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2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)最新文献

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Investigating the activation energy of intermetallic layer growth in SAC305 and Innolot alloys SAC305和Innolot合金中金属间层生长活化能的研究
2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2017-10-01 DOI: 10.1109/SIITME.2017.8259860
O. Krammer, T. Hurtony, Áron Hadarits
{"title":"Investigating the activation energy of intermetallic layer growth in SAC305 and Innolot alloys","authors":"O. Krammer, T. Hurtony, Áron Hadarits","doi":"10.1109/SIITME.2017.8259860","DOIUrl":"https://doi.org/10.1109/SIITME.2017.8259860","url":null,"abstract":"In this paper, the activation energy of intermetallic layer growth was investigated for SAC305 (Sn/3Ag/0.5Cu) and Innolot (Sn/3.8Ag/0.7Cu/3Bi/1.5Sb/0.2Ni) lead-free solder alloys. A testboard was designed, which contained 50 pieces of 0603 size (1.5 × 0.75 mm) chip resistors. The solder paste was deposited by stencil printing, and the solder joints were formed with vapour phase soldering. The intermetallic layer growth was accelerated after soldering with HTSL (High Temperature Storage Life) testing at two different elevated temperatures; 100 and 150 °C. The HTSL testing was carried out for up to 1500 hours. In every 500 hours, samples were taken out from the test to measure the thickness of the intermetallic layer by analysing cross-sections with Scanning Electron Microscopy. It was found that the determined value of activation energy is influenced by the length of the HTSL testing. Since the uncertainty of the layer thickness measurements is higher at lower thicknesses (i.e. at the beginning of the HTSL testing), longer duration of testing (1500 hours at minimum) is recommended. Besides, the results showed that higher activation energy belongs to the layer growth in the Innolot alloy compared to the SAC305 alloy.","PeriodicalId":138347,"journal":{"name":"2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133984374","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Numerical investigation of channel dimension effects on the performance of a cross flow micro heat exchanger for chip cooling applications 通道尺寸对芯片冷却用交叉流微型换热器性能影响的数值研究
2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2017-10-01 DOI: 10.1109/SIITME.2017.8259877
V. Ionescu, A. Neagu
{"title":"Numerical investigation of channel dimension effects on the performance of a cross flow micro heat exchanger for chip cooling applications","authors":"V. Ionescu, A. Neagu","doi":"10.1109/SIITME.2017.8259877","DOIUrl":"https://doi.org/10.1109/SIITME.2017.8259877","url":null,"abstract":"In this paper, we developed a basic 3D numerical model for a cross-flow micro heat exchanger considering a crossflow module formed by two plates having 34 microchannels each for cold and hot fluid transfer. The simplified model implemented with Finite Element Method (FEM) based Comsol Multiphysics software doesn't take into accounts the flow maldistribution effects. The dynamic viscosity and density of water (the working fluid) are assumed to be different in different channels and also gradually increasing/decreasing along the heat exchange part of each channel. We considered in this study three different dimensions for the channel plates, having the depth b and width c at the values of: 100 and 200 μm, 125 and 160 μm, 80 and 250 μm. Fluid flow and heat transfer investigations for the models with different channel geometries revealed that the model with b = 125 gm and c = 160 gm presented the most compact temperature gradient along the hot and cold plate and the highest value for figure of merit (FoM) coefficient at the lowest values of friction factor for hot and cold channels, considering different laminar flow regimes with Reynolds number Re between 133 and 562.","PeriodicalId":138347,"journal":{"name":"2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"77 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125690266","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Electrical and thermal investigations on printed conductive paste used in solderless assembly for electronics technology 电子技术无焊装配用印刷导电浆料的电学和热学研究
2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2017-10-01 DOI: 10.1109/SIITME.2017.8259855
C. Ionescu, N. Codreanu, G. Vărzaru
{"title":"Electrical and thermal investigations on printed conductive paste used in solderless assembly for electronics technology","authors":"C. Ionescu, N. Codreanu, G. Vărzaru","doi":"10.1109/SIITME.2017.8259855","DOIUrl":"https://doi.org/10.1109/SIITME.2017.8259855","url":null,"abstract":"The paper is a follow-on of the study presented in [1] referred to the SAFE (Solderless Assembly for Electronics) process, widely known as the Occam process. [2]. One of the many key processes involved in SAFE is the additive process for realizing the conductive tracks, the interconnection structure of the electronic module. One possibility, beside the standard chemical metallization used in printed circuit boards (PCB) process, is the use of a polymer conductive paste with printing capabilities, especially developed for printed tracks [3]. In the paper there are presented quantitative investigations on the resistance and on the temperature behavior of the printed tracks, measured in climatic chamber at low current loads and also the current capabilities of the printed tracks at room temperature.","PeriodicalId":138347,"journal":{"name":"2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"61 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126281059","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 12
An RLS algorithm for the identification of bilinear forms 双线性形式识别的RLS算法
2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2017-10-01 DOI: 10.1109/SIITME.2017.8259910
Camelia Elisei-Iliescu, C. Paleologu, R. Dobre, S. Ciochină, J. Benesty
{"title":"An RLS algorithm for the identification of bilinear forms","authors":"Camelia Elisei-Iliescu, C. Paleologu, R. Dobre, S. Ciochină, J. Benesty","doi":"10.1109/SIITME.2017.8259910","DOIUrl":"https://doi.org/10.1109/SIITME.2017.8259910","url":null,"abstract":"Bilinear systems are involved in many interesting applications, especially related to the approximation of nonlinear systems. In this context, the bilinear term is usually defined in terms of an input-output relation (i.e., with respect to the data). Recently, a different approach has been introduced, by defining the bilinear term with respect to the impulse responses of a spatiotemporal model, which resembles a multiple-input/single-output (MISO) system. Also, in this framework, the Wiener filter has been involved to address the identification problem of these bilinear forms. Since the Wiener filter may not be always very efficient or convenient to use in practice, we propose in this paper an adaptive filtering approach based on the recursive least-squares (RLS) algorithm. Simulations performed in the context of system identification (based on the MISO system approach) indicate the appealing performance of this algorithm.","PeriodicalId":138347,"journal":{"name":"2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"10 2","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"113931695","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Fan vs. passive heat sink with heat pipe in cooling of high power LED 风扇与带热管的被动散热器在大功率LED散热中的对比
2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2017-10-01 DOI: 10.1109/SIITME.2017.8259911
N. Badalan, P. Svasta
{"title":"Fan vs. passive heat sink with heat pipe in cooling of high power LED","authors":"N. Badalan, P. Svasta","doi":"10.1109/SIITME.2017.8259911","DOIUrl":"https://doi.org/10.1109/SIITME.2017.8259911","url":null,"abstract":"LED light fittings are highly efficient. As a downside, due to the high power density, efficient cooling solutions are needed. This paper presents a comparison between a high-power COB (chip-on-board) LED light fitting that uses the passive cooling method with heat sink and heat pipe and one using the active cooling method with heat sink, fan and heat pipe. This paper discusses how fans, heat pipes and passive heat sinks can be combined to cool high power COB LEDs without significantly increasing the dimensions, mass and complexity of the fitting, and without significantly increasing its power consumption. Although the use of fans and heat pipes for LED cooling is not new, in this paper a comparison is made between the two methods in terms of fitting temperature, LED direct voltage, total power consumption as well as from the point of view of illumination.","PeriodicalId":138347,"journal":{"name":"2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131619034","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Real time, video quality monitoring application for digital television services 实时、视频质量监控应用于数字电视业务
2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2017-10-01 DOI: 10.1109/SIITME.2017.8259936
Ioan Tache
{"title":"Real time, video quality monitoring application for digital television services","authors":"Ioan Tache","doi":"10.1109/SIITME.2017.8259936","DOIUrl":"https://doi.org/10.1109/SIITME.2017.8259936","url":null,"abstract":"This paper presents a real-time video quality monitoring application that delivers 24/7 services to the satellite, terrestrial and cable digital television providers. The application monitors the Perceptual Video Quality (PVQ) score (on a scale between 1 to 5 like in the subjective tests), the viewers Quality of Experience score (not including the PVQ score) and the Quality of Service (QoS) parameters, so it can detect the cause of possible reduced image quality. Compared to other systems that can monitor the video quality only for one television program at a time, the proposed solution can simultaneously monitor the video quality on several television programs on different satellite transponders, terrestrial or cable television channels. The measurement test results are presented for satellite and terrestrial broadcasting services.","PeriodicalId":138347,"journal":{"name":"2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127564405","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Low-cost wireless sensor node with application in sports 低成本无线传感器节点在运动中的应用
2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2017-10-01 DOI: 10.1109/SIITME.2017.8259933
D. Sacaleanu, L. Perisoara, E. Spataru, R. Stoian
{"title":"Low-cost wireless sensor node with application in sports","authors":"D. Sacaleanu, L. Perisoara, E. Spataru, R. Stoian","doi":"10.1109/SIITME.2017.8259933","DOIUrl":"https://doi.org/10.1109/SIITME.2017.8259933","url":null,"abstract":"This paper presents the architecture and characteristics of a low-cost wireless sensor node within a Wireless Sensor Network (WSN). The wireless sensor node was specially designed and developed to comply with three main requirements: low cost, low energy consumption and adaptability to a wide range of applications in many domains. In order to test its functionality, the authors propose a new application in sports for testing and developing athletes' reflexes. The system includes a base station and four wireless nodes provided with buttons and visual and acoustic signals. The base station sends random messages to one node and measures the time from the node activation till the athlete presses the node button. The data are acquired and stored in a PC and, based on them, a complete characterization of the athletic abilities can be performed. The results obtained ensure the node applicability in multiple other areas.","PeriodicalId":138347,"journal":{"name":"2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134103768","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Compact SD card backup system for use in photography 用于摄影的紧凑SD卡备份系统
2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2017-10-01 DOI: 10.1109/SIITME.2017.8259878
R. Jano, A. Fodor, Adelina Ioana Ilieş
{"title":"Compact SD card backup system for use in photography","authors":"R. Jano, A. Fodor, Adelina Ioana Ilieş","doi":"10.1109/SIITME.2017.8259878","DOIUrl":"https://doi.org/10.1109/SIITME.2017.8259878","url":null,"abstract":"The following article presents a portable, compact, lightweight and easy-to-use SD card backup system. The main usage field of the device is amateur and professional photography, but can also be used in all fields where data corruption and data loss can cause significant problems. The presented system is able to easily backup the entire file system from a primary SD card to a secondary one or to a USB flash drive and yet it is no bigger and heavier than a standard matchbox.","PeriodicalId":138347,"journal":{"name":"2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123530344","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Dynamic PV array reconfiguration under suboptimal conditions in hybrid solar energy harvesting systems 混合太阳能收集系统中次优条件下的动态光伏阵列重构
2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2017-10-01 DOI: 10.1109/SIITME.2017.8259938
S. Bularka, A. Gontean
{"title":"Dynamic PV array reconfiguration under suboptimal conditions in hybrid solar energy harvesting systems","authors":"S. Bularka, A. Gontean","doi":"10.1109/SIITME.2017.8259938","DOIUrl":"https://doi.org/10.1109/SIITME.2017.8259938","url":null,"abstract":"Solar energy is the most popular renewable energy source, but solar energy harvesting suffers from a series of serious obstacles in effective utilisation. In case of suboptimal conditions such as partial shading of photovoltaic (PV) module, PV cell mismatch, early ageing and different fault conditions, the overall system efficiency and robustness are severely degraded. The use of bypass diode and maximum power point tracking (MPPT) techniques doesn't offer anymore a near optimal solution for the above-mentioned problems. In the past, reconfigurable PV arrays have been proposed with the possibility to interchange PV cells with spare cells. In this paper, the efficiency and robustness enhancement given by dynamic PV array reconfiguration is investigated in order to minimise the negative effects of suboptimal conditions and to offer the golden ratio in output energy in case of hybrid solar energy harvesting systems.","PeriodicalId":138347,"journal":{"name":"2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"17 2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122087650","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Web-based VR engine in electrical engineering: A proof of concept 电子工程中基于web的VR引擎:概念验证
2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2017-10-01 DOI: 10.1109/SIITME.2017.8259894
B. Evstatiev, K. Gabrovska-Evstatieva, T. Iliev, I. Stoyanov
{"title":"Web-based VR engine in electrical engineering: A proof of concept","authors":"B. Evstatiev, K. Gabrovska-Evstatieva, T. Iliev, I. Stoyanov","doi":"10.1109/SIITME.2017.8259894","DOIUrl":"https://doi.org/10.1109/SIITME.2017.8259894","url":null,"abstract":"In the present study an experimental proof of concept for implementation of a web-based virtual reality engine in electrical engineering has been performed. The main idea is that the engine should allow to easily create new virtual equipment using variables, operations and virtual components (buttons, switches, potentiometers, etc.). Several laboratory equipment have been implemented in the database of the engine and considering their complexity and variety we can conclude that the approach is feasible to virtualize most of the equipment used in electrical engineering education.","PeriodicalId":138347,"journal":{"name":"2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"84 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126209650","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
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