Application of CAE/CAD to Electronic Systems最新文献_第2页

CFD Simulations in the Design and Evaluation of Heat Sinks 散热器设计与评价中的CFD模拟

Application of CAE/CAD to Electronic Systems Pub Date : 1996-11-17 DOI: 10.1115/imece1996-0997

W. Nakayama, M. Behnia

引用次数: 0

Populating Product Data for Engineering Analysis With Applications to Printed Wiring Assemblies 为工程分析填充产品数据，并将其应用于印刷布线组件

Application of CAE/CAD to Electronic Systems Pub Date : 1996-11-17 DOI: 10.1115/imece1996-1000

D. Tamburini, R. Peak, R. Fulton

{"title":"Populating Product Data for Engineering Analysis With Applications to Printed Wiring Assemblies","authors":"D. Tamburini, R. Peak, R. Fulton","doi":"10.1115/imece1996-1000","DOIUrl":"https://doi.org/10.1115/imece1996-1000","url":null,"abstract":"\u0000 The engineering data for products such as Printed Wiring Assemblies (PWAs) is a complex aggregation of heterogeneous information generated by a variety of design tools. At certain stages of the product development cycle this information is used to perform engineering analyses in order to validate the design against several criteria.\u0000 This paper addresses the problem of populating product data from several heterogeneous sources in order to support the informational needs of given engineering analyses. This is usually a tedious and error-prone process, which involves accessing the data — often manually — from different repositories. stored in different formats and in different locations. After the data is retrieved, it must be integrated in a way that is meaningful to the analysis models employed. This integration is unique in that much of the data representing the design of the complete product is not used at all in the analysis, while the data that is used has to undergo significant transformation and/or idealization before being fed into the analysis models.\u0000 This work proposes an object-oriented architecture to automate the data retrieval and population process. It generates a semantically meaningful set of data from which the analysis applications can extract the information they need more easily. The emerging Standard for the Exchange of Product Model Data (STEP) provides the neutral mechanisms needed by this architecture for describing and exchanging product data. The design and analysis of Printed Wiring Assemblies was chosen to test the concepts developed in this work. In this example, the goal is to assemble PWA product data created by several E/MCAD tools into a single integrated schema that supports the informational needs of specific thermomechanical analyses.","PeriodicalId":182683,"journal":{"name":"Application of CAE/CAD to Electronic Systems","volume":"32 4","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-11-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120940201","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 11

Application of the Pin-Fin Heat Sink to Electronic Equipment [Study on Design Method for Flow-Guide Vanes] 引脚翅片散热器在电子设备中的应用[导流叶片设计方法研究]

Application of CAE/CAD to Electronic Systems Pub Date : 1996-11-17 DOI: 10.1115/imece1996-1010

Ko Minakami, K. Hisano, H. Iwasaki, S. Mochizuki

{"title":"Application of the Pin-Fin Heat Sink to Electronic Equipment [Study on Design Method for Flow-Guide Vanes]","authors":"Ko Minakami, K. Hisano, H. Iwasaki, S. Mochizuki","doi":"10.1115/imece1996-1010","DOIUrl":"https://doi.org/10.1115/imece1996-1010","url":null,"abstract":"\u0000 Experimental and numerical studies were carried out to evaluate the effect of flow-guide vanes on air-intake velocity into the air-cooling heat sink, in the case of using a high performance but large pressure loss heat sink, such as a pin-fin array, for microprocessors having high power density. The flow-guide vanes were placed at the inlet portion of the heat sink in the spanwise direction. The pin-fin array used in the experiments was made of square shaped thin (0.2 mm) copper pins. Thermal resistance of the pin-fin array with and without flow-guide vane was measured, varying the upstream air velocity and the angle of the flow-guide vanes as a parameter. In the numerical simulation, the pressure loss characteristic based on the empirical formulas was applied. Two-dimensional laminar flow analyses using the finite differential method were performed. The parameters were the upstream air velocity, and the width and angle of the flow-guide vanes. The tendencies of the experimental and numerical analysis results showed good agreement, and it was found that the effect of the angle of flow-guide vanes on the intake air velocity was small. Also, the relation between the upstream velocity and actual intake velocity to the heat sink was discussed, and the design method for the optimum configuration of flow-guide vanes was proposed.","PeriodicalId":182683,"journal":{"name":"Application of CAE/CAD to Electronic Systems","volume":"60 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-11-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116263352","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

The LVEL Turbulence Model for Conjugate Heat Transfer at Low Reynolds Numbers 低雷诺数下共轭传热的水平湍流模型

Application of CAE/CAD to Electronic Systems Pub Date : 1996-11-17 DOI: 10.1115/imece1996-0998

D. Agonafer, Liao Gan-Li, D. Spalding

引用次数: 40

Thermal Control Subsystem Design for the Avionics of a Space Station Payload 空间站有效载荷航空电子设备的热控制子系统设计

Application of CAE/CAD to Electronic Systems Pub Date : 1996-10-01 DOI: 10.1115/imece1996-1008

M. Moran

引用次数: 0