2014 19th IEEE European Test Symposium (ETS)最新文献

筛选
英文 中文
A new efficiency criterion for security oriented error correcting codes 一种新的面向安全的纠错码效率准则
2014 19th IEEE European Test Symposium (ETS) Pub Date : 2014-05-26 DOI: 10.1109/ETS.2014.6847800
Yaara Neumeier, O. Keren
{"title":"A new efficiency criterion for security oriented error correcting codes","authors":"Yaara Neumeier, O. Keren","doi":"10.1109/ETS.2014.6847800","DOIUrl":"https://doi.org/10.1109/ETS.2014.6847800","url":null,"abstract":"Security oriented codes are considered as one of the most efficient countermeasures against fault injection attacks. Their efficiency is usually measured in terms of their error masking probability. This criterion is applicable in cases where it is possible to distinguish between random errors and malicious attacks. In practice, if the induced errors are not fixed for several clock cycles, it is difficult to distinguish between the two. Moreover, a decoder that tries to correct the tampered word can conceal the fact that the device is under attack. This paper defines a new criterion, named t-robustness, for evaluating the efficiency of robust codes that provide both reliability and security. An error correcting code is called t-robust, if it can correct up to t errors and at the same time detect any attack that changes the data. The paper presents a general structure for concatenated codes that have this property.","PeriodicalId":145416,"journal":{"name":"2014 19th IEEE European Test Symposium (ETS)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114677451","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
A distance-based test cube merging procedure for compatible and incompatible test cubes 兼容和不兼容测试多维数据集的基于距离的测试多维数据集合并过程
2014 19th IEEE European Test Symposium (ETS) Pub Date : 2014-05-26 DOI: 10.1109/ETS.2014.6847824
I. Pomeranz
{"title":"A distance-based test cube merging procedure for compatible and incompatible test cubes","authors":"I. Pomeranz","doi":"10.1109/ETS.2014.6847824","DOIUrl":"https://doi.org/10.1109/ETS.2014.6847824","url":null,"abstract":"Test compaction can be achieved by generating incompletely-specified tests (test cubes) and merging test cubes that are compatible. A test cube that is generated for one target fault specifies values that are needed for detecting only this fault. Compatible test cubes do not conflict in any of their specified values. When compatible test cubes ci0 and ci1 are merged, they yield a single test cube, ci0 +ci1 which detects all the faults that are detected by ci0 and ci1 individually. In addition, ci0 +ci1 may detect other faults. Thus, merging of test cubes yields test cubes that detect more faults, contributing to test compaction. After test cube merging, unnecessary test cubes may exist in the test set. Such test cubes can be identified by fault simulation followed by reverse order fault simulation.","PeriodicalId":145416,"journal":{"name":"2014 19th IEEE European Test Symposium (ETS)","volume":"46 30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129446086","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Fault injection and fault tolerance methodologies for assessing device robustness and mitigating against ionizing radiation 评估设备稳健性和减轻电离辐射的故障注入和容错方法
2014 19th IEEE European Test Symposium (ETS) Pub Date : 2014-05-26 DOI: 10.1109/ETS.2014.6847812
D. Alexandrescu, L. Sterpone, C. López-Ongil
{"title":"Fault injection and fault tolerance methodologies for assessing device robustness and mitigating against ionizing radiation","authors":"D. Alexandrescu, L. Sterpone, C. López-Ongil","doi":"10.1109/ETS.2014.6847812","DOIUrl":"https://doi.org/10.1109/ETS.2014.6847812","url":null,"abstract":"Traditionally, heavy ion radiation effects affecting digital systems working in safety critical application systems has been of huge interest. Nowadays, due to the shrinking technology process, Integrated Circuits became sensitive also to other kinds of radiation particles such as neutron that can exist at the earth surface and affects ground-level safety critical applications such as automotive or medical systems. The process of analyzing and hardening digital devices against soft errors implies rising the final cost due to time expensive fault injection campaigns and radiation tests, as well as reducing system performance due to the insertion of redundancy-based mitigation solutions. The main industrial problem arising is the localization of the critical elements in the circuit in order to apply optimal mitigation techniques. The proposal of this tutorial is to present and discuss different solutions currently available for assessing and implementing the fault tolerance of digital circuits, not only when the unique design description is provided but also at the component level, especially when Commercial-of-the-shelf (COTS) devices are selected.","PeriodicalId":145416,"journal":{"name":"2014 19th IEEE European Test Symposium (ETS)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128409067","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 12
Towards a general purpose mixed-signal instrumentation layer in the die stack of a 3D-SIC 3D-SIC芯片堆叠中通用混合信号仪表层的研究
2014 19th IEEE European Test Symposium (ETS) Pub Date : 2014-05-26 DOI: 10.1109/ETS.2014.6847832
Shudong Lin, G. Roberts
{"title":"Towards a general purpose mixed-signal instrumentation layer in the die stack of a 3D-SIC","authors":"Shudong Lin, G. Roberts","doi":"10.1109/ETS.2014.6847832","DOIUrl":"https://doi.org/10.1109/ETS.2014.6847832","url":null,"abstract":"This paper proposes the use of an instrumentation layer in the die stack of a 3D-stacked IC for making precision on-chip measurements for silicon debug, device ramp-up and calibration purposes. As the instrumentation die communicates with the IC stack via the 1149.4 test bus, it can be removed from the stack to reduce the overall cost of the IC when in full production mode. Design effort on a full suite of analog instruments can be performed once and shared between different IC implementations, thereby reducing development costs. The initial focus of this work is on the development of a set of instruments that will be used to characterize the through-silicon via(s) (TSVs) of a 3D-CMOS process. Circuit details related to the design of a 3D-SIC using the Tezzaron 2-Tier 130 nm CMOS process are outlined.","PeriodicalId":145416,"journal":{"name":"2014 19th IEEE European Test Symposium (ETS)","volume":"2014 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130037833","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Improving polynomial datapath debugging with HEDs 改进用赫德调试多项式数据路径
2014 19th IEEE European Test Symposium (ETS) Pub Date : 2014-05-26 DOI: 10.1109/ETS.2014.6847797
Somayeh Sadeghi Kohan, Payman Behnam, B. Alizadeh, M. Fujita, Z. Navabi
{"title":"Improving polynomial datapath debugging with HEDs","authors":"Somayeh Sadeghi Kohan, Payman Behnam, B. Alizadeh, M. Fujita, Z. Navabi","doi":"10.1109/ETS.2014.6847797","DOIUrl":"https://doi.org/10.1109/ETS.2014.6847797","url":null,"abstract":"In this paper, we introduce a formal and scalable debugging approach to derive a reduced ordered set of design error candidates in polynomial datapath designs. To make our debugging method scalable for large designs, we utilize a Modular Horner Expansion Diagram (M-HED), which has been shown to be a scalable high level decision model. In our method, we extract data dependency graphs from the polynomial datapath designs using static slicing. Then we combine backward and forward path tracing to extract a reduced set of error candidates. In order to increase the accuracy of the method in the presence of multiple design errors, we rank the error candidates in decreasing order of their probability of being an error using a proposed priority criterion. In order to evaluate the effectiveness of our method, we have applied it to several large designs. The experimental results show that the proposed method enables us to locate even multiple errors with high accuracy in a short run time.","PeriodicalId":145416,"journal":{"name":"2014 19th IEEE European Test Symposium (ETS)","volume":"2014 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128110362","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
INL systematic reduced-test technique for Pipeline ADCs 流水线adc系统简化测试技术
2014 19th IEEE European Test Symposium (ETS) Pub Date : 2014-05-26 DOI: 10.1109/ETS.2014.6847818
E. Peralías, A. Ginés, A. Rueda
{"title":"INL systematic reduced-test technique for Pipeline ADCs","authors":"E. Peralías, A. Ginés, A. Rueda","doi":"10.1109/ETS.2014.6847818","DOIUrl":"https://doi.org/10.1109/ETS.2014.6847818","url":null,"abstract":"This paper presents a procedure to implement a high efficient test of the Integral Non-linearity (INL) of Pipeline ADCs using an extremely reduced set of test input amplitude levels (one order of magnitude lower than the total number of codes in the ADC). For a given architecture, the method provides the way to determine these levels to robustly capture the nonlinearity information. The location of each test level within the input range has low sensitivity to the internal ADC noise, and therefore, they are a good basis to continuously monitor the impact of process, aging and environment conditions variations (PVT) on the non-linearity, as well as miscalibration and possible failures in both foreground and background applications. The proposed method has been validated by realistic behavioral models in several examples.","PeriodicalId":145416,"journal":{"name":"2014 19th IEEE European Test Symposium (ETS)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124958538","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 10
Variation-aware deterministic ATPG 变化感知确定性ATPG
2014 19th IEEE European Test Symposium (ETS) Pub Date : 2014-05-26 DOI: 10.1109/ETS.2014.6847806
M. Sauer, I. Polian, M. Imhof, A. Mumtaz, E. Schneider, A. Czutro, H. Wunderlich, B. Becker
{"title":"Variation-aware deterministic ATPG","authors":"M. Sauer, I. Polian, M. Imhof, A. Mumtaz, E. Schneider, A. Czutro, H. Wunderlich, B. Becker","doi":"10.1109/ETS.2014.6847806","DOIUrl":"https://doi.org/10.1109/ETS.2014.6847806","url":null,"abstract":"In technologies affected by variability, the detection status of a small-delay fault may vary among manufactured circuit instances. The same fault may be detected, missed or provably undetectable in different circuit instances. We introduce the first complete flow to accurately evaluate and systematically maximize the test quality under variability. As the number of possible circuit instances is infinite, we employ statistical analysis to obtain a test set that achieves a fault-efficiency target with an user-defined confidence level. The algorithm combines a classical path-oriented test-generation procedure with a novel waveform-accurate engine that can formally prove that a small-delay fault is not detectable and does not count towards fault efficiency. Extensive simulation results demonstrate the performance of the generated test sets for industrial circuits affected by uncorrelated and correlated variations.","PeriodicalId":145416,"journal":{"name":"2014 19th IEEE European Test Symposium (ETS)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122058241","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 17
Triple error detection for Imai-Kamiyanagi codes based on subsyndrome computations 基于子群计算的Imai-Kamiyanagi码三重错误检测
2014 19th IEEE European Test Symposium (ETS) Pub Date : 2014-05-26 DOI: 10.1109/ETS.2014.6847840
Christian Badack, M. Gössel
{"title":"Triple error detection for Imai-Kamiyanagi codes based on subsyndrome computations","authors":"Christian Badack, M. Gössel","doi":"10.1109/ETS.2014.6847840","DOIUrl":"https://doi.org/10.1109/ETS.2014.6847840","url":null,"abstract":"Imai-Kamiyanagi codes are a class of linear double error correcting (DEC) codes suitable for fast parallel error correction. The parity-check matrix H' of these codes is composed of submatrices based on BCH codes of small codeword length. To reduce the complexity of the decoder, the embedded BCH codes are used for error correction. To improve the applicability of Imai-Kamiyanagi codes, in this paper it is shown how triple error detection can be efficiently implemented using the small subsyndromes determined by the submatrices of H'.","PeriodicalId":145416,"journal":{"name":"2014 19th IEEE European Test Symposium (ETS)","volume":"101 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117256721","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Quantified contribution of design for manufacturing to yield at 28nm 量化设计对28nm制程产率的贡献
2014 19th IEEE European Test Symposium (ETS) Pub Date : 2014-05-26 DOI: 10.1109/ETS.2014.6847815
T. Herrmann, S. Malik, S. Madhavan
{"title":"Quantified contribution of design for manufacturing to yield at 28nm","authors":"T. Herrmann, S. Malik, S. Madhavan","doi":"10.1109/ETS.2014.6847815","DOIUrl":"https://doi.org/10.1109/ETS.2014.6847815","url":null,"abstract":"Yield is the single most important criterion which drives the economics of our industry, impacting the bottom line directly. It is a well understood fact that both foundries and fabless companies have an extremely strong interest in achieving high yield as quickly as possible to meet the economies of scale and rapid time to market. At the 28nm node and below, implementation of DFM is believed to be particularly critical to enable a fast yield ramp. Quantification of the yield impact of various DFM enhancements is crucial to drive the appropriate design tradeoffs. In this paper we present an analysis of yield impact of DFM features over the duration of technology and product yield ramp for the 28nm node. Yield has inherent variation due to nature of its dependency on multiple factors and stages which makes it difficult to attribute yield signal to a small action in a long chain of event, from design to fabrication, leading to successful yield. We created a set of designs in 28nm, with and without DFM, where DFM changes were done only opportunistically. After finishing these designs, both the unmodified and the DFM enhanced layouts were placed side by side on the test chip reticles. Both instances got tested over long time for yield evaluation on silicon to create enormous amount of data which we analyzed and present in this paper. For analysis of all this data, we compare different statistical methods to understand the same and present challenges faced using these methods. We conclude with successful application of Matched Pair statistical method that quantified yield sensitivity to the DFM design changes.","PeriodicalId":145416,"journal":{"name":"2014 19th IEEE European Test Symposium (ETS)","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116128452","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Optimization-based multiple target test generation for highly compacted test sets 基于优化的高度压缩测试集的多目标测试生成
2014 19th IEEE European Test Symposium (ETS) Pub Date : 2014-05-26 DOI: 10.1109/ETS.2014.6847807
Stephan Eggersglüß, K. Schmitz, Rene Krenz-Baath, R. Drechsler
{"title":"Optimization-based multiple target test generation for highly compacted test sets","authors":"Stephan Eggersglüß, K. Schmitz, Rene Krenz-Baath, R. Drechsler","doi":"10.1109/ETS.2014.6847807","DOIUrl":"https://doi.org/10.1109/ETS.2014.6847807","url":null,"abstract":"Test compaction is an important aspect in the postproduction test since it is able to reduce the test data and the test costs, respectively. Current ATPG methods treat all faults independently from each other which limits the test compaction capability. This paper proposes a new optimization based SAT-ATPG for compact test set generation. Robust solving algorithms are leveraged to determine fault groups which can be detected by the same test. The proposed technique can be used during initial compact test generation as well as a post-process to increase the compactness of existing test sets, e.g, generated by commercial tools, in an iterative manner. Experimental results on industrial circuits and academic benchmarks show that this technique is able to significantly reduce the pattern count down to 40% for the initial test generation and down to 30% for the iterative reduction.","PeriodicalId":145416,"journal":{"name":"2014 19th IEEE European Test Symposium (ETS)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115625135","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 24
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信