评论家的认可

IF 2.2 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Electronic Packaging Pub Date : 2023-02-01 DOI:10.1115/1.4056725

{"title":"评论家的认可","authors":"","doi":"10.1115/1.4056725","DOIUrl":null,"url":null,"abstract":"The Reviewers of the Year Award is given to reviewers who have made an outstanding contribution to the journal in terms of the quantity, quality, and turnaround time of reviews completed during the past 12 months. The prize includes a Wall Plaque, 50 free downloads from the ASME Digital Collection, and a one year free subscription to the journal.T. AnH. BaiM. BudakliF. CheJ. ChenT. ChenH. ChengT. ChiuM. ChowdhuryO. DalvernyB. DogruozC. GanR. GhaffarianD. Gonzalez CuadradoC. GreenP. GromalaM. GuptaY. HuangD. HuitinkT. IkedaC. KapustaB. KellyC. KhorH. LeeD. LiuA. MianK. MysoreD. NarasimhanJ. NiG. OnushkinD. PahinkarD. PantusoS. ParupalliG. PavlidisD. Ramos AlvaradoD. RaoM. ShihA. SinghJ. TsaiA. UdupaA. UsmanM. Van DijkW. Van DrielM. Van SoestbergenG. WangR. WarzohaJ. XuJ. YangM. Yazdan MehrA. YeoD. YuC. YuanZ. ZhangS. ZhaoQ. Zheng","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":null,"pages":null},"PeriodicalIF":2.2000,"publicationDate":"2023-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Reviewer's Recognition\",\"authors\":\"\",\"doi\":\"10.1115/1.4056725\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The Reviewers of the Year Award is given to reviewers who have made an outstanding contribution to the journal in terms of the quantity, quality, and turnaround time of reviews completed during the past 12 months. The prize includes a Wall Plaque, 50 free downloads from the ASME Digital Collection, and a one year free subscription to the journal.T. AnH. BaiM. BudakliF. CheJ. ChenT. ChenH. ChengT. ChiuM. ChowdhuryO. DalvernyB. DogruozC. GanR. GhaffarianD. Gonzalez CuadradoC. GreenP. GromalaM. GuptaY. HuangD. HuitinkT. IkedaC. KapustaB. KellyC. KhorH. LeeD. LiuA. MianK. MysoreD. NarasimhanJ. NiG. OnushkinD. PahinkarD. PantusoS. ParupalliG. PavlidisD. Ramos AlvaradoD. RaoM. ShihA. SinghJ. TsaiA. UdupaA. UsmanM. Van DijkW. Van DrielM. Van SoestbergenG. WangR. WarzohaJ. XuJ. YangM. Yazdan MehrA. YeoD. YuC. YuanZ. ZhangS. ZhaoQ. Zheng\",\"PeriodicalId\":15663,\"journal\":{\"name\":\"Journal of Electronic Packaging\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":2.2000,\"publicationDate\":\"2023-02-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1115/1.4056725\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1115/1.4056725","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}

引用次数: 0

摘要

年度审稿人奖颁发给在过去12个月内完成的审稿数量、质量和周转时间方面对期刊做出杰出贡献的审稿人。奖品包括一块墙上的牌匾，50个免费下载的ASME数字合集，以及一年的免费订阅。无水的。拜姆。BudakliF。CheJ。ChenT。ChenH。ChengT。ChiuM。ChowdhuryO。DalvernyB。DogruozC。GanR。GhaffarianD。冈萨雷斯CuadradoC。GreenP。GromalaM。GuptaY。HuangD。HuitinkT。IkedaC。KapustaB。KellyC。KhorH。LeeD。LiuA。MianK。迈索尔。NarasimhanJ。国家行业集团公司。OnushkinD。PahinkarD。PantusoS。ParupalliG。PavlidisD。拉莫斯AlvaradoD。RaoM。ShihA。SinghJ。TsaiA。UdupaA。UsmanM。范DijkW。范DrielM。范SoestbergenG。WangR。WarzohaJ。XuJ。YangM。Yazdan用。YeoD。YuC。YuanZ。丈。ZhaoQ。郑

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Reviewer's Recognition

The Reviewers of the Year Award is given to reviewers who have made an outstanding contribution to the journal in terms of the quantity, quality, and turnaround time of reviews completed during the past 12 months. The prize includes a Wall Plaque, 50 free downloads from the ASME Digital Collection, and a one year free subscription to the journal.T. AnH. BaiM. BudakliF. CheJ. ChenT. ChenH. ChengT. ChiuM. ChowdhuryO. DalvernyB. DogruozC. GanR. GhaffarianD. Gonzalez CuadradoC. GreenP. GromalaM. GuptaY. HuangD. HuitinkT. IkedaC. KapustaB. KellyC. KhorH. LeeD. LiuA. MianK. MysoreD. NarasimhanJ. NiG. OnushkinD. PahinkarD. PantusoS. ParupalliG. PavlidisD. Ramos AlvaradoD. RaoM. ShihA. SinghJ. TsaiA. UdupaA. UsmanM. Van DijkW. Van DrielM. Van SoestbergenG. WangR. WarzohaJ. XuJ. YangM. Yazdan MehrA. YeoD. YuC. YuanZ. ZhangS. ZhaoQ. Zheng

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来源期刊

Journal of Electronic Packaging 工程技术-工程：电子与电气

CiteScore

4.90

自引率

6.20%

发文量

审稿时长

3 months

期刊介绍： The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.