通道尺寸对芯片冷却用交叉流微型换热器性能影响的数值研究

V. Ionescu, A. Neagu
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引用次数: 0

摘要

在本文中,我们建立了一个基本的三维数值模型的交叉流微热交换器考虑交叉流模块组成的两个板,每个板有34个微通道的冷热流体传递。采用基于Comsol Multiphysics软件的有限元法实现的简化模型没有考虑流动不均匀效应。假设水(工质)的动态粘度和密度在不同的通道中是不同的,并且沿着每个通道的换热部分逐渐增加/减少。在本研究中,我们考虑了三种不同尺寸的通道板,其深度b和宽度c分别为:100和200 μm, 125和160 μm, 80和250 μm。对不同通道几何形状模型的流体流动和传热研究表明,考虑雷诺数Re在133 ~ 562之间的不同层流流型,b = 125 gm和c = 160 gm的模型沿冷热板的温度梯度最紧凑,冷热通道摩擦系数最小时的FoM系数最高。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Numerical investigation of channel dimension effects on the performance of a cross flow micro heat exchanger for chip cooling applications
In this paper, we developed a basic 3D numerical model for a cross-flow micro heat exchanger considering a crossflow module formed by two plates having 34 microchannels each for cold and hot fluid transfer. The simplified model implemented with Finite Element Method (FEM) based Comsol Multiphysics software doesn't take into accounts the flow maldistribution effects. The dynamic viscosity and density of water (the working fluid) are assumed to be different in different channels and also gradually increasing/decreasing along the heat exchange part of each channel. We considered in this study three different dimensions for the channel plates, having the depth b and width c at the values of: 100 and 200 μm, 125 and 160 μm, 80 and 250 μm. Fluid flow and heat transfer investigations for the models with different channel geometries revealed that the model with b = 125 gm and c = 160 gm presented the most compact temperature gradient along the hot and cold plate and the highest value for figure of merit (FoM) coefficient at the lowest values of friction factor for hot and cold channels, considering different laminar flow regimes with Reynolds number Re between 133 and 562.
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