Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)最新文献_第4页

High strain rate mechanical properties of SAC105 leadfree alloy at high operating temperatures SAC105无铅合金在高温下的高应变率力学性能

Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Pub Date : 2014-05-27 DOI: 10.1109/ITHERM.2014.6892276

P. Lall, Vikas Yadav, D. Zhang, J. Suhling, S. Shantaram

{"title":"High strain rate mechanical properties of SAC105 leadfree alloy at high operating temperatures","authors":"P. Lall, Vikas Yadav, D. Zhang, J. Suhling, S. Shantaram","doi":"10.1109/ITHERM.2014.6892276","DOIUrl":"https://doi.org/10.1109/ITHERM.2014.6892276","url":null,"abstract":"Industry migration to leadfree solders has resulted in a proliferation of a wide variety of solder alloy compositions. The most popular amongst these are the Sn-Ag-Cu family of alloys like SAC105 and SAC305. Electronics subjected to shock and vibration may experience strain rates of 1-100 per sec. Electronic product may often be exposed to high temperature during storage, operation and handling in addition to high strain rate transient dynamic loads during drop-impact, shock and vibration. Properties of leadfree solder alloys at high strain rates at low and high temperatures experienced by the solder joint during typical mechanical shock events are scarce. Previous studies have showed the effect of high strain rates and thermal aging on the mechanical properties of leadfree alloys including elastic modulus and the ultimate tensile strength. The ANAND viscoplastic constitutive model has been widely used to describe the inelastic deformation behavior of solders in electronic components. In this study, SAC105 leadfree alloys have been tested at strain rates of 10, 35, 50 and 75 per sec at various operating temperatures of 50°C, 75°C, 100°C and 125°C. Full-field strain in the specimen have been measured using high speed imaging at frame rates up to 75,000 fps in combination with digital image correlation. The cross-head velocity has been measured prior-to, during, and after deformation to ensure the constancy of cross-head velocity. Stress-Strain curves have been plotted over a wide range of strain rates and temperatures. Experimental data for the pristine specimen has been fit to the ANAND's viscoplastic model.","PeriodicalId":12453,"journal":{"name":"Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"21 1","pages":"161-169"},"PeriodicalIF":0.0,"publicationDate":"2014-05-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83216124","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 23

Reliability of MEMS devices under multiple environments MEMS器件在多种环境下的可靠性

Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Pub Date : 2014-05-27 DOI: 10.1109/ITHERM.2014.6892432

P. Lall, A. Abrol, Lee Simpson, J. Glover

{"title":"Reliability of MEMS devices under multiple environments","authors":"P. Lall, A. Abrol, Lee Simpson, J. Glover","doi":"10.1109/ITHERM.2014.6892432","DOIUrl":"https://doi.org/10.1109/ITHERM.2014.6892432","url":null,"abstract":"Micro-electro-mechanical systems (MEMS) devices are used in a variety of applications for sensing acceleration, translation, rotation, pressure and sound in addition to actuation and signal generation. The MEMS devices have been applied to varied fields including healthcare and automotive applications. Data on reliability degradation of MEMS devices in harsh environment applications including combined environments of high temperature exposure, and high-g shock loading is scarce. In this paper, a test vehicle with a MEMS Accelerometers has been studied under high-temperature exposure followed by high-g mechanical shock. Test boards have been designed to assemble all the sensor types. The boards have been subjected to mechanical shocks using the method 2002.5, condition G, under the standard MIL-STD-883H test. Shock pulse amplitudes have been ramped from 500 to 30,000g with pulse duration between 0.1 to 1 millisecond. Full field effect on the components has been extracted using high speed cameras operating at 100,000 fps in conjunction with digital image correlation. The degradation of the MEMS response has been studied using statistical pattern recognition. The failure mechanisms have been characterized. The deterioration of the components has been extracted using non-destructive evaluation with micro-CT scans and X-ray. Further, the degradation of the MEMS response has been studied using statistical pattern recognition. The failure mechanisms have been characterized.","PeriodicalId":12453,"journal":{"name":"Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"89 1 1","pages":"1313-1321"},"PeriodicalIF":0.0,"publicationDate":"2014-05-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86465320","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

Liquid cooling of a hot spot using a superhydrophilic nanoporous surface 使用超亲水性纳米孔表面对热点进行液体冷却

Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Pub Date : 2014-05-27 DOI: 10.1109/ITHERM.2014.6892298

Shailesh Malla, Miguel Amaya, H. Moon, S. M. You

{"title":"Liquid cooling of a hot spot using a superhydrophilic nanoporous surface","authors":"Shailesh Malla, Miguel Amaya, H. Moon, S. M. You","doi":"10.1109/ITHERM.2014.6892298","DOIUrl":"https://doi.org/10.1109/ITHERM.2014.6892298","url":null,"abstract":"The performance of thin-film evaporative cooling for near-junction thermal management was investigated. A liquid delivery system capable of delivering water in small volumes ranging 20~75 nl at frequencies of up to 600 Hz was established. On one side of the silicon chip, a resistive heating layer of 2 mm × 2 mm was fabricated to emulate the high heat flux hot-spot, and on the other side a superhydrophilic nanoporous coating (SHNC) was applied over an area of 10 mm × 10 mm. With the aid of the nanoporous coating, delivered droplets spread into thin films of thicknesses less than 10 μm. With this system, evaporative tests were conducted in ambient in an effort to maximize dryout heat flux and evaporative heat transfer coefficient. During the tests, heat flux at the hot spot was varied to values above 1000 W/cm2. Water was delivered at either given constant frequency (constant mass flow rate) or programmed variations of frequency (variable mass flow rate), for a given nanoliter dose volume. Heat flux and hot spot surface temperatures were recorded upon reaching steady state at each applied heat flux increment. A mixed mode of cooling consisting of simultaneous thin-film evaporation and boiling was observed. Relative to bare silicon surface, dryout heat flux of the SHNC surface was found to increase by ~5 times at 500~600 Hz.","PeriodicalId":12453,"journal":{"name":"Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"36 1","pages":"317-325"},"PeriodicalIF":0.0,"publicationDate":"2014-05-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89049232","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Piranha Pin-Fins (PPF): Voracious boiling heat transfer by vapor venting from microchannels - system calibration and single-phase fluid dynamics 水虎鱼鳍(PPF):通过微通道的蒸汽排气来进行贪婪的沸腾传热-系统校准和单相流体动力学

Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Pub Date : 2014-05-27 DOI: 10.1109/ITHERM.2014.6892294

C. Woodcock, Farzad Houshmand, J. Plawsky, M. Izenson, D. Fogg, R. Hill, Scott Phillips, Y. Peles

{"title":"Piranha Pin-Fins (PPF): Voracious boiling heat transfer by vapor venting from microchannels - system calibration and single-phase fluid dynamics","authors":"C. Woodcock, Farzad Houshmand, J. Plawsky, M. Izenson, D. Fogg, R. Hill, Scott Phillips, Y. Peles","doi":"10.1109/ITHERM.2014.6892294","DOIUrl":"https://doi.org/10.1109/ITHERM.2014.6892294","url":null,"abstract":"A novel approach to embedded electronics cooling with a multi-phase microfluidic heat sink termed the Piranha Pin-Fin (PPF) is presented. Several first-generation PPF devices, as well as plain-channel and solid pin-fin heat sinks, have been fabricated and experimentally tested under single-phase adiabatic conditions. Details of the PPF device geometry and microfabrication process are provided. Plots showing pressure drop and friction factor are also provided. Numerical fluid dynamics modeling has been performed in parallel to the experiments. Modeling data presented includes fractional flow through the pins, predicted pressure losses, fluid streamlines and velocity gradients under several operating conditions. Additionally, micro-particle image velocimetry (μPIV) measurements have been performed. The velocity fields are used to provide further insight into the fluid mechanics within the heat sink as well as to validate the models. Velocity field measurements are included for various operating conditions.","PeriodicalId":12453,"journal":{"name":"Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"134 1","pages":"282-289"},"PeriodicalIF":0.0,"publicationDate":"2014-05-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86303743","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 12

Characterization of thermal transport in multiwalled carbon nanotube using FIB irradiation 用FIB辐照表征多壁碳纳米管的热输运

Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Pub Date : 2014-05-27 DOI: 10.1109/ITHERM.2014.6892439

Koji Takahashi, H. Hayashi

引用次数: 1

Thermal performance modeling of hybrid liquid-air cooled servers 混合式液空冷却服务器的热性能建模

Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Pub Date : 2014-05-27 DOI: 10.1109/ITHERM.2014.6892333

R. Zeighami, W. Saunders, Henry Coles, S. Branton

引用次数: 7

Thermal Modeling Improvements using substrate ECAD integration 利用衬底ECAD集成改进热建模

Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Pub Date : 2014-05-27 DOI: 10.1109/ITHERM.2014.6892391

V. Jha, T. Hauck

引用次数: 1

Damage mechanisms in copper-aluminum wirebond under high temperature operation 铜铝焊丝在高温下的损伤机理

Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Pub Date : 2014-05-27 DOI: 10.1109/ITHERM.2014.6892412

P. Lall, Shantanu Deshpande, L. Nguyen, M. Murtuza

{"title":"Damage mechanisms in copper-aluminum wirebond under high temperature operation","authors":"P. Lall, Shantanu Deshpande, L. Nguyen, M. Murtuza","doi":"10.1109/ITHERM.2014.6892412","DOIUrl":"https://doi.org/10.1109/ITHERM.2014.6892412","url":null,"abstract":"Wire bonding is predominant mode of interconnect in electronics packaging. Traditionally material used for wire bonding is gold. But industry is slowly replacing gold wire bond by copper-aluminum wire bond because of the lower cost and better mechanical properties than gold, such as high strength, high thermal conductivity etc. Numerous studies have been done to analyze failure mechanism of Cu-Al wire bonds. Cu-Al interface is a predominant location for failure of the wirebond interconnects. In this paper, the use of intermetallic thickness as leading indicator-of-failure for prognostication of remaining useful life for Cu-Al wire bond interconnects has been studied. For analysis, 32 pin chip scale packages were used. Packages were aged isothermally at 200°C and 250°C for 10 days. Packages were withdrawn periodically after 24 hours and its IMC thickness was measured using SEM. The parts have been prognosticated for accrued damage and remaining useful life in current or anticipated future deployment environment. The presented methodology uses evolution of the IMC thickness in conjunction with the Levenberg-Marquardt Algorithm to identify accrued damage in wire bond subjected to thermal aging. The proposed method can be used for equivalency of damage accrued in Cu-Al parts subjected to multiple thermal aging environments.","PeriodicalId":12453,"journal":{"name":"Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"66 1","pages":"1171-1178"},"PeriodicalIF":0.0,"publicationDate":"2014-05-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"77150999","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Phonon thermal conduction in periodically porous silicon nanobeams 周期性多孔硅纳米梁中的声子热传导

Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Pub Date : 2014-05-27 DOI: 10.1109/ITHERM.2014.6892341

Woosung Park, A. Marconnet, T. Kodama, Joonsuk Park, R. Sinclair, M. Asheghi, K. Goodson

引用次数: 3

Towards development of a passive datacenter cooling technology: On-server thermosyphon cooling loop under dynamic workload 被动数据中心冷却技术的发展:动态工作负载下的服务器上热虹吸冷却回路

Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Pub Date : 2014-05-27 DOI: 10.1109/ITHERM.2014.6892394

J. Marcinichen, S. Szczukiewicz, N. Lamaison, J. Thome

引用次数: 10