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2020 27th International Conference on Mixed Design of Integrated Circuits and System (MIXDES)最新文献

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Thermal Characterization of Electronic Components Using Single-detector IR Measurement and 3D Heat Transfer Modelling 使用单探测器红外测量和三维传热建模的电子元件热表征
2020 27th International Conference on Mixed Design of Integrated Circuits and System (MIXDES) Pub Date : 2020-06-01 DOI: 10.23919/MIXDES49814.2020.9155993
M. Kopeć, B. Więcek
{"title":"Thermal Characterization of Electronic Components Using Single-detector IR Measurement and 3D Heat Transfer Modelling","authors":"M. Kopeć, B. Więcek","doi":"10.23919/MIXDES49814.2020.9155993","DOIUrl":"https://doi.org/10.23919/MIXDES49814.2020.9155993","url":null,"abstract":"A novel methodology of thermal impedance measurement by temperature monitoring out of the heat source in a power transistor is presented. A low-cost Infra-Red (IR) head is used to register evolution of temperature after step-function powering. A dedicated power generator has been developed to synchronize temperature recording with power dissipation in a device. Estimation of temperature in the heat source is performed by 3D FEM modelling of multilayer transistor structure. It allows fitting the measurement and simulation results to achieve the classically-defined thermal impedance in the heat source.","PeriodicalId":145224,"journal":{"name":"2020 27th International Conference on Mixed Design of Integrated Circuits and System (MIXDES)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121516872","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Analysis and Modelling of ICs and Microsystems 集成电路和微系统的分析与建模
2020 27th International Conference on Mixed Design of Integrated Circuits and System (MIXDES) Pub Date : 2020-06-01 DOI: 10.23919/mixdes49814.2020.9155966
{"title":"Analysis and Modelling of ICs and Microsystems","authors":"","doi":"10.23919/mixdes49814.2020.9155966","DOIUrl":"https://doi.org/10.23919/mixdes49814.2020.9155966","url":null,"abstract":"","PeriodicalId":145224,"journal":{"name":"2020 27th International Conference on Mixed Design of Integrated Circuits and System (MIXDES)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121667913","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
The Application of NIR Spectrometer for Average Temperature Measurement in Optical Fibers Based on Spontaneous Raman Scattering for DTS Applications 基于自发拉曼散射的近红外光谱仪在DTS光纤平均温度测量中的应用
2020 27th International Conference on Mixed Design of Integrated Circuits and System (MIXDES) Pub Date : 2020-06-01 DOI: 10.23919/MIXDES49814.2020.9155569
I. Shatarah, B. Więcek
{"title":"The Application of NIR Spectrometer for Average Temperature Measurement in Optical Fibers Based on Spontaneous Raman Scattering for DTS Applications","authors":"I. Shatarah, B. Więcek","doi":"10.23919/MIXDES49814.2020.9155569","DOIUrl":"https://doi.org/10.23919/MIXDES49814.2020.9155569","url":null,"abstract":"Continuously excited Raman scattering in optical fibers is proposed for temperature remote sensing in a Distributed Temperature Sensing (DTS) system. Such an approach is suitable for average temperature measurements over the entire optical fiber or in the chosen set points. The system is operating at 1550 nm to achieve long distance temperature applications. This paper proposes the use of sensitive NIR spectrometer instead on WDM splitter. It allows controlling and choosing the appropriate wavelength of the Raman Anti-Stokes and Raman Stokes backscattered radiation. Moreover, two different types of optical fibers were tested in order to verify the DTS system capabilities, and to present the different impact of temperature upon different optical fibers types. The obtained results were satisfying and promising.","PeriodicalId":145224,"journal":{"name":"2020 27th International Conference on Mixed Design of Integrated Circuits and System (MIXDES)","volume":"44 19","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120816788","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
A Capacitive Feedback 80 dBΩ 1.1 GHz CMOS Transimpedance Amplifier with Improved Biasing 一种改进偏置的电容反馈80 dBΩ 1.1 GHz CMOS跨阻放大器
2020 27th International Conference on Mixed Design of Integrated Circuits and System (MIXDES) Pub Date : 2020-06-01 DOI: 10.23919/MIXDES49814.2020.9155724
A. Romanova, V. Barzdenas
{"title":"A Capacitive Feedback 80 dBΩ 1.1 GHz CMOS Transimpedance Amplifier with Improved Biasing","authors":"A. Romanova, V. Barzdenas","doi":"10.23919/MIXDES49814.2020.9155724","DOIUrl":"https://doi.org/10.23919/MIXDES49814.2020.9155724","url":null,"abstract":"The work presents the design of an area-efficient low-noise high-performance CMOS transimpedance amplifier for optical time-domain reflectometers. The proposed solution is based on a low-noise capacitive feedback structure and shows a gain of 83/80 dBΩ with the bandwidth reaching 1.1 GHz and average input-referred noise current density below $1.8 mathrm{pA}/sqrt{mathrm{Hz}}$ in the presence of a 0.7 pF total input capacitance. The noise-efficient feedback structure allows addressing noise problem of conventional feed-forward or resistive feedback devices with the total power consumption around 21 mW while running at 1.8 V power supply. A more accurate design methodology is proposed based on explicit modeling of the biasing circuits and decoupling capacitor and modifications to the reference design are suggested including circuits for PMOS-based biasing and DC current elimination.","PeriodicalId":145224,"journal":{"name":"2020 27th International Conference on Mixed Design of Integrated Circuits and System (MIXDES)","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127642473","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
International programme committee 国际项目委员会
2020 27th International Conference on Mixed Design of Integrated Circuits and System (MIXDES) Pub Date : 2020-06-01 DOI: 10.1109/CCGRID.2005.1558522
T. Krishnamurti
{"title":"International programme committee","authors":"T. Krishnamurti","doi":"10.1109/CCGRID.2005.1558522","DOIUrl":"https://doi.org/10.1109/CCGRID.2005.1558522","url":null,"abstract":"For realistic image synthesis, simulating complex environments in all detail can lead to prohibitive rendering costs. In visual analytics, large-scale datasets pose significant challenges for analysis","PeriodicalId":145224,"journal":{"name":"2020 27th International Conference on Mixed Design of Integrated Circuits and System (MIXDES)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130429069","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Challenges in Performance Improvement of Silicon Systems on Chip in Advanced Nanoelectronics Technology Nodes 先进纳米电子技术节点中硅片系统性能改进的挑战
2020 27th International Conference on Mixed Design of Integrated Circuits and System (MIXDES) Pub Date : 2020-06-01 DOI: 10.23919/MIXDES49814.2020.9155752
A. Malinowski, S. Mishra
{"title":"Challenges in Performance Improvement of Silicon Systems on Chip in Advanced Nanoelectronics Technology Nodes","authors":"A. Malinowski, S. Mishra","doi":"10.23919/MIXDES49814.2020.9155752","DOIUrl":"https://doi.org/10.23919/MIXDES49814.2020.9155752","url":null,"abstract":"Speed or clock rate of the first microprocessor released to the market in 1971 was 740 kHz. This microprocessor was intended for calculator application. Continuing increase of microprocessor speed and computing power led to explosion of numerous applications. Five decades later microprocessors speed reached 5 GHz and they have enough computing power leading to such wonders as an artificial intelligence, virtual reality and self-driving autonomous cars which were before only in a science fiction domain. However, an increase of a chip speed is very challenging and it comes with high price. The most straightforward chip speed improvement based on transistor physical dimensions scaling eventually ran out of steam. This led to stress (1990s) followed by strain (2000s) techniques development. When this became insufficient new device structure, FinFET, has been introduced into main stream manufacturing in 2011. However, similarly to the previous approaches, increasing computing power of microprocessors based on FinFET is running now out of steam due to difficult technological barriers and integration challenges. Difficulties and challenges outlined in this paper may end era of microprocessor computing power improvement based on classical silicon technology.","PeriodicalId":145224,"journal":{"name":"2020 27th International Conference on Mixed Design of Integrated Circuits and System (MIXDES)","volume":"125 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132579073","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Comparative Analysis of Power Consumption of Parallel Prefix Adders 并行前缀加法器的功耗比较分析
2020 27th International Conference on Mixed Design of Integrated Circuits and System (MIXDES) Pub Date : 2020-06-01 DOI: 10.23919/MIXDES49814.2020.9155632
I. Brzozowski
{"title":"Comparative Analysis of Power Consumption of Parallel Prefix Adders","authors":"I. Brzozowski","doi":"10.23919/MIXDES49814.2020.9155632","DOIUrl":"https://doi.org/10.23919/MIXDES49814.2020.9155632","url":null,"abstract":"This paper presents results and conclusions derived from simulations of tens structures of Parallel Prefix Adders considering over a dozen activity scenarios of input vector changes. Based on extended power model of static CMOS gates accurate analysis is done, thanks to the fact, that the model take into consideration changes of input vectors, not only switching activity of signals. Various structures of PG tree have been examined: regular, non-regular, with grey cells only, with both grey and black and with higher valency cells. Obtained results shows that some structures are better for some kind of summed data, but general remarks for adders design can be derived.","PeriodicalId":145224,"journal":{"name":"2020 27th International Conference on Mixed Design of Integrated Circuits and System (MIXDES)","volume":"65 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131651429","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Sensor Fusion Algorithm Implementation on Microchip PIC Microcontroller 传感器融合算法在微芯片PIC单片机上的实现
2020 27th International Conference on Mixed Design of Integrated Circuits and System (MIXDES) Pub Date : 2020-06-01 DOI: 10.23919/MIXDES49814.2020.9155841
Sergio Salas Arriarán, C. Valdez, Kalun Lau, M. Amini, M. Kropidłowski, P. Sniatala
{"title":"Sensor Fusion Algorithm Implementation on Microchip PIC Microcontroller","authors":"Sergio Salas Arriarán, C. Valdez, Kalun Lau, M. Amini, M. Kropidłowski, P. Sniatala","doi":"10.23919/MIXDES49814.2020.9155841","DOIUrl":"https://doi.org/10.23919/MIXDES49814.2020.9155841","url":null,"abstract":"The paper describes an implementation of a Brooks-Iyengar algorithm on the Microchip PIC18F4550 platform. The circuit is considered as a testing platform to check the algorithm concept simulated in MATLAB before the final implementation as ASIC IP core. The results confirm the correctness of the proposed approach, which will be used in the final IP Core design.","PeriodicalId":145224,"journal":{"name":"2020 27th International Conference on Mixed Design of Integrated Circuits and System (MIXDES)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123808485","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
An Influence of the Operation Mode of a LED Lamp of the HUE Type on Its Electrical and Optical Parameters 色相型LED灯工作方式对其电学和光学参数的影响
2020 27th International Conference on Mixed Design of Integrated Circuits and System (MIXDES) Pub Date : 2020-06-01 DOI: 10.23919/MIXDES49814.2020.9155923
Przemysław Ptak, K. Górecki, Jakub Heleniak
{"title":"An Influence of the Operation Mode of a LED Lamp of the HUE Type on Its Electrical and Optical Parameters","authors":"Przemysław Ptak, K. Górecki, Jakub Heleniak","doi":"10.23919/MIXDES49814.2020.9155923","DOIUrl":"https://doi.org/10.23919/MIXDES49814.2020.9155923","url":null,"abstract":"In the paper electrical and optical properties of a LED lamp of the HUE type are analysed. This lamp has a possibility to remote control the mode of its operation. Properties of this class of lamps given by the producer was characterised and the measuring set-up to measure electrical and optical parameters of the considered lamps are proposed. The obtained results of measurements of the investigated lamps emitting light of different colours are shown and discussed. Attention was paid on parameters characterising influence of the LED lamp on the electroenergy network. Additionally, influence of feeding voltage, the fixed value of illuminance and colour of the emitted light on THD and PF parameters is analysed and discussed.","PeriodicalId":145224,"journal":{"name":"2020 27th International Conference on Mixed Design of Integrated Circuits and System (MIXDES)","volume":"80 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128385581","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Proceedings of 27th International Conference 第27届国际会议论文集
2020 27th International Conference on Mixed Design of Integrated Circuits and System (MIXDES) Pub Date : 2020-06-01 DOI: 10.23919/mixdes49814.2020.9155800
{"title":"Proceedings of 27th International Conference","authors":"","doi":"10.23919/mixdes49814.2020.9155800","DOIUrl":"https://doi.org/10.23919/mixdes49814.2020.9155800","url":null,"abstract":"","PeriodicalId":145224,"journal":{"name":"2020 27th International Conference on Mixed Design of Integrated Circuits and System (MIXDES)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128926546","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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