Special Issue on COOL Chips

IF 2.8 3区计算机科学 Q2 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE

IEEE Micro Pub Date : 2024-02-13 DOI:10.1109/mm.2024.3353949

Ryusuke Egawa, Yasutaka Wada

引用次数: 0

Abstract

This introduction to the special issue on low-power, high speed chips (COOL chips) discusses state-of-the-art COOL chips and the challenges facing researchers. It introduces four articles exploring different solutions for reducing power consumption and enhancing chip performance.

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COOL 芯片特刊

本特刊介绍了低功耗、高速芯片（COOL 芯片），讨论了最先进的 COOL 芯片和研究人员面临的挑战。它介绍了四篇文章，探讨了降低功耗和提高芯片性能的不同解决方案。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Micro 工程技术-计算机：软件工程

CiteScore

7.50

自引率

0.00%

发文量

164

审稿时长

>12 weeks

期刊介绍： IEEE Micro addresses users and designers of microprocessors and microprocessor systems, including managers, engineers, consultants, educators, and students involved with computers and peripherals, components and subassemblies, communications, instrumentation and control equipment, and guidance systems. Contributions should relate to the design, performance, or application of microprocessors and microcomputers. Tutorials, review papers, and discussions are also welcome. Sample topic areas include architecture, communications, data acquisition, control, hardware and software design/implementation, algorithms (including program listings), digital signal processing, microprocessor support hardware, operating systems, computer aided design, languages, application software, and development systems.