IEEE Journal of Selected Topics in Quantum Electronics最新文献_第6页

Ultrafast Laser-Fabricated Three-Dimensional Photonic Chips Empowering Diverse Applications 超快激光制造三维光子芯片支持多种应用

IF 5.1 2区工程技术

IEEE Journal of Selected Topics in Quantum Electronics Pub Date : 2026-03-01 Epub Date: 2026-03-02 DOI: 10.1109/JSTQE.2026.3669125

Jian Wang;Jue Wang;Chengkun Cai;Kangrui Wang;Shiao Ding

{"title":"Ultrafast Laser-Fabricated Three-Dimensional Photonic Chips Empowering Diverse Applications","authors":"Jian Wang;Jue Wang;Chengkun Cai;Kangrui Wang;Shiao Ding","doi":"10.1109/JSTQE.2026.3669125","DOIUrl":"https://doi.org/10.1109/JSTQE.2026.3669125","url":null,"abstract":"Three-dimensional (3D) photonic integration is becoming a key enabler for future optical technologies, driven by the need for greater functionality, higher compactness, and superior interconnect density. In response to these demands, ultrafast laser processing has emerged as a powerful technique for realizing 3D photonic chips with enhanced design and fabrication flexibility—while avoiding the complexity of mask-based or cleanroom-dependent fabrication. This review begins by outlining the fundamental mechanisms of femtosecond laser–matter interactions, which enable precise energy deposition and spatially confined material modification. It then delineates three primary processing routes—direct modification, additive processing, and subtractive processing—alongside essential beam-shaping strategies. The compatibility of various material systems and structural platforms, including glasses, polymers, crystals, bulk substrates, thin-film layers, and optical fibers, is further discussed. Subsequently, the review details how these 3D laser-fabricated photonic structures underpin a wide range of applications, such as optical field manipulation, optical communications, optical interconnects, optical computing and processing, optical data storage, quantum information, nonlinear optics, optical trapping, and imaging. Finally, it concludes with a perspective on the prevailing challenges and future trends toward scalable, multifunctional, and hybrid-integrated photonic systems enabled by ultrafast laser microfabrication.","PeriodicalId":13094,"journal":{"name":"IEEE Journal of Selected Topics in Quantum Electronics","volume":"32 2: 3-D Horizons in Photonics: Integrated Circuits","pages":"1-26"},"PeriodicalIF":5.1,"publicationDate":"2026-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147557329","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

IEEE Journal of Selected Topics in Quantum Electronics Publication Information IEEE量子电子学专题杂志出版信息

IF 4.5 2区工程技术

IEEE Journal of Selected Topics in Quantum Electronics Pub Date : 2026-03-01 Epub Date: 2026-04-30 DOI: 10.1109/JSTQE.2026.3682095

引用次数: 0

IEEE Journal of Selected Topics in Quantum Electronics Edics IEEE量子电子医学专题杂志

IF 4.5 2区工程技术

IEEE Journal of Selected Topics in Quantum Electronics Pub Date : 2026-03-01 Epub Date: 2026-04-30 DOI: 10.1109/JSTQE.2026.3682101

引用次数: 0

Efficient Silicon Nitride Quantum Interconnect for Intrinsic Silicon Nitride Single-Photon Emitters 本征氮化硅单光子发射体的高效氮化硅量子互连

IF 4.5 2区工程技术

IEEE Journal of Selected Topics in Quantum Electronics Pub Date : 2026-03-01 Epub Date: 2026-08-11 DOI: 10.1109/JSTQE.2026.3722063

Henna Farheen;Yuheng Chen;Peigang Chen;Pranshu Maan;Samuel Peana;Alexander Senichev;Vladimir M. Shalaev;Alexandra Boltasseva;Jens Förstner;Alexander V. Kildishev

{"title":"Efficient Silicon Nitride Quantum Interconnect for Intrinsic Silicon Nitride Single-Photon Emitters","authors":"Henna Farheen;Yuheng Chen;Peigang Chen;Pranshu Maan;Samuel Peana;Alexander Senichev;Vladimir M. Shalaev;Alexandra Boltasseva;Jens Förstner;Alexander V. Kildishev","doi":"10.1109/JSTQE.2026.3722063","DOIUrl":"https://doi.org/10.1109/JSTQE.2026.3722063","url":null,"abstract":"Scalable on-chip quantum photonics requires efficient quantum interconnects between deterministic single-photon sources and low-loss waveguides. The discovery of intrinsic, nonstoichiometric nitrogen-rich silicon nitride (SiN) emitters provides a promising route for monolithic integration, enabling both enhanced emission rates and high extraction efficiencies. Here, we present a topology-optimized hybrid photonic-plasmonic quantum interconnect that functions as a cavity and coupler; it simultaneously enhances spontaneous emission and directs photons into a waveguide. By combining an Au nanodisk for Purcell enhancement with an inverse-designed SiN routing structure, we increase the emission rate while maintaining a coupling efficiency of <inline-formula><tex-math>$sim$</tex-math></inline-formula>79% (corresponding to a coupling loss of <inline-formula><tex-math>$sim$</tex-math></inline-formula>1.02 dB). These co-optimized plasmonic and dielectric components play complementary roles, enabling superior total collected photon power compared to dielectric-only designs. Native integration of single-photon sources in our design enables a robust quantum interconnect with the critical material uniformity across different functional elements and demonstrates a fabrication-aware, scalable approach to addressing key efficiency bottlenecks in large-scale quantum architectures.","PeriodicalId":13094,"journal":{"name":"IEEE Journal of Selected Topics in Quantum Electronics","volume":"32 3: Nanophotonics, Metamaterials and Plasmonics","pages":"610080-610080"},"PeriodicalIF":4.5,"publicationDate":"2026-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148925341","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

IEEE Journal of Selected Topics in Quantum Electronics Edics IEEE量子电子医学专题杂志

IF 4.5 2区工程技术

IEEE Journal of Selected Topics in Quantum Electronics Pub Date : 2026-03-01 Epub Date: 2026-09-25 DOI: 10.1109/JSTQE.2026.3695977

引用次数: 0

IEEE Journal of Selected Topics in Quantum Electronics Information for Authors IEEE量子电子信息专题杂志

IF 4.5 2区工程技术

IEEE Journal of Selected Topics in Quantum Electronics Pub Date : 2026-03-01 Epub Date: 2026-09-25 DOI: 10.1109/JSTQE.2026.3695975

引用次数: 0

3D Electronic-Photonic Heterogeneous Interconnect Platforms Enabling Energy-Efficient Scalable Architectures for Future HPC Systems 3D电子-光子异构互连平台为未来的高性能计算系统实现节能可扩展架构

IF 5.1 2区工程技术

IEEE Journal of Selected Topics in Quantum Electronics Pub Date : 2026-03-01 Epub Date: 2026-03-13 DOI: 10.1109/JSTQE.2026.3674145

Anirban Samanta;Shun-Hung Lee;Chun-Yi Cheng;Samuel Palermo;S. J. Ben Yoo

{"title":"3D Electronic-Photonic Heterogeneous Interconnect Platforms Enabling Energy-Efficient Scalable Architectures for Future HPC Systems","authors":"Anirban Samanta;Shun-Hung Lee;Chun-Yi Cheng;Samuel Palermo;S. J. Ben Yoo","doi":"10.1109/JSTQE.2026.3674145","DOIUrl":"https://doi.org/10.1109/JSTQE.2026.3674145","url":null,"abstract":"3D interconnects have emerged as a solution to address the scaling issues of interconnect bandwidth and the memory wall problem in high-performance computing (HPC), such as High-Bandwidth Memory (HBM). However, the copper-based electrical interconnect retains fundamental limitations. Dense I/O for high-speed signals lead to degraded signal quality for end-to-end links, necessitating additional circuits to mitigate signal impairments and resulting in poor energy efficiency. We propose a 3D chiplet stacking electronic-photonic interconnect (EPIC) platform, which offers a solution by moving the high-speed data communication interface to the optical domain across the 3D stack by using Through Silicon Optical Vias (TSOV), while retaining the functionality of electrical TSVs and 2.5D interconnects for power delivery and short-reach low-latency communications. We then benchmark the proposed model against state-of-the-art 3D electrical interconnects to demonstrate our 3D EPIC platform beating the 3D electrical interconnects to >10 TB/s/mm<sup>2</sup> bandwidth density. We present a pathway to extend our demonstrated, industry-ready design to achieving <inline-formula><tex-math>$leq$</tex-math></inline-formula>100 fJ/bit high-speed communication.","PeriodicalId":13094,"journal":{"name":"IEEE Journal of Selected Topics in Quantum Electronics","volume":"32 2: 3-D Horizons in Photonics: Integrated Circuits","pages":"1-14"},"PeriodicalIF":5.1,"publicationDate":"2026-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11434907","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147606196","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Vacuum Induced Transparency, Vacuum Rabi Splitting, and Exceptional Points in a Quantum Emitter Near a Graphene Nanodisk 真空诱导透明，真空拉比分裂，以及石墨烯纳米盘附近量子发射极的特殊点

IF 5.1 2区工程技术

IEEE Journal of Selected Topics in Quantum Electronics Pub Date : 2026-03-01 Epub Date: 2026-04-22 DOI: 10.1109/JSTQE.2026.3686445

George E. Paspalakis;Adamantios P. Synanidis;Vasilios Karanikolas;Andreas F. Terzis;Ioannis Thanopulos;Emmanuel Paspalakis

{"title":"Vacuum Induced Transparency, Vacuum Rabi Splitting, and Exceptional Points in a Quantum Emitter Near a Graphene Nanodisk","authors":"George E. Paspalakis;Adamantios P. Synanidis;Vasilios Karanikolas;Andreas F. Terzis;Ioannis Thanopulos;Emmanuel Paspalakis","doi":"10.1109/JSTQE.2026.3686445","DOIUrl":"https://doi.org/10.1109/JSTQE.2026.3686445","url":null,"abstract":"This work studies the absorption spectrum of a two-level quantum emitter coupled to a photonic environment modified by the plasmon modes of a graphene nanodisk. Using macroscopic quantum electrodynamics and a Lorentzian mapping, the system is described within an effective cavity quantum electrodynamics framework. Analytical expressions are derived for the linear susceptibility, and three distinct spectral regimes are identified. In vacuum induced transparency, destructive quantum interference opens a narrow transparency window in the absorption spectrum. In vacuum Rabi splitting, coherent energy exchange between the emitter and the plasmonically modified photonic mode produces a well-resolved doublet. When plasmon losses are large, the required interference is suppressed, leading to the absence of induced optical transparency. It is shown that the transitions between these regimes are strictly determined by the exceptional points of the system's effective non-Hermitian Hamiltonian, and a complete phase diagram is provided as a function of the emitter-nanodisk distance and the free-space decay rate. The results highlight graphene nanodisks as a highly tunable platform for the dynamic control of quantum interference, offering potential applications in reconfigurable nanophotonic spectral switching and transparency-window engineering.","PeriodicalId":13094,"journal":{"name":"IEEE Journal of Selected Topics in Quantum Electronics","volume":"32 3: Nanophotonics, Metamaterials and Plasmonics","pages":"6700112-6700112"},"PeriodicalIF":5.1,"publicationDate":"2026-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11489484","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148236172","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Rainbow Trapping on Plasmonic Surface Gratings and Beyond 等离子体表面光栅上的彩虹俘获及其他

IF 5.1 2区工程技术

IEEE Journal of Selected Topics in Quantum Electronics Pub Date : 2026-03-01 Epub Date: 2026-02-12 DOI: 10.1109/JSTQE.2026.3664350

Jietao Liu;P.V. Karthik Yadav;Murali Gedda;Qiaoqiang Gan

{"title":"Rainbow Trapping on Plasmonic Surface Gratings and Beyond","authors":"Jietao Liu;P.V. Karthik Yadav;Murali Gedda;Qiaoqiang Gan","doi":"10.1109/JSTQE.2026.3664350","DOIUrl":"https://doi.org/10.1109/JSTQE.2026.3664350","url":null,"abstract":"On-chip rainbow trapping enables precise light manipulation for slow light, photonics trapping, absorption, and sensing in advanced photonic devices. Although metallic graded grating nanostructures facilitate efficient rainbow trapping, broadband plasmonic trapping remains challenging. Over the past decades, metamaterials, microstructures, and nanostructures have been extensively studied and surface-trapped rainbows have been incorporated in novel applications. This review examines the key achievements, challenges, and practical applications of rainbow trapping, focusing on broadband light control through plasmonic surface gratings. We discuss the fundamental mechanisms of rainbow trapping through simulations and experimental demonstrations across various geometries, especially those of graded gratings. In addition, we explore advanced fabrication techniques and emerging applications of rainbow trapping in optical sensing, communication, and light absorption, highlighting new possibilities for multi-spectrum and broadband light manipulation. Finally, we highlight the challenges and future perspectives of this emerging technology.","PeriodicalId":13094,"journal":{"name":"IEEE Journal of Selected Topics in Quantum Electronics","volume":"32 3: Nanophotonics, Metamaterials and Plasmonics","pages":"1-13"},"PeriodicalIF":5.1,"publicationDate":"2026-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147557419","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

IEEE Journal of Selected Topics in Quantum Electronics Publication Information IEEE量子电子学专题杂志出版信息

IF 4.5 2区工程技术

IEEE Journal of Selected Topics in Quantum Electronics Pub Date : 2026-03-01 Epub Date: 2026-09-25 DOI: 10.1109/JSTQE.2026.3695971

引用次数: 0