IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003.最新文献

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Universal simulation kit in micro-production 微型生产通用仿真工具包
O. Wiechers, M. Zehtaban, J. Seidelmann, J. Schliesser
{"title":"Universal simulation kit in micro-production","authors":"O. Wiechers, M. Zehtaban, J. Seidelmann, J. Schliesser","doi":"10.1109/IEMT.2003.1225926","DOIUrl":"https://doi.org/10.1109/IEMT.2003.1225926","url":null,"abstract":"Due to its broad fields of applications, micro technology has become a key technology for the 21st century. In the scope of a successfully performed project for \"Principles of universal device kit for micro-production\", a simulation kit for testing and optimizing the tools and logistic concepts has been introduced by Fraunhofer IPA, Department Cleanroom Manufacturing. In this paper the approach and results of the developed simulation kit will be presented. The goal of this study was to test the functionality and efficiency of different equipment configurations and logistic plans during development and planning phase by means of this simulation kit. eM-Plant simulation software is used which benefits from an object-oriented and open system architecture and enables the user to create well-structured hierarchical simulation models. Based on this virtual simulation platform important manufacturing data like throughput, cycle time, equipment utilization as well as process controlling strategies can be determined for later application in production phase. By means of this simulation kit, development and optimization of new application for a tool and for factory logistics is also possible.","PeriodicalId":106415,"journal":{"name":"IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003.","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131894335","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Precision flux deposition techniques for semiconductor applications 半导体应用的精密磁通沉积技术
S. Erickson
{"title":"Precision flux deposition techniques for semiconductor applications","authors":"S. Erickson","doi":"10.1109/IEMT.2003.1225871","DOIUrl":"https://doi.org/10.1109/IEMT.2003.1225871","url":null,"abstract":"Precise control of flux deposition is critical to semiconductor packaging applications including chip scale packages, ball grid arrays, column grid arrays, and flip chips. The flux must be applied in a defined pattern and film thickness to maximize both quality and throughput. Automated, contactless techniques are increasingly being utilized to replace the less controllable dipping and pin transfer techniques for flux application. Some new contactless flux application methods include flux jetting and ultrasonic atomized spray.","PeriodicalId":106415,"journal":{"name":"IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003.","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116547451","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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