发布求助
文献互助 智能选刊 最新文献

IEEE Micro最新文献

筛选
英文 中文
IEEE Computer Society D&I Fund 电气和电子工程师学会计算机协会 D&I 基金
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-02-13 DOI: 10.1109/mm.2023.3340835
{"title":"IEEE Computer Society D&I Fund","authors":"","doi":"10.1109/mm.2023.3340835","DOIUrl":"https://doi.org/10.1109/mm.2023.3340835","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"151 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139955078","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Analysis of Historical Patenting Behavior and Patent Characteristics of Computer Architecture Companies—Part VIII: Patent Families 计算机体系结构公司的历史专利行为和专利特点分析--第八部分：专利家族
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-02-13 DOI: 10.1109/mm.2024.3353948
Joshua J. Yi
{"title":"Analysis of Historical Patenting Behavior and Patent Characteristics of Computer Architecture Companies—Part VIII: Patent Families","authors":"Joshua J. Yi","doi":"10.1109/mm.2024.3353948","DOIUrl":"https://doi.org/10.1109/mm.2024.3353948","url":null,"abstract":"This article is the next article in the series on the patenting behavior and characteristics of computer architecture companies. This article analyzes the characteristics for patent families.","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"40 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139754265","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Special Issue on COOL Chips COOL 芯片特刊
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-02-13 DOI: 10.1109/mm.2024.3353949
Ryusuke Egawa, Yasutaka Wada
{"title":"Special Issue on COOL Chips","authors":"Ryusuke Egawa, Yasutaka Wada","doi":"10.1109/mm.2024.3353949","DOIUrl":"https://doi.org/10.1109/mm.2024.3353949","url":null,"abstract":"This introduction to the special issue on low-power, high speed chips (COOL chips) discusses state-of-the-art COOL chips and the challenges facing researchers. It introduces four articles exploring different solutions for reducing power consumption and enhancing chip performance.","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"12 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139903800","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
After the Gold Rush 淘金热之后
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-02-13 DOI: 10.1109/mm.2023.3339186
Shane Greenstein
{"title":"After the Gold Rush","authors":"Shane Greenstein","doi":"10.1109/mm.2023.3339186","DOIUrl":"https://doi.org/10.1109/mm.2023.3339186","url":null,"abstract":"What determines market prospects during and after a commercial gold rush, such as the boom presently taking place in commercial generative AI? Many firms face similar technical challenges and commercial risks, and the resolution of one firm’s challenge correlates with that of another. That provides a way of cataloging risks, and the general prospects of some categories of firms, even though it does not lead to insight related to the prospects of specific firms.","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"35 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139754262","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Computing Edge 计算边缘
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-02-13 DOI: 10.1109/mm.2023.3340845
{"title":"Computing Edge","authors":"","doi":"10.1109/mm.2023.3340845","DOIUrl":"https://doi.org/10.1109/mm.2023.3340845","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"242 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139954866","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Publications Seek 2025 Editors in Chief 出版物招聘 2025 名主编
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-02-13 DOI: 10.1109/mm.2024.3357189
{"title":"Publications Seek 2025 Editors in Chief","authors":"","doi":"10.1109/mm.2024.3357189","DOIUrl":"https://doi.org/10.1109/mm.2024.3357189","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"2015 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139955051","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Computer Society Has You Covered! IEEE 计算机协会为您提供服务！
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-02-13 DOI: 10.1109/mm.2024.3356895
{"title":"IEEE Computer Society Has You Covered!","authors":"","doi":"10.1109/mm.2024.3356895","DOIUrl":"https://doi.org/10.1109/mm.2024.3356895","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"42 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139955050","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Computer Society Career Center 电气和电子工程师学会计算机协会职业中心
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-02-13 DOI: 10.1109/mm.2023.3340843
{"title":"IEEE Computer Society Career Center","authors":"","doi":"10.1109/mm.2023.3340843","DOIUrl":"https://doi.org/10.1109/mm.2023.3340843","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"16 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139955075","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
High-Speed Data Communication with Advanced Networks in Large Language Model Training 在大型语言模型训练中利用先进网络进行高速数据通信
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-01-30 DOI: 10.1109/mm.2024.3360081
Liuyao Dai, Hao Qi, Weicong Chen, Xiaoyi Lu
{"title":"High-Speed Data Communication with Advanced Networks in Large Language Model Training","authors":"Liuyao Dai, Hao Qi, Weicong Chen, Xiaoyi Lu","doi":"10.1109/mm.2024.3360081","DOIUrl":"https://doi.org/10.1109/mm.2024.3360081","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"197 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-01-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139955047","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
High Performance Cooling for Power Electronics Via Electrochemical Additive Manufacturing 通过电化学增材制造实现电力电子设备的高性能冷却
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-01-30 DOI: 10.1109/mm.2024.3360255
Ian Winfield, Tim Ouradnik, Joseph Madril, Michael Matthews, Guillermo Romero
{"title":"High Performance Cooling for Power Electronics Via Electrochemical Additive Manufacturing","authors":"Ian Winfield, Tim Ouradnik, Joseph Madril, Michael Matthews, Guillermo Romero","doi":"10.1109/mm.2024.3360255","DOIUrl":"https://doi.org/10.1109/mm.2024.3360255","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"116 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-01-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139954870","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
首页 上一页
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整，为了账户安全，请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们：info@booksci.cn Book学术提供免费学术资源搜索服务，方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号：604180095
Book学术官方微信
小红书