ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

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ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 最新文献

Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server

Pub Date : 2022-10-25 DOI: 10.1115/ipack2022-97587 Himanshu Modi, Pardeep Shahi, Lochan Sai Reddy Chinthaparthy, Gautam Gupta, Pratik V. Bansode, Vibin Shalom Simon, D. Agonafer

Multiphysics Co-Optimization Design and Analysis of a Double-Side-Cooled Silicon Carbide-Based Power Module

Pub Date : 2022-10-25 DOI: 10.1115/ipack2022-97355 Xuhui Feng, G. Moreno, S. Narumanchi, P. Paret

Naturally-Cooled Heat Sinks for Next-Generation Battery Chargers

Pub Date : 2022-10-25 DOI: 10.1115/ipack2022-98077 C. Chhokar, G. B. Abadi, Nicholas McDaniel, Chris Botting, M. Bahrami

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