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AMD Next Generation "Zen 4" Core and 4th Gen AMD EPYC™ Server CPUs AMD 下一代 "Zen 4 "核心和第四代 AMD EPYC™ 服务器 CPU
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-03-12 DOI: 10.1109/mm.2024.3375070
Ravi Bhargava, Kai Troester
{"title":"AMD Next Generation \"Zen 4\" Core and 4th Gen AMD EPYC™ Server CPUs","authors":"Ravi Bhargava, Kai Troester","doi":"10.1109/mm.2024.3375070","DOIUrl":"https://doi.org/10.1109/mm.2024.3375070","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"43 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140116481","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Quantifying CO2 Emission Reduction through Spatial Partitioning in Deep Learning Recommendation System Workloads 通过深度学习推荐系统工作负载中的空间分区量化二氧化碳减排量
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-03-05 DOI: 10.1109/mm.2024.3373443
Andrei Bersatti, Euna Kim, Hyesoon Kim
{"title":"Quantifying CO2 Emission Reduction through Spatial Partitioning in Deep Learning Recommendation System Workloads","authors":"Andrei Bersatti, Euna Kim, Hyesoon Kim","doi":"10.1109/mm.2024.3373443","DOIUrl":"https://doi.org/10.1109/mm.2024.3373443","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"39 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-03-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140045867","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Computing in Science & Engineering 科学与工程中的计算
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-02-13 DOI: 10.1109/mm.2024.3356893
{"title":"Computing in Science & Engineering","authors":"","doi":"10.1109/mm.2024.3356893","DOIUrl":"https://doi.org/10.1109/mm.2024.3356893","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"34 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139955052","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Security&Privacy Magazine 电气和电子工程师学会《安全与隐私》杂志
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-02-13 DOI: 10.1109/mm.2024.3356891
{"title":"IEEE Security&Privacy Magazine","authors":"","doi":"10.1109/mm.2024.3356891","DOIUrl":"https://doi.org/10.1109/mm.2024.3356891","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"2012 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139954808","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Computing With COOL Chips 使用酷睿芯片进行计算
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-02-13 DOI: 10.1109/mm.2024.3354368
Hsien-Hsin S. Lee
{"title":"Computing With COOL Chips","authors":"Hsien-Hsin S. Lee","doi":"10.1109/mm.2024.3354368","DOIUrl":"https://doi.org/10.1109/mm.2024.3354368","url":null,"abstract":"In this issue, IEEE MICRO welcomes the newly inaugurated Editor-in-Chief Dr. Hsien-Hsin Sean Lee and introduces the Special Issue on COOL chips for the state-of-the-art in low-power design for computing.","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"158 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139754486","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Annals of the History of Computing 电气和电子工程师学会计算机史年鉴
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-02-13 DOI: 10.1109/mm.2023.3340847
{"title":"IEEE Annals of the History of Computing","authors":"","doi":"10.1109/mm.2023.3340847","DOIUrl":"https://doi.org/10.1109/mm.2023.3340847","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"71 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139954813","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IT Professional 信息技术专业人员
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-02-13 DOI: 10.1109/mm.2024.3356889
{"title":"IT Professional","authors":"","doi":"10.1109/mm.2024.3356889","DOIUrl":"https://doi.org/10.1109/mm.2024.3356889","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"197 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139954872","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Computer Society Information 电气和电子工程师学会计算机协会信息
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-02-13 DOI: 10.1109/mm.2023.3340841
{"title":"IEEE Computer Society Information","authors":"","doi":"10.1109/mm.2023.3340841","DOIUrl":"https://doi.org/10.1109/mm.2023.3340841","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"129 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139955071","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Analysis of Historical Patenting Behavior and Patent Characteristics of Computer Architecture Companies—Part VIII: Patent Families 计算机体系结构公司的历史专利行为和专利特点分析--第八部分：专利家族
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-02-13 DOI: 10.1109/mm.2024.3353948
Joshua J. Yi
{"title":"Analysis of Historical Patenting Behavior and Patent Characteristics of Computer Architecture Companies—Part VIII: Patent Families","authors":"Joshua J. Yi","doi":"10.1109/mm.2024.3353948","DOIUrl":"https://doi.org/10.1109/mm.2024.3353948","url":null,"abstract":"This article is the next article in the series on the patenting behavior and characteristics of computer architecture companies. This article analyzes the characteristics for patent families.","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"40 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139754265","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Special Issue on COOL Chips COOL 芯片特刊
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-02-13 DOI: 10.1109/mm.2024.3353949
Ryusuke Egawa, Yasutaka Wada
{"title":"Special Issue on COOL Chips","authors":"Ryusuke Egawa, Yasutaka Wada","doi":"10.1109/mm.2024.3353949","DOIUrl":"https://doi.org/10.1109/mm.2024.3353949","url":null,"abstract":"This introduction to the special issue on low-power, high speed chips (COOL chips) discusses state-of-the-art COOL chips and the challenges facing researchers. It introduces four articles exploring different solutions for reducing power consumption and enhancing chip performance.","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"12 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139903800","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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