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IEEE Computer Society D&I Fund 电气和电子工程师学会计算机协会 D&I 基金
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-02-13 DOI: 10.1109/mm.2023.3340835
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引用次数: 0
After the Gold Rush 淘金热之后
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-02-13 DOI: 10.1109/mm.2023.3339186
Shane Greenstein
{"title":"After the Gold Rush","authors":"Shane Greenstein","doi":"10.1109/mm.2023.3339186","DOIUrl":"https://doi.org/10.1109/mm.2023.3339186","url":null,"abstract":"What determines market prospects during and after a commercial gold rush, such as the boom presently taking place in commercial generative AI? Many firms face similar technical challenges and commercial risks, and the resolution of one firm’s challenge correlates with that of another. That provides a way of cataloging risks, and the general prospects of some categories of firms, even though it does not lead to insight related to the prospects of specific firms.","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"35 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139754262","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Computing Edge 计算边缘
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-02-13 DOI: 10.1109/mm.2023.3340845
{"title":"Computing Edge","authors":"","doi":"10.1109/mm.2023.3340845","DOIUrl":"https://doi.org/10.1109/mm.2023.3340845","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"242 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139954866","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Publications Seek 2025 Editors in Chief 出版物招聘 2025 名主编
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-02-13 DOI: 10.1109/mm.2024.3357189
{"title":"Publications Seek 2025 Editors in Chief","authors":"","doi":"10.1109/mm.2024.3357189","DOIUrl":"https://doi.org/10.1109/mm.2024.3357189","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"2015 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139955051","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Computer Society Has You Covered! IEEE 计算机协会为您提供服务！
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-02-13 DOI: 10.1109/mm.2024.3356895
{"title":"IEEE Computer Society Has You Covered!","authors":"","doi":"10.1109/mm.2024.3356895","DOIUrl":"https://doi.org/10.1109/mm.2024.3356895","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"42 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139955050","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Computer Society Career Center 电气和电子工程师学会计算机协会职业中心
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-02-13 DOI: 10.1109/mm.2023.3340843
{"title":"IEEE Computer Society Career Center","authors":"","doi":"10.1109/mm.2023.3340843","DOIUrl":"https://doi.org/10.1109/mm.2023.3340843","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"16 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139955075","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
High-Speed Data Communication with Advanced Networks in Large Language Model Training 在大型语言模型训练中利用先进网络进行高速数据通信
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-01-30 DOI: 10.1109/mm.2024.3360081
Liuyao Dai, Hao Qi, Weicong Chen, Xiaoyi Lu
{"title":"High-Speed Data Communication with Advanced Networks in Large Language Model Training","authors":"Liuyao Dai, Hao Qi, Weicong Chen, Xiaoyi Lu","doi":"10.1109/mm.2024.3360081","DOIUrl":"https://doi.org/10.1109/mm.2024.3360081","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"197 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-01-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139955047","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
High Performance Cooling for Power Electronics Via Electrochemical Additive Manufacturing 通过电化学增材制造实现电力电子设备的高性能冷却
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-01-30 DOI: 10.1109/mm.2024.3360255
Ian Winfield, Tim Ouradnik, Joseph Madril, Michael Matthews, Guillermo Romero
{"title":"High Performance Cooling for Power Electronics Via Electrochemical Additive Manufacturing","authors":"Ian Winfield, Tim Ouradnik, Joseph Madril, Michael Matthews, Guillermo Romero","doi":"10.1109/mm.2024.3360255","DOIUrl":"https://doi.org/10.1109/mm.2024.3360255","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"116 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-01-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139954870","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Improving key-value cache performance with heterogeneous memory tiering: A case study of CXL-based memory expansion 利用异构内存分层提高键值缓存性能：基于 CXL 的内存扩展案例研究
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-01-26 DOI: 10.1109/mm.2024.3358861
KyungSoo Lee, Sohyun Kim, Joohee Lee, Donguk Moon, Rakie Kim, Honggyu Kim, Hyeongtak Ji, Yunjeong Mun, Youngpyo Joo
{"title":"Improving key-value cache performance with heterogeneous memory tiering: A case study of CXL-based memory expansion","authors":"KyungSoo Lee, Sohyun Kim, Joohee Lee, Donguk Moon, Rakie Kim, Honggyu Kim, Hyeongtak Ji, Yunjeong Mun, Youngpyo Joo","doi":"10.1109/mm.2024.3358861","DOIUrl":"https://doi.org/10.1109/mm.2024.3358861","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"34 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-01-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139954981","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Advancing TinyMLOps: Robust Model Updates in the Internet of Intelligent Vehicles 推进 TinyMLOps：智能车联网中的稳健模型更新
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-01-17 DOI: 10.1109/mm.2024.3354323
Thommas K. S. Flores, Ivanovitch Silva, Mariana B. Azevedo, Thais de A. de Medeiros, Morsinaldo de A. Medeiros, Daniel G. Costa, Paolo Ferrari, Emiliano Sisinni
{"title":"Advancing TinyMLOps: Robust Model Updates in the Internet of Intelligent Vehicles","authors":"Thommas K. S. Flores, Ivanovitch Silva, Mariana B. Azevedo, Thais de A. de Medeiros, Morsinaldo de A. Medeiros, Daniel G. Costa, Paolo Ferrari, Emiliano Sisinni","doi":"10.1109/mm.2024.3354323","DOIUrl":"https://doi.org/10.1109/mm.2024.3354323","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"3 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-01-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139954988","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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