IEEE Journal on Flexible Electronics最新文献

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A Proposed Fully Transparent, Flexible, and Compact Modeled Low-Voltage TFT for Implementation of Full Adder and Subtractor 一种完全透明、灵活和紧凑的低压TFT模型,用于实现全加减法器
IEEE Journal on Flexible Electronics Pub Date : 2024-03-14 DOI: 10.1109/JFLEX.2024.3400760
Mukuljeet Singh Mehrolia;Ankit Verma;Abhishek Kumar Singh;Nitesh K. Chourasia;Amritanshu Pandey
{"title":"A Proposed Fully Transparent, Flexible, and Compact Modeled Low-Voltage TFT for Implementation of Full Adder and Subtractor","authors":"Mukuljeet Singh Mehrolia;Ankit Verma;Abhishek Kumar Singh;Nitesh K. Chourasia;Amritanshu Pandey","doi":"10.1109/JFLEX.2024.3400760","DOIUrl":"https://doi.org/10.1109/JFLEX.2024.3400760","url":null,"abstract":"In this article, a low-voltage, fully transparent, flexible thin-film transistor (TFT) is simulated using the Silvaco-Atlas tool, in which amorphous indium-gallium–zinc oxide (a-IGZO) and HfO2 are used as the active layers, gate dielectrics of the TFT, and indium-tin oxide (ITO) serves as the electrodes for source, drain, and gate contacts. In addition, this TFT is compactly modeled and used in the implementation of full adder and full subtractor circuits through the Silvaco-Techmodeler and Silvaco-Gateway tools. The technology computer-aided design (TCAD) simulated device has an operating voltage of 2 V and good performance parameters, such as a low threshold voltage of 0.104 V, high mobility (~8.9 cm2/V-sec), high <inline-formula> <tex-math>$I_{text {ON}}$ </tex-math></inline-formula>/<inline-formula> <tex-math>$I_{text {OFF}}~sim 10^{5}$ </tex-math></inline-formula>, and a low subthreshold slope (SS) of 65 mV/decade. The Silvaco-Gateway tool is used for the execution of full adder and subtractor circuits. For all eight inputs (from 000 to 111), it gives quite acceptable transient characteristics in analyzing corresponding outputs as sum, carry, difference, and borrow. Silvaco-Techmodeler tools help in the compact modeling of simulated devices and generate a high level of accuracy of ~100% with very minimal error between simulated and modeled data (0.41% and 0.94%, respectively). This simulated, compactly modeled TFT would be used in the near future for analyzing complex analog and digital circuits.","PeriodicalId":100623,"journal":{"name":"IEEE Journal on Flexible Electronics","volume":"3 11","pages":"477-483"},"PeriodicalIF":0.0,"publicationDate":"2024-03-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143521568","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Effective Posture Classification Using Statistically Significant Data From Flexible Pressure Sensors 利用柔性压力传感器的统计意义数据进行有效的姿势分类
IEEE Journal on Flexible Electronics Pub Date : 2024-03-13 DOI: 10.1109/JFLEX.2024.3400151
Jungeun Yoon;Aekyeung Moon;Seung Woo Son
{"title":"Effective Posture Classification Using Statistically Significant Data From Flexible Pressure Sensors","authors":"Jungeun Yoon;Aekyeung Moon;Seung Woo Son","doi":"10.1109/JFLEX.2024.3400151","DOIUrl":"https://doi.org/10.1109/JFLEX.2024.3400151","url":null,"abstract":"Advancements in flexible and printable sensor technologies to overcome the limitations of conventional rigid counterparts offer an excellent opportunity to design various healthcare applications for humans, and their potential flexibility can be used in real-time health monitoring and personalized physical conditions with minimal or no inconvenience. However, managing a large volume of obtained sensor datasets and ensuring accurate predictions can take time and effort. While statistical analysis and the Pearson correlation coefficient can reduce data volume, whether this would lead to losing important information and affect downstream application performance is still being determined. In this article, we use posture classification as an exemplar of timely services in digital healthcare, especially for bedsores or decubitus ulcers. Our sensors, placed under hospital beds, have a thickness of just 0.4 mm and collect pressure data from 28 sensors (\u0000<inline-formula> <tex-math>$7 times 4$ </tex-math></inline-formula>\u0000) at an 8-Hz cycle, categorizing postures into four types from five patients. We then collected sensor data to explore the possibility of using a small number of pressure sensors for patient posture classification. Next, we apply a statistical analysis to the datasets obtained to select the featured sensor data cells and evaluate the performance of posture classification models on various groups of sensors. Our evaluation involves the analysis of reduced datasets through statistical methods and the Pearson correlation coefficient. The classification performance using datasets comprising five featured and 28 sensors are 0.93 and 0.99, respectively. These results suggest comparable performance and the viability of useful classifiers for both the cases. Consequently, comparable posture classification performance can be achieved using only 17.9% of the entire dataset.","PeriodicalId":100623,"journal":{"name":"IEEE Journal on Flexible Electronics","volume":"3 5","pages":"173-180"},"PeriodicalIF":0.0,"publicationDate":"2024-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141965446","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
One-Step Plasma Jet Deposition and Self-Sintering of Gold Nanoparticle Inks on Low-Temperature Substrates 低温基底上金纳米粒子墨水的一步式等离子喷射沉积和自烧结技术
IEEE Journal on Flexible Electronics Pub Date : 2024-03-09 DOI: 10.1109/JFLEX.2024.3399710
Jacob Manzi;Tony Varghese;Josh Eixenberger;Lakshmi Prakasan;David Estrada;Harish Subbaraman
{"title":"One-Step Plasma Jet Deposition and Self-Sintering of Gold Nanoparticle Inks on Low-Temperature Substrates","authors":"Jacob Manzi;Tony Varghese;Josh Eixenberger;Lakshmi Prakasan;David Estrada;Harish Subbaraman","doi":"10.1109/JFLEX.2024.3399710","DOIUrl":"https://doi.org/10.1109/JFLEX.2024.3399710","url":null,"abstract":"Flexible electronics on low-temperature substrates like paper are very appealing for their use in disposable and biocompatible electronic applications and areas like healthcare, wearables, and consumer electronics. Plasma-jet printing (PJP) uses a dielectric barrier discharge plasma to focus aerosolized nanoparticles onto a target substrate. The same plasma can be used to change the properties of the printed material and even sinter in situ. In this work, we demonstrate the one-step deposition of gold structures onto flexible and low-temperature substrates without the need for thermal or photonic postprocessing. We also explore the plasma effect on the deposition of the gold nanoparticle ink. The plasma voltage is optimized for the sintering of the gold nanoparticles, and a simple procedure for manufacturing traces with increased adhesion and conductivity is presented, with a peak conductivity of \u0000<inline-formula> <tex-math>$6.2times 10^{5}$ </tex-math></inline-formula>\u0000 S/m. PJP-printed gold LED interconnects and microheaters on flexible substrates are developed to demonstrate the potential of this single-step sintered deposition of conductive traces on low-temperature substrates.","PeriodicalId":100623,"journal":{"name":"IEEE Journal on Flexible Electronics","volume":"3 5","pages":"197-204"},"PeriodicalIF":0.0,"publicationDate":"2024-03-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141965531","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Multilayered MXene-PEDOT:PSS Composite for Electromagnetic Interference Shielding 用于电磁干扰屏蔽的多层 MXene-PEDOT:PSS 复合材料
IEEE Journal on Flexible Electronics Pub Date : 2024-03-07 DOI: 10.1109/JFLEX.2024.3374690
Sanjoy Sur Roy;M. Meyyappan;P. K. Giri
{"title":"Multilayered MXene-PEDOT:PSS Composite for Electromagnetic Interference Shielding","authors":"Sanjoy Sur Roy;M. Meyyappan;P. K. Giri","doi":"10.1109/JFLEX.2024.3374690","DOIUrl":"https://doi.org/10.1109/JFLEX.2024.3374690","url":null,"abstract":"The rapid growth in communication and advanced electronics in modern society has made electromagnetic interference (EMI), resulting in EM pollution becoming a serious issue, prompting research on new materials for effective EMI shields that are a lightweight alternative to metals. Here, we present a multilayered Ti3C\u0000<inline-formula> <tex-math>$_{2} text {T}_{text {X}}$ </tex-math></inline-formula>\u0000 MXene-(poly(3,4-ethylenedioxythiophene)-polystyrene sulfonate (PEDOT:PSS) composite for EMI shielding. The multilayered accordion-like structure is blade-coated to prepare the EMI shield. Extensive material characterization confirms the high quality of the shield material. The MXene composite with 20% of MXene in conducting polymer shows 34 dB shielding performance and a green index (GI) value of ~0.5 indicating a higher absorption-based shielding compared to conventional metal shields.","PeriodicalId":100623,"journal":{"name":"IEEE Journal on Flexible Electronics","volume":"3 6","pages":"282-288"},"PeriodicalIF":0.0,"publicationDate":"2024-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142021644","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Journal on Flexible Electronics Call for Papers: Special Issue on Selected Papers from the IEEE International Conference on Flexible, Printable, Sensors and Systems (FLEPS 2024) IEEE 柔性电子学报》征稿:电气和电子工程师学会柔性、可印刷、传感器与系统国际会议 (FLEPS 2024) 论文选特刊
IEEE Journal on Flexible Electronics Pub Date : 2024-03-01 DOI: 10.1109/JFLEX.2024.3432431
{"title":"IEEE Journal on Flexible Electronics Call for Papers: Special Issue on Selected Papers from the IEEE International Conference on Flexible, Printable, Sensors and Systems (FLEPS 2024)","authors":"","doi":"10.1109/JFLEX.2024.3432431","DOIUrl":"https://doi.org/10.1109/JFLEX.2024.3432431","url":null,"abstract":"","PeriodicalId":100623,"journal":{"name":"IEEE Journal on Flexible Electronics","volume":"3 5","pages":"222-222"},"PeriodicalIF":0.0,"publicationDate":"2024-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10613872","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141965449","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Journal on Flexible Electronics Publication Information 电气和电子工程师学会柔性电子学报》出版信息
IEEE Journal on Flexible Electronics Pub Date : 2024-03-01 DOI: 10.1109/JFLEX.2024.3426025
{"title":"IEEE Journal on Flexible Electronics Publication Information","authors":"","doi":"10.1109/JFLEX.2024.3426025","DOIUrl":"https://doi.org/10.1109/JFLEX.2024.3426025","url":null,"abstract":"","PeriodicalId":100623,"journal":{"name":"IEEE Journal on Flexible Electronics","volume":"3 5","pages":"C2-C2"},"PeriodicalIF":0.0,"publicationDate":"2024-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10613871","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141965450","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Journal on Flexible Electronics Call for Papers: Cross Society Special Issue (ISCAS & IFETC) on Flexible Hybrid Electronics: Advancing Next-Generation Applications IEEE 柔性电子学报》征稿:跨学会特刊(ISCAS 和 IFETC):柔性混合电子技术:推动下一代应用
IEEE Journal on Flexible Electronics Pub Date : 2024-03-01 DOI: 10.1109/JFLEX.2024.3432406
{"title":"IEEE Journal on Flexible Electronics Call for Papers: Cross Society Special Issue (ISCAS & IFETC) on Flexible Hybrid Electronics: Advancing Next-Generation Applications","authors":"","doi":"10.1109/JFLEX.2024.3432406","DOIUrl":"https://doi.org/10.1109/JFLEX.2024.3432406","url":null,"abstract":"","PeriodicalId":100623,"journal":{"name":"IEEE Journal on Flexible Electronics","volume":"3 5","pages":"221-221"},"PeriodicalIF":0.0,"publicationDate":"2024-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10613873","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141965448","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Guest Editorial for Special Issue on Papers From 2023 IEEE International Conference on Flexible Printable Sensors and Systems (FLEPS) 2023 年电气和电子工程师学会柔性可印刷传感器与系统(FLEPS)国际会议论文特刊客座编辑
IEEE Journal on Flexible Electronics Pub Date : 2024-03-01 DOI: 10.1109/JFLEX.2024.3426128
Tse Nga Ng;Matti Mäntysalo;Shweta Agarwala;Benjamin Tee;Woo Soo Kim;Gerd Grau
{"title":"Guest Editorial for Special Issue on Papers From 2023 IEEE International Conference on Flexible Printable Sensors and Systems (FLEPS)","authors":"Tse Nga Ng;Matti Mäntysalo;Shweta Agarwala;Benjamin Tee;Woo Soo Kim;Gerd Grau","doi":"10.1109/JFLEX.2024.3426128","DOIUrl":"https://doi.org/10.1109/JFLEX.2024.3426128","url":null,"abstract":"This Special Issue of the IEEE Journal on Flexible Electronics (J-FLEX) showcases the expanded papers presented at the 2023 IEEE International Conference on Flexible Printable Sensors and Systems (FLEPS), held in Boston, MA, USA. FLEPS was organized by the IEEE Sensors Council. The advancements in flexibility and printability are reshaping the landscape of electronic device design and production, sparking great enthusiasm globally for the field of flexible and printable electronics. FLEPS served as an excellent platform for engaging in discussions about the latest advancements in the field and shaping future pathways for sensors utilizing unconventional materials and manufacturing technologies. FLEPS garnered an enthusiastic response, attracting leading experts, researchers, and innovators from both academia and industry. The technical program of FLEPS 2023 comprised over 150 presentations spanning three days. Submitted papers underwent a rigorous peer-review process. The authors whose papers were accepted were encouraged to submit extended versions for consideration, hence the creation of this special issue.","PeriodicalId":100623,"journal":{"name":"IEEE Journal on Flexible Electronics","volume":"3 5","pages":"172-172"},"PeriodicalIF":0.0,"publicationDate":"2024-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10614079","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141965533","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Multiwall Carbon Nanotube/Polydimethylsiloxane Composites-Based Dry Electrodes for Bio-Signal Detection 基于多壁碳纳米管/聚二甲基硅氧烷复合材料的生物信号检测干电极
IEEE Journal on Flexible Electronics Pub Date : 2024-02-19 DOI: 10.1109/JFLEX.2024.3367648
Puneet Sharma;Suraj Baloda;Deepak Verma;Vijay Janyani;Ritu Sharma;Navneet Gupta
{"title":"Multiwall Carbon Nanotube/Polydimethylsiloxane Composites-Based Dry Electrodes for Bio-Signal Detection","authors":"Puneet Sharma;Suraj Baloda;Deepak Verma;Vijay Janyani;Ritu Sharma;Navneet Gupta","doi":"10.1109/JFLEX.2024.3367648","DOIUrl":"https://doi.org/10.1109/JFLEX.2024.3367648","url":null,"abstract":"Continuous, stable, and long-term monitoring of bio-signals, such as electrocardiogram (ECG) and electromyography (EMG), are utmost important in healthcare sector. In this work, we developed a multiwall carbon nanotubes (MWCNTs)/polydimethylsiloxane (PDMS) composites based bio-electrodes using a simple, low-cost, and solution-process method. The fabricated MWCNTs/PDMS composites electrode exhibited comparable electrode–skin impedance to conventional silver/silver chloride (Ag/AgCl) electrodes over the frequency range of 20 Hz–1 kHz. In addition, our developed electrodes has the ability to be applied on the skin in dry form without needing an intermediate gel layer or skin preparation. The results show that the MWCNT-/PDMS-based dry electrodes were efficient to acquire a real-time ECG signals. The fabricated electrodes showed better performance compared to the commercially available Ag/AgCl electrode in ECG and EMG measurements. The obtained results shows that the proposed dry bio-electrodes has a promising application in electronic/mobile health applications and wearable health monitoring applications.","PeriodicalId":100623,"journal":{"name":"IEEE Journal on Flexible Electronics","volume":"3 3","pages":"108-114"},"PeriodicalIF":0.0,"publicationDate":"2024-02-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140135245","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Call for Papers-Special Issue on Direct IEEE IFETC Publications 论文征集--IEEE IFETC 直接出版物特刊
IEEE Journal on Flexible Electronics Pub Date : 2024-02-08 DOI: 10.1109/JFLEX.2024.3363983
{"title":"Call for Papers-Special Issue on Direct IEEE IFETC Publications","authors":"","doi":"10.1109/JFLEX.2024.3363983","DOIUrl":"https://doi.org/10.1109/JFLEX.2024.3363983","url":null,"abstract":"","PeriodicalId":100623,"journal":{"name":"IEEE Journal on Flexible Electronics","volume":"3 2","pages":"88-88"},"PeriodicalIF":0.0,"publicationDate":"2024-02-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10430072","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139710583","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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