Process-factor Optimization of Small-area Sintered Interconnects for Power Electronics Applications

Abstract

Power electronics is concerned with the use of electronic devices to control and transfer electric power from one form to another. Power electronics can be found in laptop chargers, electric grids, and solar inverters. Die-attach interconnections form a critical part of power electronics devices. Silver sintering is traditionally used for die-attach interconnections because of its high melting point and ability to form very thin thicknesses. However, the processing time compared with soldering is very long. Sintered layers might contain large voids that affect the mechanical stability of the structure. Stresses caused by mechanical and environmental conditions might cause degradation and possibly early failures. This work focuses on studying the combined effect of process factors on the shear strength of small-area die-attach interconnections in silver sintering. Design of Experiments (DoE) tools were used to build an experimental matrix with a 95% confidence level. The results have shown that holding time has a considerable effect on the mechanical stability of the die-attach interconnections. Intermetallic compounds formed in the sintered joints at higher holding times resulted in lesser voids. Furthermore, the treatment level of the holding time highly affects the shear strength under the other factors of temperature and pressure.