{"title":"多层印刷电路板中高速数字电路互连的频域和时域特性","authors":"A. Agrawal","doi":"10.1109/ARFTG.1992.327006","DOIUrl":null,"url":null,"abstract":"The digital interconnects are characterized in frequency domain by measuring the scattering matrices using network analyser. These scattering matrices are used to find frequency dependent resistance, inductance, capacitance, and conductance of the coupled transmission lines. In time domain, the lossy transmission line parameters are used to simulate the transient response to analyse the skin-effect and dielectric loss effect on the signal propagation and cross-talk.","PeriodicalId":130939,"journal":{"name":"40th ARFTG Conference Digest","volume":"24 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Frequency and Time Domain Characterization of High-Speed Digital Circuit Interconnects in a Multilayer Printed Circuit Board\",\"authors\":\"A. Agrawal\",\"doi\":\"10.1109/ARFTG.1992.327006\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The digital interconnects are characterized in frequency domain by measuring the scattering matrices using network analyser. These scattering matrices are used to find frequency dependent resistance, inductance, capacitance, and conductance of the coupled transmission lines. In time domain, the lossy transmission line parameters are used to simulate the transient response to analyse the skin-effect and dielectric loss effect on the signal propagation and cross-talk.\",\"PeriodicalId\":130939,\"journal\":{\"name\":\"40th ARFTG Conference Digest\",\"volume\":\"24 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1992-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"40th ARFTG Conference Digest\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ARFTG.1992.327006\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"40th ARFTG Conference Digest","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ARFTG.1992.327006","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Frequency and Time Domain Characterization of High-Speed Digital Circuit Interconnects in a Multilayer Printed Circuit Board
The digital interconnects are characterized in frequency domain by measuring the scattering matrices using network analyser. These scattering matrices are used to find frequency dependent resistance, inductance, capacitance, and conductance of the coupled transmission lines. In time domain, the lossy transmission line parameters are used to simulate the transient response to analyse the skin-effect and dielectric loss effect on the signal propagation and cross-talk.
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