Precision flux deposition techniques for semiconductor applications

Abstract

Precise control of flux deposition is critical to semiconductor packaging applications including chip scale packages, ball grid arrays, column grid arrays, and flip chips. The flux must be applied in a defined pattern and film thickness to maximize both quality and throughput. Automated, contactless techniques are increasingly being utilized to replace the less controllable dipping and pin transfer techniques for flux application. Some new contactless flux application methods include flux jetting and ultrasonic atomized spray.