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Semi-Interpenetrating Highly Conductive and Transparent Hydrogels for Wearable Sensors and Gesture-Driven Cryptography 用于可穿戴传感器和手势驱动密码的半互穿高导电透明水凝胶
3区 计算机科学
IEEE Micro Pub Date : 2025-11-23 DOI: 10.3390/micro5040053
Dan Li, Kai Li, Yilin Wei, Lu Jiang, Hongqing Feng, Qiang Zheng
{"title":"Semi-Interpenetrating Highly Conductive and Transparent Hydrogels for Wearable Sensors and Gesture-Driven Cryptography","authors":"Dan Li, Kai Li, Yilin Wei, Lu Jiang, Hongqing Feng, Qiang Zheng","doi":"10.3390/micro5040053","DOIUrl":"https://doi.org/10.3390/micro5040053","url":null,"abstract":"Developing conductive hydrogels that balance high conductivity, stretchability, transparency, and sensitivity for next-generation wearable sensors remains challenging due to inherent trade-offs. This study introduces a straightforward approach to fabricate a semi-interpenetrating double-network hydrogel comprising polyvinyl alcohol (PVA), polyacrylamide (PAM), and lithium chloride (LiCl) to overcome these limitations. Leveraging hydrogen bonding for energy dissipation and chemical cross-linking for structural integrity, the design achieves robust mechanical properties. The incorporation of 1 mol/L LiCl significantly enhances ionic conductivity, while also providing plasticizing and moisture-retention benefits. The optimized hydrogel exhibits impressive ionic conductivity (0.47 S/m, 113% enhancement), excellent mechanical performance (e.g., 0.177 MPa tensile strength, 730% elongation, 0.68 MJ m−3 toughness), high transparency (>85%), and superior strain sensitivity (gauge factors ~1). It also demonstrates rapid response/recovery and robust fatigue resistance. Functioning as a wearable sensor, it reliably monitors diverse human activities and enables novel, secure data handling applications, such as finger-motion-driven Morse code interfaces and gesture-based password systems. This accessible fabrication method yields versatile hydrogels with promising applications in health tracking, interactive devices, and secure communication technologies.","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"5 4","pages":"53-53"},"PeriodicalIF":0.0,"publicationDate":"2025-11-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.mdpi.com/2673-8023/5/4/53/pdf?version=1763901154","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147886351","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
BlitzCoin: A Decentralized Hardware Solution for Power Management of Highly Heterogeneous Systems on Chip BlitzCoin:用于芯片上高度异构系统电源管理的分散式硬件解决方案
3区 计算机科学
IEEE Micro Pub Date : 2025-05-30 DOI: 10.1109/mm.2025.3574281
Martin Cochet, Karthik Swaminathan, Erik Jens Loscalzo, Joseph Zuckerman, Maico Cassel dos Santos, Davide Giri, Alper Buyuktosunoglu, Tianyu Jia, David Brooks, Gu-Yeon Wei, Kenneth L. Shepard, Luca P. Carloni, Pradip Bose
{"title":"BlitzCoin: A Decentralized Hardware Solution for Power Management of Highly Heterogeneous Systems on Chip","authors":"Martin Cochet, Karthik Swaminathan, Erik Jens Loscalzo, Joseph Zuckerman, Maico Cassel dos Santos, Davide Giri, Alper Buyuktosunoglu, Tianyu Jia, David Brooks, Gu-Yeon Wei, Kenneth L. Shepard, Luca P. Carloni, Pradip Bose","doi":"10.1109/mm.2025.3574281","DOIUrl":"https://doi.org/10.1109/mm.2025.3574281","url":null,"abstract":"The increase in both the number and the types of accelerators in modern SoCs necessitates a rethinking of power-management strategies. To overcome the scalability shortcomings of current methods, we propose BlitzCoin a fully decentralized hardware-based power management coupled with optimized unified voltage and frequency regulation. We evaluated BlitzCoin through RTL simulations of multiple SoCs targeted toward different application domains. The results are further validated through silicon measurements of a fabricated 12 nm many-accelerator SoC that includes BlitzCoin. Our evaluations show that BlitzCoin is markedly faster than state-of-the-art centralized power-management strategies, with 8× to 12× lower response times. This results in 25%-34% throughput improvement and allows for scaling to 7× to 13× larger SoCs, all with a small area overhead of <1%. BlitzCoin is an addition to the open-source ESP SoC platform, offering a foundation for further exploration of power-management strategies.","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"45 4","pages":"79-86"},"PeriodicalIF":0.0,"publicationDate":"2025-05-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147913735","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Interconnect Design for Heterogeneous Integration of Chiplets in the AMD Instinct™ MI300X Accelerator AMD Instinct™ MI300X加速器中芯片组异构集成的互连设计
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-09-18 DOI: 10.1109/mm.2024.3462351
Alan Smith, Gabriel H. Loh, Samuel Naffziger, John Wuu, Nathan Kalyanasundharam, Eric Chapman, Raja Swaminathan, Tyrone Huang, Wonjun Jung, Alexander Kaganov, Hugh McIntyre, Ramon Mangaser
{"title":"Interconnect Design for Heterogeneous Integration of Chiplets in the AMD Instinct™ MI300X Accelerator","authors":"Alan Smith, Gabriel H. Loh, Samuel Naffziger, John Wuu, Nathan Kalyanasundharam, Eric Chapman, Raja Swaminathan, Tyrone Huang, Wonjun Jung, Alexander Kaganov, Hugh McIntyre, Ramon Mangaser","doi":"10.1109/mm.2024.3462351","DOIUrl":"https://doi.org/10.1109/mm.2024.3462351","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"6 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142262554","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
ReDL: A Hybrid Memory System with Scalable Data Management Strategies for DNN Applications ReDL:为 DNN 应用提供可扩展数据管理策略的混合内存系统
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-09-13 DOI: 10.1109/mm.2024.3458992
Ningning Pan, Lei Ma, Xinting Ge, Hang Xiao, Xiaodan Sui, Yanyun Jiang, Yuanjie Zheng, Wei Rang
{"title":"ReDL: A Hybrid Memory System with Scalable Data Management Strategies for DNN Applications","authors":"Ningning Pan, Lei Ma, Xinting Ge, Hang Xiao, Xiaodan Sui, Yanyun Jiang, Yuanjie Zheng, Wei Rang","doi":"10.1109/mm.2024.3458992","DOIUrl":"https://doi.org/10.1109/mm.2024.3458992","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"188 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-09-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142262555","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
UCIe: Standard for an Open Chiplet Ecosystem UCIe:开放式芯片组生态系统标准
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-09-06 DOI: 10.1109/mm.2024.3451532
Peter Onufryk, Swadesh Choudhary
{"title":"UCIe: Standard for an Open Chiplet Ecosystem","authors":"Peter Onufryk, Swadesh Choudhary","doi":"10.1109/mm.2024.3451532","DOIUrl":"https://doi.org/10.1109/mm.2024.3451532","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"16 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-09-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142196822","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Energy-Efficient Parallel Interconnects for Chiplet Integration 用于芯片组集成的高能效并行互连器件
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-08-29 DOI: 10.1109/mm.2024.3450841
Wei Tang, Chester Liu, Zhengya Zhang
{"title":"Energy-Efficient Parallel Interconnects for Chiplet Integration","authors":"Wei Tang, Chester Liu, Zhengya Zhang","doi":"10.1109/mm.2024.3450841","DOIUrl":"https://doi.org/10.1109/mm.2024.3450841","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"25 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-08-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142196823","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Co-Design of Inter-Chiplet, Package, and System Interconnect Protocols 片间、封装和系统互连协议的协同设计
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-08-26 DOI: 10.1109/mm.2024.3447711
Tony Chan Carusone, Dustin Dunwell, Sundeep Gupta, Letizia Giuliano, Adrien Auge, Michael Klempa, Sue Hung Fung
{"title":"Co-Design of Inter-Chiplet, Package, and System Interconnect Protocols","authors":"Tony Chan Carusone, Dustin Dunwell, Sundeep Gupta, Letizia Giuliano, Adrien Auge, Michael Klempa, Sue Hung Fung","doi":"10.1109/mm.2024.3447711","DOIUrl":"https://doi.org/10.1109/mm.2024.3447711","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"80 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-08-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142196824","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Computer Society Information 电气和电子工程师学会计算机协会信息
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-08-23 DOI: 10.1109/mm.2024.3431258
{"title":"IEEE Computer Society Information","authors":"","doi":"10.1109/mm.2024.3431258","DOIUrl":"https://doi.org/10.1109/mm.2024.3431258","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"48 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-08-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142196828","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Special Issue on Top Picks From the 2023 Computer Architecture Conferences 2023 年计算机体系结构大会精选特刊
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-08-23 DOI: 10.1109/mm.2024.3431308
Yan Solihin
{"title":"Special Issue on Top Picks From the 2023 Computer Architecture Conferences","authors":"Yan Solihin","doi":"10.1109/mm.2024.3431308","DOIUrl":"https://doi.org/10.1109/mm.2024.3431308","url":null,"abstract":"It is our pleasure to introduce the <italic xmlns:mml=\"http://www.w3.org/1998/Math/MathML\" xmlns:xlink=\"http://www.w3.org/1999/xlink\">IEEE Micro</i> Special Issue on Top Picks from the 2023 Computer Architecture Conferences. This special issue includes 12 articles chosen by a selection committee (SC) as being the most significant research articles in computer architecture in 2023 in terms of their potential for long-term impact. The committee also selected an additional 12 articles to be recognized with an honorable mention (see “Honorable Mentions”).","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"14 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-08-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142196831","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Navigating Applications Development in Generative AI 引导生成式人工智能的应用开发
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-08-23 DOI: 10.1109/mm.2024.3425209
Shane Greenstein
{"title":"Navigating Applications Development in Generative AI","authors":"Shane Greenstein","doi":"10.1109/mm.2024.3425209","DOIUrl":"https://doi.org/10.1109/mm.2024.3425209","url":null,"abstract":"In its earliest prototypes, GitHub CoPilot stood apart from other tools. It demonstrated a remarkable ability to accelerate the work of intermediate coders by 20% to 40%, mainly with standardized languages like Python. This is a significant productivity gain in a labor-intensive activity, where such breakthroughs are rare.","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"56 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-08-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142196833","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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