Journal of Electronic Packaging最新文献_第4页

Surrogate Modeling for Creep Strain Based Fatigue Prediction of a Ball Grid Array Component 基于蠕变应变的球栅阵列构件疲劳预测的代理建模

IF 1.6 4区工程技术

Journal of Electronic Packaging Pub Date : 2023-04-26 DOI: 10.1115/1.4062404

Markus Tauscher, Merk Tobias, Aniket Adsule, Andreas Linnemann, Jüergen Wilde

{"title":"Surrogate Modeling for Creep Strain Based Fatigue Prediction of a Ball Grid Array Component","authors":"Markus Tauscher, Merk Tobias, Aniket Adsule, Andreas Linnemann, Jüergen Wilde","doi":"10.1115/1.4062404","DOIUrl":"https://doi.org/10.1115/1.4062404","url":null,"abstract":"\u0000 In the past years the Finite Element Analysis has proven to be a suitable way for fatigue prediction of electronic equipment based on the Physics-of-Failure-approach. For this, inelastic strain parameters like creep strain or creep energy density are evaluated in crack susceptible regions of solder joints. Due to the non-linearity of the plastic behavior, which is the basis for these simulations, the computational effort can be significant. This mostly leads to a component focused approach. Global influences on components like local stiffness variations due to adjacent components, copper traces or fixations of the Printed Circuit Board are often ignored. To make creep based fatigue predictions suitable for complex Printed Circuit Board Assemblies, a method for reducing computational effort needs to be established. For this matter, a machine learning based approach for solder joints has been developed. First, the process for data generation and model training has been established. Thereafter, several methods for input parameter reduction are discussed. Lastly, a first model is being trained based on the generated simulation data.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":" ","pages":""},"PeriodicalIF":1.6,"publicationDate":"2023-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"48366353","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Multi-level Embedded 3d Manifold Microchannel Heat Sink of Aln Direct Bonded Copper for the High-power Electronic Module 用于大功率电子模块的Aln直接键合铜多层嵌入式三维歧管微通道散热器

IF 1.6 4区工程技术

Journal of Electronic Packaging Pub Date : 2023-04-21 DOI: 10.1115/1.4062384

Yujui Lin, Tiwei Wei, Wyatt Jason Moy, Hao Chen, M. Gupta, M. Degner, M. Asheghi, A. Mantooth, K. Goodson

引用次数: 1

Improving Ambient Contrast Ratio of Display Device At Oblique Angle Using a Fe3o4-magnetic Particle Chained Pillar Array Structure 利用fe3o4磁颗粒链柱阵列结构提高斜角度显示器件的环境对比度

IF 1.6 4区工程技术

Journal of Electronic Packaging Pub Date : 2023-04-21 DOI: 10.1115/1.4062383

Zongtao Li, Junhao Wu, Guanwei Liang, Renpeng Yang, Zhihui Yang, Jiasheng Li

{"title":"Improving Ambient Contrast Ratio of Display Device At Oblique Angle Using a Fe3o4-magnetic Particle Chained Pillar Array Structure","authors":"Zongtao Li, Junhao Wu, Guanwei Liang, Renpeng Yang, Zhihui Yang, Jiasheng Li","doi":"10.1115/1.4062383","DOIUrl":"https://doi.org/10.1115/1.4062383","url":null,"abstract":"\u0000 A high ambient contrast ratio (ACR) is essential for achieving a high dynamic range in advanced display applications, but reported ACR enhancement strategies always result in reduced optical efficiency of light-emitting diode (LED) display devices. In this study, an Fe3O4-magnetic particle-chained pillar array (Fe3O4-MPCP) structure was introduced to improve the ACR of LED display devices with low optical loss. The results indicated that the MPCP structure achieved high ACR at an oblique angle using surface pillar array to suppress ambient light reflections, and its internal magnetic particle chain improved the transmissivity to maintain high device efficiency. Compared with the commercial graphite-coated device at typical viewing angles (i.e., 0° and 60°), the ACR of the optimal MPCP device increased by 217 and 140%, while the device efficiency increased by 25 and 12%, respectively. Therefore, the proposed method provides a novel approach for significantly improving ACR at all oblique angles while maintaining high device efficiency, which can be easily integrated into various LED display devices and has significant potential in advanced display applications.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":"1 1","pages":""},"PeriodicalIF":1.6,"publicationDate":"2023-04-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"41483717","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Effect of Heating Power On BGA Thermal Shock Reliability for a Fanout Package 加热功率对扇出封装BGA热冲击可靠性的影响

IF 1.6 4区工程技术

Journal of Electronic Packaging Pub Date : 2023-04-17 DOI: 10.1115/1.4062344

Ke Zhong, Wang Huanpeng, Jingrou Wang, Yuehang Xu

{"title":"Effect of Heating Power On BGA Thermal Shock Reliability for a Fanout Package","authors":"Ke Zhong, Wang Huanpeng, Jingrou Wang, Yuehang Xu","doi":"10.1115/1.4062344","DOIUrl":"https://doi.org/10.1115/1.4062344","url":null,"abstract":"\u0000 The reliability of Fanout package with a ball grid array (BGA) for micro-system is studied under thermal shock. Different heat source powers are applied to the silicon substrate to imitate the power dissipation induced heat of power devices and the thermal fatigue life of the package are studied using the Anand constitutive model and Darveaux life model. The finite element method (FEM) simulation results show that the thermal fatigue life is not positively correlated with the heat source power. In a certain power range, the life first increases and then decreases. To explain this abnormal phenomenon, the fatigue analysis of solder balls with different heating power (10~55W) is carried out. The results show that in the low temperature stage, with the increase of the heat source power, the heat source offsets the low temperature effect to a certain extent, and the stress value of the solder balls decreases. And during the high temperature stage, the stress of the ball is hardly affected. However, with the increase of the heat source power, the thermal deformation of the structure is gradually serious, the effect of offsetting the low temperature effect is reduced, and the thermal fatigue life increases with the increase of the heat source power. The results of the paper can be useful for micro-system package design.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":" ","pages":""},"PeriodicalIF":1.6,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"46198714","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Numerical Study of Two-Stage Temperature Control Strategy for High Temperature Stability of Satellite-Borne Fiber Optic Gyroscope 星载光纤陀螺高温稳定性两阶段温度控制策略的数值研究

IF 1.6 4区工程技术

Journal of Electronic Packaging Pub Date : 2023-03-11 DOI: 10.1115/1.4062108

Kai‐Guo Chang, Yunze Li, Weishu Wang

{"title":"Numerical Study of Two-Stage Temperature Control Strategy for High Temperature Stability of Satellite-Borne Fiber Optic Gyroscope","authors":"Kai‐Guo Chang, Yunze Li, Weishu Wang","doi":"10.1115/1.4062108","DOIUrl":"https://doi.org/10.1115/1.4062108","url":null,"abstract":"\u0000 Fiber optic gyroscopes (FOGs) are widely used in attitude control systems of spacecraft such as satellites and Mars rovers for their superior spatial adaptability. However, changes in ambient temperature can cause errors in the FOG and reduce its output accuracy. In this paper, a fuzzy two-stage temperature control strategy applied to a satellite-borne three-axis integrated fiber optic gyroscope (TAIFOG) is proposed. And the control rules of the fuzzy two-stage temperature controller are described in detail. A thermodynamic model that can quickly and accurately respond to the dynamic thermal characteristics of the satellite-borne TAIFOG is also constructed based on the lumped method. The effectiveness of the proposed fuzzy two-stage temperature control strategy in improving the temperature stability of the satellite-borne TAIFOG in orbit is verified through numerical studies. Numerical results show that this fuzzy two-stage active temperature control strategy can fundamentally improve the thermal state of the satellite-borne TAIFOG and ensure that its sensitive element fiber optic coils maintain high temperature stability while the TAIFOG is in orbit. In addition, the start-up time of TAIFOG is reduced to 308 seconds compared to the case without active temperature control, which is a reduction of 96.27%. This active temperature control strategy is well suited for engineering applications to improve FOG output accuracy.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":" ","pages":""},"PeriodicalIF":1.6,"publicationDate":"2023-03-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"45031616","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Process-factor Optimization of Small-area Sintered Interconnects for Power Electronics Applications 电力电子应用中小面积烧结互连的工艺因素优化

IF 1.6 4区工程技术

Journal of Electronic Packaging Pub Date : 2023-02-27 DOI: 10.1115/1.4056992

K. Alzoubi, A. Hensel, Felix Häußler, B. Ottinger, Marcel Sippel, Joerg Franke

{"title":"Process-factor Optimization of Small-area Sintered Interconnects for Power Electronics Applications","authors":"K. Alzoubi, A. Hensel, Felix Häußler, B. Ottinger, Marcel Sippel, Joerg Franke","doi":"10.1115/1.4056992","DOIUrl":"https://doi.org/10.1115/1.4056992","url":null,"abstract":"\u0000 Power electronics is concerned with the use of electronic devices to control and transfer electric power from one form to another. Power electronics can be found in laptop chargers, electric grids, and solar inverters. Die-attach interconnections form a critical part of power electronics devices. Silver sintering is traditionally used for die-attach interconnections because of its high melting point and ability to form very thin thicknesses. However, the processing time compared with soldering is very long. Sintered layers might contain large voids that affect the mechanical stability of the structure. Stresses caused by mechanical and environmental conditions might cause degradation and possibly early failures. This work focuses on studying the combined effect of process factors on the shear strength of small-area die-attach interconnections in silver sintering. Design of Experiments (DoE) tools were used to build an experimental matrix with a 95% confidence level. The results have shown that holding time has a considerable effect on the mechanical stability of the die-attach interconnections. Intermetallic compounds formed in the sintered joints at higher holding times resulted in lesser voids. Furthermore, the treatment level of the holding time highly affects the shear strength under the other factors of temperature and pressure.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":" ","pages":""},"PeriodicalIF":1.6,"publicationDate":"2023-02-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"45102537","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

High Gain and Wideband Antenna-in-package Solution Using Fan-out Technology 采用扇出技术的高增益宽带封装天线解决方案

IF 1.6 4区工程技术

Journal of Electronic Packaging Pub Date : 2023-02-27 DOI: 10.1115/1.4056991

Xuesong Zhang, Qian Wang, Chenhui Xia, Chaojie Zhou, Gang Wang, Jian Cai

引用次数: 0

A Time Frequency Domain Based Approach for Bga Solder Joint Fatigue Analysis Using Global Local Modeling Technique 基于时频域全局局部建模技术的Bga焊点疲劳分析方法

IF 1.6 4区工程技术

Journal of Electronic Packaging Pub Date : 2023-02-09 DOI: 10.1115/1.4056886

S. Doranga, Dongji Xie, J. Lee, Andy Zhang, Xue Shi, Valeriy Khaldarov

{"title":"A Time Frequency Domain Based Approach for Bga Solder Joint Fatigue Analysis Using Global Local Modeling Technique","authors":"S. Doranga, Dongji Xie, J. Lee, Andy Zhang, Xue Shi, Valeriy Khaldarov","doi":"10.1115/1.4056886","DOIUrl":"https://doi.org/10.1115/1.4056886","url":null,"abstract":"\u0000 The fatigue life prediction of the electronic packages under dynamic loading conditions is an increasingly important area of research, with direct application in packaging industries. Current life prediction methodologies are, in general, developed through a finite element (FE) model that is correlated using an experimental data measured through sweep sine testing. The frequency response curve (FRF) generated by using a sweep sine testing may suffer from leakage and windowing of the signal may not work correctly, which results in the shift in the amplitude and the resonance frequencies of the package. In consequence, there will be a significant deviation between the actual and the predicted natural frequencies and the amplitude of vibration response in the given excitation range, resulting in the longer time to fail the package during the laboratory based /virtual durability testing. Thus, it is necessary to develop a suitable validation technique in time/frequency domain to address this issue. In this paper, the step sine testing procedure is utilized to validate the FE model of a test vehicle consisting of a board level BGA chip package and the resonance based fatigue testing is performed in the FE based simulation. The global-local modeling approach is utilized to model the test vehicle and the volume average von Mises stress is used to predict the life of the solder joint. Following the numerical simulations, fatigue test is carried out in the test vehicle at the first resonance frequency obtained from the step sine test. Experimental results show that there are full openings of the corner balls in a very short interval of time. The results of the life prediction from the FE model and from experiments are comparable to each other thus validating the proposed methodology.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":" ","pages":""},"PeriodicalIF":1.6,"publicationDate":"2023-02-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"49644543","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Reviewer's Recognition 评论家的认可

4区工程技术

Journal of Electronic Packaging Pub Date : 2023-02-01 DOI: 10.1115/1.4056725

引用次数: 0

A Comparison of Biaxial Bending Strength of Thin Silicon Dies in the BoR and PoEF Tests 薄硅模具在BoR和PoEF试验中的双轴弯曲强度比较

IF 1.6 4区工程技术

Journal of Electronic Packaging Pub Date : 2023-01-23 DOI: 10.1115/1.4056717

M. Tsai, T. Kuo

{"title":"A Comparison of Biaxial Bending Strength of Thin Silicon Dies in the BoR and PoEF Tests","authors":"M. Tsai, T. Kuo","doi":"10.1115/1.4056717","DOIUrl":"https://doi.org/10.1115/1.4056717","url":null,"abstract":"\u0000 This paper aims to demonstrate the biaxial bending strength test on thin silicon dies using the classic ball-on-ring (BoR) test, and discuss it in detail by comparing those results with the newly-proposed point load on elastic foundation (PoEF) test. The geometric linear and nonlinear solutions to the BoR test are reviewed and also provided with theoretical and numerical formulations, respectively. Three different thicknesses (t = 42 μm, 57 μm and 82 μm) of the thin silicon dies (with a size of 10 mm × 10 mm) are tested in the BoR test, and their bending strengths, load-displacement curves and failure modes are presented and thoroughly discussed with a comparison of the published data from the PoEF test. It is found that, for the bending strengths of 57 μm and 82 μm-thick dies, the data from both the BoR and PoEF tests are very consistent, but not for 42 μm-thick dies with a relatively lower value in the BoR test. This lower strength value in the BoR test is attributed to the more pronounced local buckling effect than the PoEF test. Based on that, it can concluded that the PoEF test is better and more reliable than the conventional BoR as for testing the ultra-thin silicon dies, even though both tests are identical for the regularly thin dies.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":" ","pages":""},"PeriodicalIF":1.6,"publicationDate":"2023-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"48252437","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0