ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems最新文献_第5页

Drop Durability of Printed Hybrid Electronic (PHE) Assemblies Under Extreme Acceleration Level 印刷混合电子(PHE)组件在极端加速水平下的掉落耐久性

ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Pub Date : 2022-10-25 DOI: 10.1115/ipack2022-97382

H. Abusalma, A. Dasgupta, A. Bujanda, Jian Yu, H. Tsang

{"title":"Drop Durability of Printed Hybrid Electronic (PHE) Assemblies Under Extreme Acceleration Level","authors":"H. Abusalma, A. Dasgupta, A. Bujanda, Jian Yu, H. Tsang","doi":"10.1115/ipack2022-97382","DOIUrl":"https://doi.org/10.1115/ipack2022-97382","url":null,"abstract":"\u0000 In this paper, the drop durability of printed hybrid electronic (PHE) assemblies of various form factors is studied under extreme drop conditions with accelerations up to 20,000 G. Test specimens considered here include: circular disk, cantilever beam, and hemispherical dome samples.\u0000 The disk is made from a UV hardened resin material and mounted using a 3-point fixture. This specimen experienced overstress fracture at 20,000 G drops. Additionally, it was very susceptible to repetitive drop failure. The failure site was at the expected site of maximum flexure, as revealed by finite element modeling and by high-speed video recording.\u0000 The cantilever beam is a standard 1.6 mm thick FR4 substrate with printed silver traces. The substrate was durable but suffered from high strains near the clamp which are expected to cause damage to the silver conductive traces printed on them. The beam specimen was instrumented with strain gages and was also subjected to high-speed video recording of the drop event. The beam was found to vibrate in its first two bending modes when dropped at 10,000 G.\u0000 The hemispherical substrates for the dome specimens were made from several different polymeric materials and were mounted in a threaded fixture. Drop durability varied with choice of substrate material and fabrication method. Some showed catastrophic failures after 1–5 drops at 20,000 Gs while some survived more than 50 drops at 20,000 G. The failure site for all failed dome specimens was at the threads used for mounting to the fixture.","PeriodicalId":117260,"journal":{"name":"ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126677077","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

A Study on Parameters That Impact the Thermal Fatigue Life of BGA Solder Joints 影响BGA焊点热疲劳寿命的参数研究

ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Pub Date : 2022-10-25 DOI: 10.1115/ipack2022-97253

Karthik Arun Deo, R. Kono, Chongyang Cai, Junbo Yang, Yangyang Lai, Seungbae Park

{"title":"A Study on Parameters That Impact the Thermal Fatigue Life of BGA Solder Joints","authors":"Karthik Arun Deo, R. Kono, Chongyang Cai, Junbo Yang, Yangyang Lai, Seungbae Park","doi":"10.1115/ipack2022-97253","DOIUrl":"https://doi.org/10.1115/ipack2022-97253","url":null,"abstract":"\u0000 Estimation of the thermal fatigue life of solder joints and identification of parameters that enhance the fatigue life are important steps in the development stage of BGA packages. In this study, different parameters of Sn-Ag-Cu 305 BGA (Ball Grid Array) solder balls are investigated to understand their impact on the number of cycles to failure under thermal fatigue life tests. Initially, accelerated thermal cycling fatigue tests on two electronic packages were conducted by three different vendors and it was observed that the results were significantly different. The first part of this study dwells into understanding the influence of parameters such as the solder mask design; SMD and NSMD, the variation in the solder ball geometry, copper pad thickness and diameter and material properties of the PCB on the accelerated thermal cycling performance of the BGA packages. The later part deals with understanding the root cause for the variation in the estimated life of two BGA packages by the three different vendors.","PeriodicalId":117260,"journal":{"name":"ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"99 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115005553","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 7

Electro-Chemical Migration in Aerosol-Jet Printed Electronics Using Temperature-Humidity and Water Droplet Testing Methods 使用温度-湿度和水滴测试方法的气溶胶-喷射印刷电子中的电化学迁移

ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Pub Date : 2022-10-25 DOI: 10.1115/ipack2022-92306

Beihan Zhao, Aniket Bharamgonda, E. Jennings, R. G. Utter, M. Osterman, M. Azarian, Siddhartha Das, A. Dasgupta, J. Fleischer, Edwin Quinn, D. Hines

{"title":"Electro-Chemical Migration in Aerosol-Jet Printed Electronics Using Temperature-Humidity and Water Droplet Testing Methods","authors":"Beihan Zhao, Aniket Bharamgonda, E. Jennings, R. G. Utter, M. Osterman, M. Azarian, Siddhartha Das, A. Dasgupta, J. Fleischer, Edwin Quinn, D. Hines","doi":"10.1115/ipack2022-92306","DOIUrl":"https://doi.org/10.1115/ipack2022-92306","url":null,"abstract":"\u0000 In this study, temperature-humidity-bias (THB) testing and water droplet (WD) testing have been conducted to study electro-chemical migration (ECM) and dendrite formation across features in aerosol jet printed (AJP) conductor patterns. Test specimen design and testing conditions were guided by industrial standards and related research studies. Time-to-failure (TTF) for AJP printed silver patterns is found to be much smaller than that for conventional copper patterns in THB testing, under identical testing conditions. Furthermore, TTF for dendrite growth between neighboring biased conductors at constant temperature and humidity conditions was found to have a non-monotonic dependence on the electric potential gradient. The dendrite density was found to vary significantly with different applied voltage gradients in both THB testing and WD testing. Those observations can help to guide future investigation and life-prediction modeling of AJP printed electronics subjected to combined temperature, humidity, and voltage stresses.","PeriodicalId":117260,"journal":{"name":"ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115406720","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

A Three-Face Utilized Heat Sink Design for 3-D Integrated 75 kVA Intelligent Power Stage (IPS) 三维集成75kva智能电源级(IPS)的三面利用散热器设计

ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Pub Date : 2022-10-25 DOI: 10.1115/ipack2022-97886

A. Mirza, Xiaoqiang Xu, A. Emon, F. Luo, Shikui Chen

引用次数: 1

Thermomechanical Reliability of BGA Packages With Different Underfill Reinforcement Methods 不同补强方式BGA封装的热机械可靠性

ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Pub Date : 2022-10-25 DOI: 10.1115/ipack2022-97349

Yangyang Lai, Chongyang Cai, K. Pan, Junbo Yang, J. Ha, Pengcheng Yin, K. Deo, Seungbae Park

{"title":"Thermomechanical Reliability of BGA Packages With Different Underfill Reinforcement Methods","authors":"Yangyang Lai, Chongyang Cai, K. Pan, Junbo Yang, J. Ha, Pengcheng Yin, K. Deo, Seungbae Park","doi":"10.1115/ipack2022-97349","DOIUrl":"https://doi.org/10.1115/ipack2022-97349","url":null,"abstract":"\u0000 In this paper, an experimental approach is presented to investigate the influence of second level underfill on the thermomechanical behavior of two BGA packages during thermal cycles. Two different flip chip packages with two major underfill reinforcement methods (corner bonding and full bottom surface bonding) and no-underfill were studied. To quantitatively measure the deformation of solder balls, all the BGA packages were cross-sectioned before thermal cycles. The two-dimensional digital image correlation (DIC) technique was used to capture the in-plane deformation of the critical solder ball in thermal cycling intervals. The accumulated plastic strain of the BGA solder was calculated after every 10 thermal cycles. The temperature of each cycle was set from −40 to 100 °C at a 20°C/second rate. The experiment results showed that Package A with fully underfilled and corner underfilled both alleviated the averaged plastic strain on the critical solder ball in comparison with the no-underfilled Package A. However, Package B with corners underfilled had a larger plastic strain than the package without underfill. The material properties of underfill applied in the two reinforcement methods are identical. The results indicate that inappropriate underfilling methods can adversely affect the thermomechanical reliability of the packages. The underfill material and reinforcement methods are associated with the stiffness rigidity and the compact CTE of the package itself. In the respect of thermomechanical reliability, second level underfilling should be individually specified for varied packages.","PeriodicalId":117260,"journal":{"name":"ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127812695","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Experimental Study of Transient Hydraulic Characteristics for Liquid Cooled Data Center Deployment 液冷数据中心部署瞬态水力特性实验研究

ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Pub Date : 2022-10-25 DOI: 10.1115/ipack2022-97425

A. Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Akiilessh Sivakumar, A. Lakshminarayana, Harold Miyamura, Gautam Gupta, D. Agonafer, Jeremy Rodriguez

{"title":"Experimental Study of Transient Hydraulic Characteristics for Liquid Cooled Data Center Deployment","authors":"A. Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Akiilessh Sivakumar, A. Lakshminarayana, Harold Miyamura, Gautam Gupta, D. Agonafer, Jeremy Rodriguez","doi":"10.1115/ipack2022-97425","DOIUrl":"https://doi.org/10.1115/ipack2022-97425","url":null,"abstract":"\u0000 Increasing demands for cloud-based computing and storage, Internet-of-Things, and machine learning-based applications have necessitated the utilization of more efficient cooling technologies. Direct-to-chip liquid cooling using cold plates has proven to be one of the most efficient methods to dissipate the high heat fluxes of modern high-power CPUs and GPUs. While the published literature has well-documented research on the thermal aspects of direct liquid cooling, a detailed account of transient hydraulic investigation is still missing. In this experiment, a total of four 52U racks with four high-power TTV-servers (Thermal Test Vehicles) in each rack were designed and deployed. Each server consists of eight GPU TTVs and six NV switch heaters. Each of the two racks has a different vendor rack manifold and cooling loop modules (CLM). A 450 kW coolant distribution unit (CDU) is used to supply 25% propylene glycol coolant to these racks. Each rack has its own rack-level flow control valve to maintain the same flow rate. The present study provides an in-depth analysis of hydraulic transients when rack-level flow control valves are used with and without flow control. The operating conditions of the CDU are varied for different parameters, such as a constant flow rate, constant differential pressure, and constant pump speed. Furthermore, hydraulic transient is examined when the cooling loop modules are decommissioned from the rack one by one. The effect of this step-by-step decommissioning is assessed on the CDU operation and other racks. The pressure drop-based control strategy has been developed to maintain the same flow rate in the remaining servers in the rack when some cooling loop modules are decommissioned.","PeriodicalId":117260,"journal":{"name":"ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122757373","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module 碳化硅半桥功率模块的热优化

ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Pub Date : 2022-10-25 DOI: 10.1115/ipack2022-97283

G. Moreno, J. Major, D. DeVoto, F. Khan, S. Narumanchi, Xuhui Feng, P. Paret

{"title":"Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module","authors":"G. Moreno, J. Major, D. DeVoto, F. Khan, S. Narumanchi, Xuhui Feng, P. Paret","doi":"10.1115/ipack2022-97283","DOIUrl":"https://doi.org/10.1115/ipack2022-97283","url":null,"abstract":"\u0000 This project describes the modeling process to design the packaging and heat exchanger for a half-bridge wide-bandgap (WBG) power semiconductor module. The module uses two silicon carbide, metal-oxide-semiconductor field-effect transistor (MOSFET) devices per switch position that are soldered to an aluminum nitride, direct-bond copper (DBC) substrate. A baseplate cooling configuration (e.g., no thermal grease) is used along with a water-ethylene glycol, jet-impingement-style heat exchanger. The heat exchanger was designed to be fabricated using prototyping equipment from the National Renewable Energy Laboratory, complies with automotive standards (for minimal channel sizes, flow rates, and coolant), and considers reliability aspects (i.e., erosion/corrosion). Device-scale computational fluid dynamics (CFD) is used first to design the slot jet impingement cooling configuration and compute the effective heat transfer coefficient (HTC) of the concept. The computed HTCs are then used as boundary conditions for a finite element study to optimize the package geometry (e.g., device layout and baseplate thickness) to minimize thermal resistance and minimize temperature variation between the module’s four devices. Finally, a fluid manifold is designed to generate the slot jets and cool the devices. Module-scale CFD predicts a relatively low junction-to-fluid thermal resistance of 16.7 mm2·K/W, a 1.4°C temperature variation between devices, and a total pressure drop of 5,860 Pa (0.85 psi) for the design. The thermal resistance of the module design is about 67% lower than the 2015 BMW i3 power electronics/modules thermal resistance.","PeriodicalId":117260,"journal":{"name":"ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"685 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132584056","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Predictive Methods for Electrical and Mechanical Process-Output for Inkjet Additive Printed Circuits 喷墨增材制造印刷电路的电气和机械工艺输出预测方法

ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Pub Date : 2022-10-25 DOI: 10.1115/ipack2022-97428

P. Lall, Kartik Goyal, Scott Miller

{"title":"Predictive Methods for Electrical and Mechanical Process-Output for Inkjet Additive Printed Circuits","authors":"P. Lall, Kartik Goyal, Scott Miller","doi":"10.1115/ipack2022-97428","DOIUrl":"https://doi.org/10.1115/ipack2022-97428","url":null,"abstract":"\u0000 In this paper, predictive models are developed for inkjet printed features regarding their electrical and mechanical performance and to help reduce the initial process time in selecting print parameters. Printed electronics are continuously getting immense interest with a steady increase in its areas of end applications. The process generally involves controlled deposition of material on a substrate to additively build the required structure. Due to the nature of additive printing, benefits such as reduced time to manufacturing and the possibility of flexible and conformable electronics can be easily achievable. Under the umbrella term of additive printing, Inkjet printing is one technique that is sometimes known as the workforce of mass manufacturing due to the number of nozzles ranging in hundreds or even thousands, with which it can print the structures. The process, also known as drop-on-demand, involves the deposition of liquid ink droplets as per the required structure. However, for deposition, inkjet requires control of certain process parameters that impact the print resolution and, thus, the printed material properties. Thus, it is important to have a predictive framework that helps select those significant parameters. Silver Nanoparticle-based ink is utilized that is compatible with the viscosity range allowed in the printer. For the predictive framework development, a statistical approach is implemented that consists of a design-of-experiments (DOE) matrix with significant parameters that have a major impact on the resolution and properties of the material. The study’s response variables consist of the printed feature’s electrical and mechanical properties. The aim of this study is to provide statistical models that can be used with Inkjet process parameters as an input to predict the properties of the final printed feature.","PeriodicalId":117260,"journal":{"name":"ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129276966","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Deep Learning for Prediction of Print Parameters and Realized Electrical Performance and Geometry on Inkjet Platform 基于深度学习的喷墨打印参数预测及在喷墨平台上实现的电性能和几何特性

ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Pub Date : 2022-10-25 DOI: 10.1115/ipack2022-97437

P. Lall, Shriram K. Kulkarni, Ved Soni, Kartik Goyal, Scott Miller

{"title":"Deep Learning for Prediction of Print Parameters and Realized Electrical Performance and Geometry on Inkjet Platform","authors":"P. Lall, Shriram K. Kulkarni, Ved Soni, Kartik Goyal, Scott Miller","doi":"10.1115/ipack2022-97437","DOIUrl":"https://doi.org/10.1115/ipack2022-97437","url":null,"abstract":"\u0000 A closed-loop deep learning approach for correlating the print parameters with realized electrical performance and geometry estimations on an inkjet platform has been presented in this paper. An estimate of the changes in the print parameters and the recognized print dimension is necessary to print reliable and fine conductive traces. The inks used for this analysis are both particle and particle-free silver inks, and the comparison of the same is also studied. A closed-loop control algorithm is used to attain the desired electrical and geometrical values by changing the print parameters without any user intervention. Sensing is achieved by an automatic print parameter sensing system using a camera that captures the print to identify the geometry and dimension of the same. Once the realized print parameters are determined, a deep learning neural network regression model based on these parameters is used to predict the desired input print parameters, which are used to achieve the desired geometry and dimension of the print. These new parameter values are passed on to the printing software to optimize the print and attain the desired geometry and characteristics.","PeriodicalId":117260,"journal":{"name":"ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122218807","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

RoHS – Compliant Indirectly Material Evaluation for Manufacturing Study 符合RoHS -制造的间接材料评价研究

ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Pub Date : 2022-10-25 DOI: 10.1115/ipack2022-97175

F. Liu, S. Huang, Sheng Fong Yu, Chun Yen Li, Liang-Yih Hung, Yu Po Wang

{"title":"RoHS – Compliant Indirectly Material Evaluation for Manufacturing Study","authors":"F. Liu, S. Huang, Sheng Fong Yu, Chun Yen Li, Liang-Yih Hung, Yu Po Wang","doi":"10.1115/ipack2022-97175","DOIUrl":"https://doi.org/10.1115/ipack2022-97175","url":null,"abstract":"\u0000 The restriction of hazardous substances directive is an environmental directive being passed by the European Union in February 2003. It was scheduled to be effective from on July 1, 2006. It mainly aims at product ingredients and engineering process standards in manufacturing. Any electrical and electronic equipment contains hazardous substances over the regulated limitation will not be allowed to be offered on the market in European Union. Mar 31, 2015, European Union issued a directive to add four new restrictions on the concentration of phthalates that were Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP) and Diisobutyl phthalate (DIBP). The limitation of concentration by weight is 0.1% for each substance.\u0000 The phthalates which are used as plasticizers to be used in indirectly material as dicing tape for the semiconductor industry. Many related researches mentioned that temperature and time effects on the migration of DEHP, which means the product existed the risk to be contaminated. Therefore, DEHP is phased out from indirectly material to evaluate DEHP-free indirectly material. The manufacture result is shown in this study to evaluate new indirectly material without DEHP.","PeriodicalId":117260,"journal":{"name":"ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116308158","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0