40th ARFTG Conference Digest最新文献_第2页

Calibrating On-Wafer Probes to the Probe Tips 校准晶圆上探针到探针尖端

40th ARFTG Conference Digest Pub Date : 1992-12-01 DOI: 10.1109/ARFTG.1992.327008

Dylan F. Williams, R. Marks

引用次数: 41

Frequency and Time Domain Characterization of High-Speed Digital Circuit Interconnects in a Multilayer Printed Circuit Board 多层印刷电路板中高速数字电路互连的频域和时域特性

40th ARFTG Conference Digest Pub Date : 1992-12-01 DOI: 10.1109/ARFTG.1992.327006

A. Agrawal

引用次数: 1

Using Microwave Coupled Resonator Filters to Characterize Thick Film Interconnects for Highfrequency Signal Propagation 用微波耦合谐振器滤波器表征高频信号传播的厚膜互连

40th ARFTG Conference Digest Pub Date : 1992-12-01 DOI: 10.1109/ARFTG.1992.327002

R. Grzybowski, D. B. Jensen, M. Gilden, R. J. Bacher

引用次数: 0

T/R Modules for Automated Assembly and Test Using Flip Chip and LTCC Packaging 用于倒装芯片和LTCC封装的自动组装和测试的T/R模块

40th ARFTG Conference Digest Pub Date : 1992-12-01 DOI: 10.1109/ARFTG.1992.327000

David K. Sakamoto

{"title":"T/R Modules for Automated Assembly and Test Using Flip Chip and LTCC Packaging","authors":"David K. Sakamoto","doi":"10.1109/ARFTG.1992.327000","DOIUrl":"https://doi.org/10.1109/ARFTG.1992.327000","url":null,"abstract":"This paper discusses the use of Low Temperature Cofired Ceramic (LTCC) packages and flip chip MMICs designed for automated assembly and test in T/R module applications. The reduction of the number of components, elimination of assembly steps, and the automated assembly and test of T/R modules that is thus achieved is also discussed. The use of multi-layer LTCC allows dense packaging. DC lines can be routed on multiple layers, and different types of RF configurations ¿ microstrip, stripline, and coplanar waveguide (CPW) ¿ can be realized on the same substrate. RF cross-overs with high isolation between lines can be achieved by means of buried transmission lines and ground planes. The substrate can be fabricated to be used in a conventional metal housing, or the substrate can be fabricated to function as both the substrate and housing at the same time. With the latter method, walls are built up using the ceramic tape. These walls can also contain circuitry, allowing for higher packaging density. Flipped GaAs chips utilizing CPW structures eliminate costly backside processing of MMIC wafers. Flip chips used in T/R modules are thicker than conventional chips, 25 mils vs. 4 mils, thus providing a much more robust chip for handling by high speed automated assembly equipment. The use of flip chips simplifies the assembly procedure by eliminating wire bonds, since the solder attachment of the flip chip to the substrate serves as both die attach and interconnect.","PeriodicalId":130939,"journal":{"name":"40th ARFTG Conference Digest","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133268514","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Measurements of Dynamic Current in Switching CMOS Buffer 开关CMOS缓冲器中动态电流的测量

40th ARFTG Conference Digest Pub Date : 1992-12-01 DOI: 10.1109/ARFTG.1992.326986

Oystein Pedersen, B. Flaten

引用次数: 0

Planar Resistors for Probe Station Calibration 探头站标定用平面电阻器

40th ARFTG Conference Digest Pub Date : 1992-12-01 DOI: 10.1109/ARFTG.1992.326993

D. Walker, D.F. Williams, J. M. Morgan

引用次数: 30

Characterizing Blind Mate Connectors 盲配连接器的特性

40th ARFTG Conference Digest Pub Date : 1992-12-01 DOI: 10.1109/ARFTG.1992.327009

B. Oldfield

引用次数: 0

Coplanar Versus Microstrip Measurements of Millimetre-Wave Devices 毫米波器件的共面与微带测量

40th ARFTG Conference Digest Pub Date : 1992-12-01 DOI: 10.1109/ARFTG.1992.326996

P. Walters, R. Pollard, J. Richardson, P. Gamand, P. Suchet

引用次数: 1

Measuring Package and Interconnect Model Parameters Using Distributed Impedance 使用分布阻抗测量封装和互连模型参数

40th ARFTG Conference Digest Pub Date : 1992-12-01 DOI: 10.1109/ARFTG.1992.327003

B. Janko, Pete Decher

{"title":"Measuring Package and Interconnect Model Parameters Using Distributed Impedance","authors":"B. Janko, Pete Decher","doi":"10.1109/ARFTG.1992.327003","DOIUrl":"https://doi.org/10.1109/ARFTG.1992.327003","url":null,"abstract":"The method developed here employs time domain reflectometry (TDR) techniques to measure model parameters of a lead in an interconnect or a package. TDR techniques have been broadly used in testing interconnect networks, since reflected waveforms provide excellent visualization of the signal path and waveform features can be readily associated with physical features of the device. What has not been widely appreciated is that quantitative values of network model parameters can be as easily extracted with TDR, in a manner that can make lumped model generation for an interconnect an easy job. The technique described here will be usefbl when a device already exists, for model pnmmeter geiieration from measurements, or, in cases where theoretical models also exist, for model parameter venficatioii. Although it can be used for a large variety of distributed impedance function carries the information about the local inductance and capacitance of the lead. Thus, lumped element LCZ models can be derived knowing this function. All the necessary calculations can easily be performed in time domain, thus avoiding artifacts that can arise with time-frequency domain transformations.","PeriodicalId":130939,"journal":{"name":"40th ARFTG Conference Digest","volume":"77 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115726554","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 7

Save The "Thru" in the A.N.A. Calibration 保存“通过”在A.N.A.校准

40th ARFTG Conference Digest Pub Date : 1992-12-01 DOI: 10.1109/ARFTG.1992.327007

A. Ferrero, U. Pisani, F. Sanpietro

引用次数: 5