IEEE SENSORS 2014 Proceedings最新文献

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Nanocrystalline p-TiO2 based MIS device for efficient acetone detection 基于纳米晶p-TiO2的高效丙酮检测MIS装置
IEEE SENSORS 2014 Proceedings Pub Date : 2014-12-15 DOI: 10.1109/ICSENS.2014.6984991
B. Bhowmik, A. Hazra, K. Dutta, P. Bhattacharyya
{"title":"Nanocrystalline p-TiO2 based MIS device for efficient acetone detection","authors":"B. Bhowmik, A. Hazra, K. Dutta, P. Bhattacharyya","doi":"10.1109/ICSENS.2014.6984991","DOIUrl":"https://doi.org/10.1109/ICSENS.2014.6984991","url":null,"abstract":"Present study investigated, the acetone sensing properties of Pd/TiO2/Si Metal Insulator Semiconductor (MIS) devices with nanocrystalline p-TiO2, with crystalline size ~8 nm as the sensing layer. p-TiO2 thin film was synthesized using sol-gel method. After details structural characterization by X-Ray Diffraction (XRD), Field Emission Scanning Electron Microscope (FESEM) and electrical characterization by Van Der Pauw method, the MIS structure was fabricated employing drop coated p-Si substrate. Pd was deposited, on TiO2, as noble metal catalytic electrode while Al was taken as ohmic contact electrode from Si. The sensor study was carried out at relatively lower operating temperatures (50-200°C) for the acetone concentrations of 0.5-50ppm. It was found that MIS devices showed fast response/recovery with appreciable response magnitude in the entire temperature range for all the concentration. The faster response/recovery of MIS devices has been analyzed through an electrical equivalent model including the effect of barrier height between grain boundaries (GBs) and hole trapping at GBs interfaces.","PeriodicalId":13244,"journal":{"name":"IEEE SENSORS 2014 Proceedings","volume":"4 1","pages":"293-296"},"PeriodicalIF":0.0,"publicationDate":"2014-12-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"87068041","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Human step detection from a piezoelectric polymer floor sensor using normalization algorithms 基于归一化算法的压电聚合物地板传感器人体步长检测
IEEE SENSORS 2014 Proceedings Pub Date : 2014-12-15 DOI: 10.1109/ICSENS.2014.6985216
Renan Serra, Pascal Di Croce, Richard Peres, D. Knittel
{"title":"Human step detection from a piezoelectric polymer floor sensor using normalization algorithms","authors":"Renan Serra, Pascal Di Croce, Richard Peres, D. Knittel","doi":"10.1109/ICSENS.2014.6985216","DOIUrl":"https://doi.org/10.1109/ICSENS.2014.6985216","url":null,"abstract":"Today, walking trajectory analysis or event detection gained a lot of interest in healthcare environments to prevent pathologies or gait deviations. However, to correctly study the gait of someone is difficult since it generally requires expensive systems that are difficult to implement. In the work presented herein, we propose another approach to retrieve information from a sensor area. As usual gait analysis systems comprise numerous sensors and provide spatial pressure resolution maps of footsteps over a small area; our system gives a signature generated by a single piezoelectric sensor only. The signal delivered by the sensor goes through a normalization calculation process giving a signal which can be compared to a reference signal. A Pearson product-moment correlation coefficient (PPMCC) is determined between the two signals giving a shape similarity indicator. We achieved similarity indicators greater than 95%. It is the first time that this correlation is applied in the field of human step detection.","PeriodicalId":13244,"journal":{"name":"IEEE SENSORS 2014 Proceedings","volume":"8 1","pages":"1169-1172"},"PeriodicalIF":0.0,"publicationDate":"2014-12-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89305428","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 10
Molecularly imprinted polypyrrole for the electrochemical detection of sulfadimethoxine: The effect of imprinting parameters 分子印迹聚吡咯电化学检测磺胺二甲氧嘧啶:印迹参数的影响
IEEE SENSORS 2014 Proceedings Pub Date : 2014-12-15 DOI: 10.1109/ICSENS.2014.6985384
E. Mazzotta, A. Turco, C. Malitesta, S. Corvaglia
{"title":"Molecularly imprinted polypyrrole for the electrochemical detection of sulfadimethoxine: The effect of imprinting parameters","authors":"E. Mazzotta, A. Turco, C. Malitesta, S. Corvaglia","doi":"10.1109/ICSENS.2014.6985384","DOIUrl":"https://doi.org/10.1109/ICSENS.2014.6985384","url":null,"abstract":"A novel, simple and cost-effective electrochemical sensor for sulfadimethoxine (SDM) based on molecularly imprinted overoxidized polypyrrole (PPy) is developed by exploiting an all electrochemical approach both for sensor fabrication and application consisting in molecularly imprinted polymer (MIP) electropolymerization/overoxidation and in SDM amperometric detection. Parameters influencing the imprinting effect are critically evaluated. A key role of the electrolyte used in electropolymerization is demonstrated to influence MIP sensing performances and its morphology, as highlighted by atomic force microscopy (AFM). MIP-template interaction is verified by IR spectroscopy. The effect of different overoxidation conditions in removing template is evaluated by analyzing MIP films before and after the treatment by X-Ray Photoelectron Spectroscopy (XPS) also evidencing the correlation between MIP chemical structure and its rebinding ability. Under the selected optimal conditions, MIP based sensor shows satisfactory performance in terms of sensitivity, limit of detection, reproducibility and selectivity.","PeriodicalId":13244,"journal":{"name":"IEEE SENSORS 2014 Proceedings","volume":"19 1","pages":"1835-1838"},"PeriodicalIF":0.0,"publicationDate":"2014-12-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88154849","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Semantic attacks on wireless medical devices 无线医疗设备的语义攻击
IEEE SENSORS 2014 Proceedings Pub Date : 2014-12-15 DOI: 10.1109/ICSENS.2014.6985040
Renchi Yan, T. Xu, M. Potkonjak
{"title":"Semantic attacks on wireless medical devices","authors":"Renchi Yan, T. Xu, M. Potkonjak","doi":"10.1109/ICSENS.2014.6985040","DOIUrl":"https://doi.org/10.1109/ICSENS.2014.6985040","url":null,"abstract":"Security of medical embedded systems is of vital importance. Wireless medical devices used in wireless health applications employ large number of sensors and are in particular susceptible to security attacks. They are often not physically secured and are usually used in hostile environments. We have developed theoretical and statistical framework for creating semantic attacks where data is altered in such a way that the consequences include incorrect medical diagnosis and treatment. Our approach maps a semantic attack to an instance of optimization problem where medical damage is maximized under constraints of the probability of detection and root cause tracing. We use a popular medical shoe to demonstrate that low energy and low cost of embedded medical devices increases the probability of successful attacks. We have proposed two types of semantic attacks, respectively pressure-based attack, and time-based attack under two scenarios, a shoe with 99 pressure sensors and a shoe with 20 pressure sensors. We test the effects of the attacks and compare them. Our results indicate that it is surprisingly easy to attack several essential medical metrics and to alter corresponding medical diagnosis.","PeriodicalId":13244,"journal":{"name":"IEEE SENSORS 2014 Proceedings","volume":"55 1","pages":"482-485"},"PeriodicalIF":0.0,"publicationDate":"2014-12-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83535788","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
Background calibrated MEMS gyroscope 背景校准的MEMS陀螺仪
IEEE SENSORS 2014 Proceedings Pub Date : 2014-12-15 DOI: 10.1109/ICSENS.2014.6985152
B. Eminoglu, M. Kline, I. Izyumin, Y. Yeh, B. Boser
{"title":"Background calibrated MEMS gyroscope","authors":"B. Eminoglu, M. Kline, I. Izyumin, Y. Yeh, B. Boser","doi":"10.1109/ICSENS.2014.6985152","DOIUrl":"https://doi.org/10.1109/ICSENS.2014.6985152","url":null,"abstract":"Background calibration is used to reduce three dominant error sources in MEMS gyroscopes over manufacturing variations, temperature, and aging. (1) Measuring the ratio of the change in the oscillation frequency to a calibration signal in the drive channel cancels scale factor errors and drift. (2) Tracking of the velocity-force phase relationship suppresses leakage of the quadrature error into the rate output. (3) Continuous monitoring of the drive signal is employed to reduce errors that are in-phase with the Coriolis signal including anisotropic damping and electrical feedthrough. In combination, the three error cancellation techniques reduce the Allan Variance of an experimental device from 6.6deg/hr to 1deg/hr at 400s averaging time and from 5.7deg/hr to 2deg/hr at 3200s. The temperature sensitivity of the bias decreases from 32mdeg/s/C to 8mdeg/s/C. Scale factor variations over 12 days are reduced from 547ppm p-p to 23ppm p-p, and temperature coefficient of the scale factor is reduced from 560ppm/C to 4ppm/C at room temperature.","PeriodicalId":13244,"journal":{"name":"IEEE SENSORS 2014 Proceedings","volume":"2016 1","pages":"922-925"},"PeriodicalIF":0.0,"publicationDate":"2014-12-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86486596","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 23
A rotational capacitive micromachined ultrasonic transducer (RCMUT) 一种旋转电容式微机械超声换能器(RCMUT)
IEEE SENSORS 2014 Proceedings Pub Date : 2014-12-15 DOI: 10.1109/ICSENS.2014.6985150
Donghwan Kim, M. Kuntzman, N. Hall
{"title":"A rotational capacitive micromachined ultrasonic transducer (RCMUT)","authors":"Donghwan Kim, M. Kuntzman, N. Hall","doi":"10.1109/ICSENS.2014.6985150","DOIUrl":"https://doi.org/10.1109/ICSENS.2014.6985150","url":null,"abstract":"An unconventional acoustic sensor is presented with audio and ultrasound applications. The structure is a synthesis of capacitive micromachined ultrasonic transducer (CMUT) technology and biologically inspired microphones which use rotational or rocking modes of vibration to directly sense acoustic pressure gradient. A pivoting beam structure is sealed under vacuum, and the top surface of the beam is driven into motion by external pressure gradients. Vvacuum sealing eliminates the introduction of excessive damping, stiffness, and thermal mechanical noise into the system. Motion of the beam is transduced capacitively at each end of the beam using gap-closing parallel plate electrodes. Surface-micromachined prototypes are presented that are 470 μm × 718 μm in size and exhibit a fundamental rocking resonance at 480 kHz, and a second flapping mode at 630 kHz, for which both ends of the beam vibrate in phase.","PeriodicalId":13244,"journal":{"name":"IEEE SENSORS 2014 Proceedings","volume":"108 1","pages":"915-917"},"PeriodicalIF":0.0,"publicationDate":"2014-12-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86715426","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
CMOS SC-spinning, current-feedback hall sensor for high speed and low cost applications 用于高速和低成本应用的CMOS sc旋转电流反馈霍尔传感器
IEEE SENSORS 2014 Proceedings Pub Date : 2014-12-15 DOI: 10.1109/ICSENS.2014.6985051
Tiger Chang, K. Juang
{"title":"CMOS SC-spinning, current-feedback hall sensor for high speed and low cost applications","authors":"Tiger Chang, K. Juang","doi":"10.1109/ICSENS.2014.6985051","DOIUrl":"https://doi.org/10.1109/ICSENS.2014.6985051","url":null,"abstract":"A low cost, high speed Hall sensor for motor application is presented. The Hall sensor, its signal conditioning amplifier, Hall plate and Hall biasing circuit are fully integrated in a single chip. The Hall device is a single plate configuration made by only standard mask process for low cost feature. The signal conditioning amplifier applied the noise shaping and offset filtering by chopping technique, also designed by current-feedback approach to broaden its operational speed. The Hall biasing circuit designed by proposed signal-chopped spinning current method (sc-spinning current) to combine spinning current and chopping signal into Hall biasing circuit, which ease feed-forward path design and decrease the poles in signal path. The Hall sensor has typical offset of 600 nV. The sensing speed can operate more than 400kHz operation bandwidth.","PeriodicalId":13244,"journal":{"name":"IEEE SENSORS 2014 Proceedings","volume":"1 1","pages":"527-530"},"PeriodicalIF":0.0,"publicationDate":"2014-12-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81234723","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
Fabrication of ultra-thin silicon stress sensor chips with high flexibility and high sensitivity 高柔性、高灵敏度超薄硅应力传感器芯片的研制
IEEE SENSORS 2014 Proceedings Pub Date : 2014-12-15 DOI: 10.1109/ICSENS.2014.6985241
Pai Zhao, Ning Deng, Zheyao Wang
{"title":"Fabrication of ultra-thin silicon stress sensor chips with high flexibility and high sensitivity","authors":"Pai Zhao, Ning Deng, Zheyao Wang","doi":"10.1109/ICSENS.2014.6985241","DOIUrl":"https://doi.org/10.1109/ICSENS.2014.6985241","url":null,"abstract":"We propose a method for fabrication of ultra-thin stress chips (UTSC) by dicing before thinning method on chip-scale level, discuss attributes of UTSC, and report their applications in bio-medical areas, including pulse monitoring and orthodontic force measurement. Using an edge protection method and a wafer transfer technology, silicon stress sensor chips with size of 2 mm× 2 mm fabricated using CMOS technology have been reconfigured as a virtual wafer and thinned from 350 μm to 35 μm. The thinned individual chips have been laminated with a flexible polyimide substrate and wire-bonded to the electric interconnects embedded in the polyimide substrate. Measurement results show that the sensitivity of the UTSC is about 70 times larger than that of metal strain gauge. The flexibility and the high sensitivity of the UTSC enable the measurement of human wrist pulse and orthodontic force in 1:1 teeth model. These preliminary results demonstrate a possible solution for sensor integration on flexible substrates using dicing before thinning.","PeriodicalId":13244,"journal":{"name":"IEEE SENSORS 2014 Proceedings","volume":"86 6 1","pages":"1268-1271"},"PeriodicalIF":0.0,"publicationDate":"2014-12-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"78601399","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Incident light angle detection technique using polarization pixels 基于偏振像素的入射光角检测技术
IEEE SENSORS 2014 Proceedings Pub Date : 2014-12-15 DOI: 10.1109/ICSENS.2014.6985468
Vigil Varghese, Shoushun Chen
{"title":"Incident light angle detection technique using polarization pixels","authors":"Vigil Varghese, Shoushun Chen","doi":"10.1109/ICSENS.2014.6985468","DOIUrl":"https://doi.org/10.1109/ICSENS.2014.6985468","url":null,"abstract":"In this paper we present the design and analysis of a CMOS image sensor pixel capable of detecting the angle of incident light. Determining the angle is of paramount importance in reconstructing the 3D information of the imaged scene. These pixels achieve this by including polarization gratings on top of the photodiodes in each pixel. Three different pixels, each with different grating orientation produce enough information to determine the local incidence angle. Because of the symmetric nature of the response for positive and negative angles, another set of pixels, called the linear quadrature pixel cluster has been included to break the symmetry and provide greater angle resolution.We present the simulation results as well as the design, which is targeted towards GlobalFoundries 65 nm CMOS mixed-signal process.","PeriodicalId":13244,"journal":{"name":"IEEE SENSORS 2014 Proceedings","volume":"37 1","pages":"2167-2170"},"PeriodicalIF":0.0,"publicationDate":"2014-12-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84086634","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Transient measurement method for the thermal properties of the thin-film membrane in a multi-parameter wind sensor 多参数风传感器中薄膜热性能的瞬态测量方法
IEEE SENSORS 2014 Proceedings Pub Date : 2014-12-15 DOI: 10.1109/ICSENS.2014.6985250
R. Beigelbeck, S. Cerimovic, F. Kohl, T. Voglhuber, B. Jakoby, D. Reyes-Romero, G. Urban
{"title":"Transient measurement method for the thermal properties of the thin-film membrane in a multi-parameter wind sensor","authors":"R. Beigelbeck, S. Cerimovic, F. Kohl, T. Voglhuber, B. Jakoby, D. Reyes-Romero, G. Urban","doi":"10.1109/ICSENS.2014.6985250","DOIUrl":"https://doi.org/10.1109/ICSENS.2014.6985250","url":null,"abstract":"The performance of our previously devised thermal multi-parameter wind sensor for gaseous fluids is noticeably influenced by the thermal heat shunt induced by the thin-film membrane where heating and temperature sensing elements are embedded. Consequently, reliable values for the thermal parameters of the thin-film membrane are mandatory for their design and characterization. We present a new method to determine the thermal conductivity, thermal diffusivity, and average spectral emissivity of the thin-film membrane. Compared to commonly used measurement techniques for these thermal thin-film parameters, our method does not require custom-built specimens, i. e., the results can be obtained from transient excess temperature measurements carried out directly on the wind sensor device. We describe the theoretical background of this method, provide an efficient analytical model for the data evaluation including its validation by computer numerical analyses, and showcase sample measurements on multi-layer SixNy-SiO2 thin films.","PeriodicalId":13244,"journal":{"name":"IEEE SENSORS 2014 Proceedings","volume":"25 1","pages":"1304-1307"},"PeriodicalIF":0.0,"publicationDate":"2014-12-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84513121","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
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