使用单探测器红外测量和三维传热建模的电子元件热表征

2020 27th International Conference on Mixed Design of Integrated Circuits and System (MIXDES) Pub Date : 2020-06-01 DOI:10.23919/MIXDES49814.2020.9155993

M. Kopeć, B. Więcek

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引用次数: 1

摘要

提出了一种基于功率晶体管热源外温度监测的热阻抗测量新方法。采用一种低成本的红外(IR)头来记录阶梯函数供电后的温度演变。研制了一种用于同步温度记录和器件功耗的专用发电机。利用多层晶体管结构的三维有限元模型对热源温度进行了估计。它允许拟合测量和仿真结果，以获得经典定义的热源热阻抗。

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Thermal Characterization of Electronic Components Using Single-detector IR Measurement and 3D Heat Transfer Modelling

A novel methodology of thermal impedance measurement by temperature monitoring out of the heat source in a power transistor is presented. A low-cost Infra-Red (IR) head is used to register evolution of temperature after step-function powering. A dedicated power generator has been developed to synchronize temperature recording with power dissipation in a device. Estimation of temperature in the heat source is performed by 3D FEM modelling of multilayer transistor structure. It allows fitting the measurement and simulation results to achieve the classically-defined thermal impedance in the heat source.

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来源期刊

2020 27th International Conference on Mixed Design of Integrated Circuits and System (MIXDES)

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