A. Savov, S. K. Pakazad, Shivani Joshi, V. Henneken, R. Dekker
{"title":"制造高密度可拉伸传感器阵列的后处理方法","authors":"A. Savov, S. K. Pakazad, Shivani Joshi, V. Henneken, R. Dekker","doi":"10.1109/ICSENS.2014.6985350","DOIUrl":null,"url":null,"abstract":"A method for fabricating stretchable sensor arrays consisting of rigid islands attached to a stretchable membrane is proposed. The method utilizes a CMOS compatible post processing approach, where the sensor elements and the underlying electronics are fabricated first, followed by a sequence of etching steps and polymer spin coating that result in the formation of the stretchable array. The elements of the array are connected by free-standing interconnects that are prefabricated in the metal stack of the CMOS. The presented fabrication results demonstrate the feasibility of manufacturing of fine-pitch, high density arrays where the interconnects are completely separated from the stretchable substrate allowing for high stretchability.","PeriodicalId":13244,"journal":{"name":"IEEE SENSORS 2014 Proceedings","volume":"17 1","pages":"1703-1705"},"PeriodicalIF":0.0000,"publicationDate":"2014-12-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":"{\"title\":\"A post processing approach for manufacturing high-density stretchable sensor arrays\",\"authors\":\"A. Savov, S. K. Pakazad, Shivani Joshi, V. Henneken, R. Dekker\",\"doi\":\"10.1109/ICSENS.2014.6985350\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A method for fabricating stretchable sensor arrays consisting of rigid islands attached to a stretchable membrane is proposed. The method utilizes a CMOS compatible post processing approach, where the sensor elements and the underlying electronics are fabricated first, followed by a sequence of etching steps and polymer spin coating that result in the formation of the stretchable array. The elements of the array are connected by free-standing interconnects that are prefabricated in the metal stack of the CMOS. The presented fabrication results demonstrate the feasibility of manufacturing of fine-pitch, high density arrays where the interconnects are completely separated from the stretchable substrate allowing for high stretchability.\",\"PeriodicalId\":13244,\"journal\":{\"name\":\"IEEE SENSORS 2014 Proceedings\",\"volume\":\"17 1\",\"pages\":\"1703-1705\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-12-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"9\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE SENSORS 2014 Proceedings\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICSENS.2014.6985350\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE SENSORS 2014 Proceedings","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICSENS.2014.6985350","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A post processing approach for manufacturing high-density stretchable sensor arrays
A method for fabricating stretchable sensor arrays consisting of rigid islands attached to a stretchable membrane is proposed. The method utilizes a CMOS compatible post processing approach, where the sensor elements and the underlying electronics are fabricated first, followed by a sequence of etching steps and polymer spin coating that result in the formation of the stretchable array. The elements of the array are connected by free-standing interconnects that are prefabricated in the metal stack of the CMOS. The presented fabrication results demonstrate the feasibility of manufacturing of fine-pitch, high density arrays where the interconnects are completely separated from the stretchable substrate allowing for high stretchability.