制造高密度可拉伸传感器阵列的后处理方法

A. Savov, S. K. Pakazad, Shivani Joshi, V. Henneken, R. Dekker
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引用次数: 9

摘要

提出了一种由附着在可拉伸膜上的刚性岛组成的可拉伸传感器阵列的制造方法。该方法采用CMOS兼容后处理方法,首先制造传感器元件和底层电子元件,然后是一系列蚀刻步骤和聚合物自旋涂层,从而形成可拉伸阵列。阵列的元件通过在CMOS的金属堆叠中预制的独立互连连接。所提出的制造结果证明了制造细间距、高密度阵列的可行性,其中互连完全与可拉伸基板分离,从而实现高拉伸性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A post processing approach for manufacturing high-density stretchable sensor arrays
A method for fabricating stretchable sensor arrays consisting of rigid islands attached to a stretchable membrane is proposed. The method utilizes a CMOS compatible post processing approach, where the sensor elements and the underlying electronics are fabricated first, followed by a sequence of etching steps and polymer spin coating that result in the formation of the stretchable array. The elements of the array are connected by free-standing interconnects that are prefabricated in the metal stack of the CMOS. The presented fabrication results demonstrate the feasibility of manufacturing of fine-pitch, high density arrays where the interconnects are completely separated from the stretchable substrate allowing for high stretchability.
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