. Numerical simulation using a system of lumped thermal capacitances is used to predict the air-flow rate which would prevent thermal cycling and reduce operating temperatures to well below that found in the summer months.","PeriodicalId":182683,"journal":{"name":"Application of CAE/CAD to Electronic Systems","volume":"414 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-11-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116699499","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Parametric Study of Pin Length and Reynolds Number Effects on Heat Transfer in a Cast Pin Fin Coldwall for Electronic Systems 引脚长度和雷诺数对电子系统铸造引脚鳍冷壁传热影响的参数化研究

Application of CAE/CAD to Electronic Systems Pub Date : 1996-11-17 DOI: 10.1115/imece1996-1004

B. E. Short, P. Raad, D. C. Price

引用次数: 0

Design of Experiment Based Evaluation of the Thermal Performance of a Flipchip Electronic Assembly 基于实验的倒装电子组件热性能评估设计

Application of CAE/CAD to Electronic Systems Pub Date : 1996-11-17 DOI: 10.1115/imece1996-1009

Pankaj Mithal

引用次数: 3

Novel Epoxy Compositions for Microelectronic Packaging Applications 微电子封装用新型环氧树脂组合物

Application of CAE/CAD to Electronic Systems Pub Date : 1996-11-17 DOI: 10.1115/imece1996-1002

M. Sambasivam, R. Ghoshal, Proshanto Mukerji

{"title":"Novel Epoxy Compositions for Microelectronic Packaging Applications","authors":"M. Sambasivam, R. Ghoshal, Proshanto Mukerji","doi":"10.1115/imece1996-1002","DOIUrl":"https://doi.org/10.1115/imece1996-1002","url":null,"abstract":"\u0000 Using proprietary epoxies, new formulations have been developed for use in microelectronic packaging applications. The key features of these formulations are short cure cycle, long term stability at 25° C, very low cure volatile, low moisture absorption, low coefficient of thermal expansion (CTE), excellent adhesion to various substrates. The CTE does not change appreciably with temperature between 0–200°C. This unique behavior is attributed to the interpenetrating network-like (IPN) structure of the base resins in the cured state. Further evidence of the IPN structure is the broad loss modulus and tan 6, observed between −150°C and −150°C, in dynamic mechanical tests. The extensive curing reaction in these catalyst-cured systems results in a highly crosslinked polymer network with good moisture resistance (< 0.2°o after 14 days in 85°C/85% RH) and thermal stability (< 0.3 wt % at 300°C of the cured material). Under 85/85 conditions, no appreciable changes in modulus was observed. Extent of cure studies in a dynamic scanning calorimeter (DSC) show a complete cure with no postcure requirements. Cure cycles for these formulations range from 1 hour at 140°C to about 1 minute @170°C. Currently, cure stresses, fracture toughness (bulk and interfacial), and various reliability tests are being performed to characterize the underfill, glob top encapsulants, and die-attach adhesives.","PeriodicalId":182683,"journal":{"name":"Application of CAE/CAD to Electronic Systems","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-11-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121451062","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Optimization of Solder Joint Fatigue Life Using Product Model-Based Analysis Models 基于产品模型的分析模型优化焊点疲劳寿命

Application of CAE/CAD to Electronic Systems Pub Date : 1996-11-17 DOI: 10.1115/imece1996-1001

Selçuk Cimtalay, R. Peak, R. Fulton

引用次数: 8

On the Routinization of Analysis for Physical Design 论物理设计分析的程序化

Application of CAE/CAD to Electronic Systems Pub Date : 1996-11-17 DOI: 10.1115/imece1996-1005

R. Peak, A. Scholand, R. Fulton

{"title":"On the Routinization of Analysis for Physical Design","authors":"R. Peak, A. Scholand, R. Fulton","doi":"10.1115/imece1996-1005","DOIUrl":"https://doi.org/10.1115/imece1996-1005","url":null,"abstract":"\u0000 While it is generally agreed physical designers would like to benefit more from analysis, methodologies are lacking for identifying appropriate analysis models and transforming them into readily usable tools. This paper identifies physical designer needs with respect to analysis, and introduces the term “routinization” to describe the process of creating routine analysis modules — automated analysis models that can be regularly used in product design.\u0000 A routinization methodology is presented with electronic packaging examples. Based on the multi-representation architecture (MRA), a design-analysis integration strategy, this methodology creates catalogs of product model-based analysis models (PBAMs) — analysis modules that associate design data with specific analysis models to obtain results in a highly automated manner.\u0000 The methodology is illustrated using a simple PBAM for PWB warpage analysis. Applications to solder joint fatigue and plated through hole deformation are also highlighted, with solution methods ranging from encoded formulae to multi-vendor 3D finite element analysis. Observations are given, including how routinization aides both electronic packaging researchers and physical designers. While it enables researchers to more readily benefit designers, it also acts as a catalyst for identifying needed research extensions.","PeriodicalId":182683,"journal":{"name":"Application of CAE/CAD to Electronic Systems","volume":"59 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-11-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126417310","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 14

Thermal Analysis of Compact Electronic Equipment With Cooling Fan 装有冷却风扇的小型电子设备的热分析

Application of CAE/CAD to Electronic Systems Pub Date : 1996-11-17 DOI: 10.1115/imece1996-1007

K. Hisano, H. Iwasaki, M. Ishizuka, Sadao Makita

引用次数: 0