IEEE MicroPub Date : 2024-08-23DOI: 10.1109/mm.2024.3433189
Hsien-Hsin S. Lee
{"title":"Top Picks Ignite Innovation","authors":"Hsien-Hsin S. Lee","doi":"10.1109/mm.2024.3433189","DOIUrl":"https://doi.org/10.1109/mm.2024.3433189","url":null,"abstract":"This <italic xmlns:mml=\"http://www.w3.org/1998/Math/MathML\" xmlns:xlink=\"http://www.w3.org/1999/xlink\">IEEE Micro</i> Special Issue on Top Picks includes 12 outstanding papers selected from those published in 2023 computer architecture conferences. When we were prepping and putting together all the articles in this special issue, another significant event in the computer industry was unfolding in Taipei, Taiwan, in June: the 2024 COMPUTEX Taipei. The event hosted more than 1500 exhibitors from 136 countries and regions, showcasing the latest innovations and sleek products in information and computing technologies. Unparalleled to previous equivalent events, the 2024 COMPUTEX organizers invited an elite group of influential leaders from today’s technology juggernauts to deliver keynotes. The program features AMD CEO Lisa Su, Delta Electronics General Director Tzi-cker Chiueh, Intel CEO Pat Gelsinger, MediaTek CEO Rick Tsai, NXP CTO Lars Reger, Qualcomm CEO Cristiano Amon, and Supermicro CEO Charles Liang. They were joined by a couple of additional speakers, ARM CEO Rene Haas and Nvidia CEO Jensen Huang, who delivered their keynotes outside the COMPUTEX exhibition hall. These Top Picks speakers represent the ecosystem companies of the computing infrastructure supply chain that help shape, bolster, and accelerate the Fourth Industrial Revolution, driven by the prevailing and unstoppable artificial intelligence (AI) tsunami. The unveiled systems push the frontiers of technology, reaching the pinnacle of computer architecture design, system integration, advanced packaging techniques, and leading-edge process technologies.","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"195 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-08-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142196832","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
IEEE MicroPub Date : 2024-08-23DOI: 10.1109/mm.2024.3431252
{"title":"Get Published in the New IEEE Transactions on Privacy","authors":"","doi":"10.1109/mm.2024.3431252","DOIUrl":"https://doi.org/10.1109/mm.2024.3431252","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"41 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-08-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142196827","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
IEEE MicroPub Date : 2024-08-23DOI: 10.1109/mm.2024.3433209
Joshua J. Yi
{"title":"Analysis of Historical Patenting Behavior and Patent Characteristics of Computer Architecture Companies—Part XI: Patent Families","authors":"Joshua J. Yi","doi":"10.1109/mm.2024.3433209","DOIUrl":"https://doi.org/10.1109/mm.2024.3433209","url":null,"abstract":"In previous parts of this series, I analyzed.","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"28 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-08-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142196829","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}