使用酷睿芯片进行计算

IF 2.8 3区 计算机科学 Q2 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
IEEE Micro Pub Date : 2024-02-13 DOI:10.1109/mm.2024.3354368
Hsien-Hsin S. Lee
{"title":"使用酷睿芯片进行计算","authors":"Hsien-Hsin S. Lee","doi":"10.1109/mm.2024.3354368","DOIUrl":null,"url":null,"abstract":"In this issue, IEEE MICRO welcomes the newly inaugurated Editor-in-Chief Dr. Hsien-Hsin Sean Lee and introduces the Special Issue on COOL chips for the state-of-the-art in low-power design for computing.","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"158 1","pages":""},"PeriodicalIF":2.8000,"publicationDate":"2024-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Computing With COOL Chips\",\"authors\":\"Hsien-Hsin S. Lee\",\"doi\":\"10.1109/mm.2024.3354368\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this issue, IEEE MICRO welcomes the newly inaugurated Editor-in-Chief Dr. Hsien-Hsin Sean Lee and introduces the Special Issue on COOL chips for the state-of-the-art in low-power design for computing.\",\"PeriodicalId\":13100,\"journal\":{\"name\":\"IEEE Micro\",\"volume\":\"158 1\",\"pages\":\"\"},\"PeriodicalIF\":2.8000,\"publicationDate\":\"2024-02-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Micro\",\"FirstCategoryId\":\"94\",\"ListUrlMain\":\"https://doi.org/10.1109/mm.2024.3354368\",\"RegionNum\":3,\"RegionCategory\":\"计算机科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Micro","FirstCategoryId":"94","ListUrlMain":"https://doi.org/10.1109/mm.2024.3354368","RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
引用次数: 0

摘要

在本期中,IEEE MICRO 欢迎新上任的主编李显欣博士,并介绍了有关 COOL 芯片的特刊,以介绍最先进的低功耗计算设计。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Computing With COOL Chips
In this issue, IEEE MICRO welcomes the newly inaugurated Editor-in-Chief Dr. Hsien-Hsin Sean Lee and introduces the Special Issue on COOL chips for the state-of-the-art in low-power design for computing.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
IEEE Micro
IEEE Micro 工程技术-计算机:软件工程
CiteScore
7.50
自引率
0.00%
发文量
164
审稿时长
>12 weeks
期刊介绍: IEEE Micro addresses users and designers of microprocessors and microprocessor systems, including managers, engineers, consultants, educators, and students involved with computers and peripherals, components and subassemblies, communications, instrumentation and control equipment, and guidance systems. Contributions should relate to the design, performance, or application of microprocessors and microcomputers. Tutorials, review papers, and discussions are also welcome. Sample topic areas include architecture, communications, data acquisition, control, hardware and software design/implementation, algorithms (including program listings), digital signal processing, microprocessor support hardware, operating systems, computer aided design, languages, application software, and development systems.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信