Multi-level Embedded 3d Manifold Microchannel Heat Sink of Aln Direct Bonded Copper for the High-power Electronic Module

IF 2.2 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Yujui Lin, Tiwei Wei, Wyatt Jason Moy, Hao Chen, M. Gupta, M. Degner, M. Asheghi, A. Mantooth, K. Goodson
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引用次数: 1

Abstract

Better thermal management is a key enabler of higher power density in traction inverter power modules. For the first time, we successfully fabricated and tested a microchannel with a 3D manifold cooler (MMC) using AlN-based Directed Bonded Copper (DBC) substrates. The microchannels (width ~300 μm and height ~450 μm) and 3D manifold fluidic passages (width ~300 μm and height ~600 μm) were fabricated in two DBC substrates using the femtosecond laser and subsequently bonded using transition liquid phase (TLP) bonding. In this study, the hydraulic and thermal performance of the 3D MMC is measured and validated with numerical simulation. The proposed 3D MMC is capable of removing heat at 600 W/cm2 with a 10 kPa pressured drop at the thermal thermal resistance of 0.2 cm2-K/W. The optimized designs via geometric and layout rearrangement were conducted, which indicates the pressure drop can be further reduced by 10× while maintaining the same thermal performance.
用于大功率电子模块的Aln直接键合铜多层嵌入式三维歧管微通道散热器
更好的热管理是牵引逆变器功率模块实现更高功率密度的关键因素。我们首次使用基于AlN的定向键合铜(DBC)衬底成功地制造并测试了具有3D歧管冷却器(MMC)的微通道。使用飞秒激光在两个DBC衬底上制备了微通道(宽度~300μm,高度~450μm)和3D歧管流体通道(宽度+300μm和高度~600μm),随后使用过渡液相(TLP)键合。在本研究中,测量了三维MMC的液压和热性能,并通过数值模拟进行了验证。所提出的3D MMC能够在0.2cm2-K/W的热阻下以10kPa的压降去除600W/cm2的热量。通过几何和布局重排进行了优化设计,表明在保持相同热性能的同时,压降可以进一步降低10倍。
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来源期刊
Journal of Electronic Packaging
Journal of Electronic Packaging 工程技术-工程:电子与电气
CiteScore
4.90
自引率
6.20%
发文量
44
审稿时长
3 months
期刊介绍: The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.
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